New detailed insights on the role of a novel praseodymium nanofilm on the polymer/steel interfacial adhesion bonds in dry and wet conditions: An integrated molecular dynamics simulation and experimental study

Carbon quantum dots (CQDs)-modified polymers: a review of non-optical applications

Carbon quantum dots (CQDs) are a promising candidate to replace metal-based additives for polymer reinforcement and functionalization. Specifically, vast interest in CQDs for polymer functionalization stems from their cost effectiveness, sustainable organic precursors, and their non-toxicity. Although several reviews of optical devices based on CQDs have been reported, this mini-review covers the non-optical aspects of CQD-polymer composites. Applications of CQD-modified polymers for smart devices, mechanical reinforcement, textile surface-modification methods, membranes, protective coatings, and thermal resistance are summarized. The synthesis method of CQDs, their dispersion in a polymer matrix and the underlying mechanisms related to the enhanced performance of composites are outlined. Unlike nano-reinforcements, CQDs are self-stabilized and offer an extremely high surface area, which significantly alters the polymer properties at a 1-2% concentration. Finally, a comparative analysis of recent advances in CQD-polymer composites, their problems, and future directions are discussed.

Molecular Dynamics Study on Mechanical Properties of Interface between Urea-Formaldehyde Resin and Calcium-Silicate-Hydrates

Microcapsule based self-healing concrete can automatically repair damage and improve the durability of concrete structures, the performance of which depends on the binding behavior between the microcapsule wall and cement matrix. However, conventional experimental methods could not provide detailed information on a microscopic level. In this paper, through molecular dynamics simulation, three composite models of Tobermorite (Tobermorite 9 Å, Tobermorite 11 Å, Tobermorite 14 Å), a mineral similar to Calcium-Silicate-Hydrate (C-S-H) gel, with the linear urea-formaldehyde (UF), the shell of the microcapsule, were established to investigate the mechanical properties and interface binding behaviour of the Tobermorite/UF composite. The results showed that the Young's modulus, shear modulus and bulk modulus of Tobermorite/UF were lower than that of 'pure' Tobermorite, whereas the tensile strength and failure strain of Tobermorite/UF were higher than that of 'pure' Tobermorite. Moreover, through radial distribution function (RDF) analysis, the connection between Tobermorite and UF found a strong interaction between Ca, N, and O, whereas Si from Tobermorite and N from UF did not contribute to the interface binding strength. Finally, high binding energy between the Tobermorite and UF was observed. The research results should provide insights into the interface behavior between the microcapsule wall and the cement matrix.

New Insight on the Interface between Polythiophene and Semiconductors via Molecular Dynamics Simulations

Polythiophene is considered as an effective dry adhesive and is promising to be a conductive adhesive due to its excellent properties. Here, we used steered molecular dynamics to investigate the interfacial strength between polythiophene and various semiconductors with similar structures including silicon, silicon carbide, and diamond. Energy decomposition was done to have a detailed insight into the adhesive mechanism. Particularly, we laid stress on the entropy difference of the polythiophene chain in different systems. Van der Waals interaction and electrostatic interaction both positively contributed to the adhesion between polythiophene and semiconductors, while the entropy change of polythiophene, including vibrational entropy change and conformational entropy change, weakened the adhesion to some extent. Our results indicated that the combined effect of these three factors made the adhesion between polythiophene and silicon carbide the strongest among the systems we studied. Additionally, it was found that such adhesion was scarcely influenced by temperature. This simple polythiophene-semiconductor interfacial study can help optimize the choice of the semiconductor when applying the polythiophene adhesive.

Adhesion of Epoxy Resin with Hexagonal Boron Nitride and Graphite

Adhesion interaction of epoxy resin with the basal surfaces of h-BN and graphite is investigated with the first-principles density functional theory calculations in conjunction with the dispersion correction. The h-BN/epoxy and graphite/epoxy interfaces play an important role in producing nanocomposite materials with excellent thermal dissipation properties. The epoxy resin structure is simulated by using four kinds of fragmentary models. Their structures are optimized on the h-BN and graphite surfaces after an annealing simulation. The distance between the epoxy fragment and the surface is about 3 Å. At the interface between h-BN and epoxy resin, no H-bonding formation is observed, though one could expect that the active functional groups of epoxy resin, such as hydroxyl (-OH) group, would be involved in a hydrogen-bonding interaction with nitrogen atoms of the h-BN surface. The adhesion energies for the two interfaces are calculated, showing that these two interfaces are characterized by almost the same strength of adhesion interaction. To obtain the adhesion force-separation curve for the two interfaces, the potential energy surface associated with the detachment of the epoxy fragment from the surface is calculated with the help of the nudged elastic band method and then the adhesion force is obtained by using either the Morse-potential approximation or the Hellmann-Feynman force calculation. The results from both methods agree with each other. The maximum adhesion force for the h-BN/epoxy interface is as high as that for the graphite/epoxy interface. To better understand this result, a force-decomposition analysis is carried out, and it has been disclosed that the adhesion forces working at both interfaces mainly come from the dispersion force. The trend of increase in the C 6 parameters used for the dispersion correction for the atoms included in the h-BN or graphite surface is in the order: N < C < B, which reasonably explains why the strengths of the dispersion forces operating at the two interfaces are similar. Also, the electron localization function analysis can explain why the h-BN surface cannot form an H bond with the hydroxyl group in epoxy resin.