Materials and Novel Patterning Methods for Flexible Electronics

Topological quantum devices: a review

The introduction of the concept of topology into condensed matter physics has greatly deepened our fundamental understanding of transport properties of electrons as well as all other forms of quasi particles in solid materials. It has also fostered a paradigm shift from conventional electronic/optoelectronic devices to novel quantum devices based on topology-enabled quantum device functionalities that transfer energy and information with unprecedented precision, robustness, and efficiency. In this article, the recent research progress in topological quantum devices is reviewed. We first outline the topological spintronic devices underlined by the spin-momentum locking property of topology. We then highlight the topological electronic devices based on quantized electron and dissipationless spin conductivity protected by topology. Finally, we discuss quantum optoelectronic devices with topology-redefined photoexcitation and emission. The field of topological quantum devices is only in its infancy, we envision many significant advances in the near future.

Rapid Production of Carbon Nanotube Film for Bioelectronic Applications

Flexible electronics have enormous potential for applications that are not achievable in standard electronics. In particular, important technological advances have been made in terms of their performance characteristics and potential range of applications, ranging from medical care, packaging, lighting and signage, consumer electronics, and alternative energy. In this study, we develop a novel method for fabricating flexible conductive carbon nanotube (CNT) films on various substrates. The fabricated conductive CNT films exhibited satisfactory conductivity, flexibility, and durability. The conductivity of the conductive CNT film was maintained at the same level of sheet resistance after bending cycles. The fabrication process is dry, solution-free, and convenient for mass production. Scanning electron microscopy revealed that CNTs were uniformly dispersed over the substrate. The prepared conductive CNT film was applied to collect an electrocardiogram (ECG) signal, which showed good performance compared to traditional electrodes. The conductive CNT film determined the long-term stability of the electrodes under bending or other mechanical stresses. The well-demonstrated fabrication process for flexible conductive CNT films has great potential in the field of bioelectronics.

Designing Supertough and Ultrastretchable Liquid Metal-Embedded Natural Rubber Composites for Soft-Matter Engineering

Functional elastomers with incredible toughness and stretchability are indispensable for applications in soft robotics and wearable electronics. Furthermore, coupled with excellent electrical and thermal properties, these materials are at the forefront of recent efforts toward widespread use in cutting-edge electronics and devices. Herein, we introduce a highly deformable eutectic-GaIn liquid metal alloy-embedded natural rubber (NR) architecture employing, for the first time, industrially viable solid-state mixing and vulcanization. Standard methods of rubber processing and vulcanization allow us to fragment and disperse liquid metals into submicron-sized droplets in cross-linked NR without compromising the elastic properties of the base matrix. In addition to substantial boosts in mechanical (strain at failure of up to ∼650%) and elastic (negligible hysteresis loss) performances, the tearing energy of the composite was enhanced up to 6 times, and a fourfold reduction in the crack growth rate was achieved over a control vulcanizate. Moreover, we demonstrate improved thermal conductivity and dielectric properties for the resulting composites. Therefore, this work provides a facile and scalable pathway to develop liquid metal-embedded soft elastomeric composites that could be instrumental toward potential applications in soft-matter engineering.

Flexible Electronics and Healthcare Applications

Flexible electronics has attracted tremendous attention in recent years. The essential requirements for flexible electronics include excellent electrical properties, flexibility and stretchability. By introducing special structures or using flexible materials, electronic devices can be given excellent flexibility and stretchability. In this paper we review the realization of flexible electronics from the perspective of structural design strategies and materials; then, healthcare application of flexible electronic systems was introduced. Finally, a brief summary and outlook are presented.

Twistronics in tensile strained bilayer black phosphorus

In this work, by performing state-of-the-art first-principles methods combined with molecular dynamic (MD) simulation, we theoretically investigate the electronic and mechanical behaviours of small-angle twisted bilayer black phosphorus (tbBP) under uniaxial tensile deformation. Twistronics, namely the regulation of electronic properties by Moiré physics, is demonstrated as the gene - the most crucial factor dominating not only electronic behaviour but also mechanical behaviour of tensile deformed tbBP. Compared to untwisted few-layer black phosphorus (utBP) with strong electronic sensitivity to geometric deformation, the existence of Moiré patterns in tbBP leads to spatial electronic localization, giving rise to the conservation of direct band gaps and stability of phonon limited carrier mobility under tensile deformation along the armchair direction. Moreover, during the fracture failure process, the nucleation of micro-cracks is preferentially detected at the transitional pattern boundary areas in tbBP, which could be attributed to the intra-layer maldistribution of mechanical strengths in Moiré superlattices. The explorations of twistronics in tensile strained bilayer black phosphorus contribute to the better understanding of such Moiré superlattice structures and provide insights for the design of new 2D van der Waals heterostructures in flexible nano-electronic devices.

A New Frontier of Printed Electronics: Flexible Hybrid Electronics

The performance and integration density of silicon integrated circuits (ICs) have progressed at an unprecedented pace in the past 60 years. While silicon ICs thrive at low-power high-performance computing, creating flexible and large-area electronics using silicon remains a challenge. On the other hand, flexible and printed electronics use intrinsically flexible materials and printing techniques to manufacture compliant and large-area electronics. Nonetheless, flexible electronics are not as efficient as silicon ICs for computation and signal communication. Flexible hybrid electronics (FHE) leverages the strengths of these two dissimilar technologies. It uses flexible and printed electronics where flexibility and scalability are required, i.e., for sensing and actuating, and silicon ICs for computation and communication purposes. Combining flexible electronics and silicon ICs yields a very powerful and versatile technology with a vast range of applications. Here, the fundamental building blocks of an FHE system, printed sensors and circuits, thinned silicon ICs, printed antennas, printed energy harvesting and storage modules, and printed displays, are discussed. Emerging application areas of FHE in wearable health, structural health, industrial, environmental, and agricultural sensing are reviewed. Overall, the recent progress, fabrication, application, and challenges, and an outlook, related to FHE are presented.

Ultrahigh Thermal Conductive yet Superflexible Graphene Films

Electrical devices generate heat at work. The heat should be transferred away immediately by a thermal manager to keep proper functions, especially for high-frequency apparatuses. Besides high thermal conductivity (K), the thermal manager material requires good foldability for the next generation flexible electronics. Unfortunately, metals have satisfactory ductility but inferior K (≤429 W m^-1 K^-1 ), and highly thermal-conductive nonmetallic materials are generally brittle. Therefore, fabricating a foldable macroscopic material with a prominent K is still under challenge. This study solves the problem by folding atomic thin graphene into microfolds. The debris-free giant graphene sheets endow graphene film (GF) with a high K of 1940 ± 113 W m^-1 K^-1 . Simultaneously, the microfolds render GF superflexible with a high fracture elongation up to 16%, enabling it more than 6000 cycles of ultimate folding. The large-area multifunctional GFs can be easily integrated into high-power flexible devices for highly efficient thermal management.

A transparent flexible z-axis sensitive multi-touch panel based on colloidal ITO nanocrystals

Bottom-up fabrication of a flexible multi-touch panel prototype based on transparent colloidal indium tin oxide (ITO) nanocrystal (NC) films is presented. A series of 7% Sn(4+) doped ITO NCs protected by oleate, octanoate and butanoate ligands are synthesized and characterized by a battery of techniques including, high resolution transmission electron microscopy, X-ray diffraction, (1)H, (13)C and (119)Sn nuclear magnetic resonance spectroscopy, and the related diffusion ordered spectroscopy. Electrical resistivities of transparent films of these NCs assembled on flexible polyethylene terephthalate substrates by convective self-assembly from their suspension in toluene decrease with the ligand length, from 220 × 10(3) for oleate ITO to 13 × 10(3)Ω cm for butanoate ITO NC films. A highly transparent, flexible touch panel based on a matrix of strain gauges derived from the least resistive film of 17 nm butanoate ITO NCs sensitively detects the lateral position (x, y) of the touch as well as its intensity over the z-axis. Being compatible with a stylus or bare/gloved finger, a larger version of this module may be readily implemented in upcoming flexible screens, enabling navigation capabilities over all three axes, a feature highly desired by the display industry.

Nonplanar conductive surfaces via "bottom-up" nanostructured gold coating

Development of technologies for the construction of bent, curved, and flexible conductive surfaces is among the most important albeit challenging goals in the promising field of "flexible electronics". We present a generic solution-based "bottom-up" approach for assembling conductive gold nanostructured layers on nonplanar polymer surfaces. The simple two-step experimental scheme is based upon incubation of an amine-displaying polymer [the abundantly used poly(dimethylsiloxane) (PDMS), selected here as a proof of concept] with Au(SCN)4(-), followed by a brief treatment with a conductive polymer [poly(3,4-thylenedioxythiophene)/poly(styrenesulfonate)] solution. Importantly, no reducing agent is co-added to the gold complex solution. The resultant surfaces are conductive and exhibit a unique "nanoribbon" gold morphology. The scheme yields conductive layers upon PDMS in varied configurations: planar, "wrinkled", and mechanically bent surfaces. The technology is simple, inexpensive, and easy to implement for varied polymer surfaces (and other substances), opening the way for practical applications in flexible electronics and related fields.