Adhesion Evolution: Designing Smart Polymeric Adhesive Systems with On-Demand Reversible Switchability

Smart polymeric switchable adhesives represent a rapidly emerging class of advanced materials, exhibiting the ability to undergo on-demand transitioning between "On" and "Off" adhesion states. By selectively tuning external stimuli triggers (including temperature, light, electricity, magnetism, and chemical agents), we can engineer these materials to undergo reversible changes in their bonding capabilities. The strategic design selection of stimuli is a pivotal factor in the design of switchable adhesive systems. This review outlines recent advancements in the field of smart switchable polymeric adhesives over the past decade with a focus on the selection of stimulus triggers. These systems are further categorized into one of four adhesion switching mechanisms upon initiation by a specific stimuli-trigger: (i) interfacial adhesion, (ii) stiffness, (iii) contact area, or (iv) suction-based switching. Evaluation of adhesion switching performance across systems is primarily made based on three key metrics: (i) maximum adhesion strength, (ii) switch ratio, and (iii) switch time. Different stimuli and mechanisms offer distinct advantages and limitations, influencing the performance characteristics and applicability of these materials across domains such as detachable biomedical devices, robotic grippers, and climbing robots. This review thus offers a perspective on the present advancements and challenges in this emerging field, along with insights into future directions.

Synthesis of Novel (Meth)acrylates with Variable Hydrogen Bond Interaction and Their Application in a Clear Viscoelastic Film

Clear viscoelastic films (CVFs) have many applications in the display industry. Acrylic monomers containing a hydrogen bond (H-monomer) are often used in the preparation of CVF to increase the cohesion and form favorable interactions with the display substrate. Common H-monomers face a counterbalance between the glass transition temperature (Tg) and the hydrogen-bonding association constant (Ka). Strong hydrogen bonding often leads to a high Tg and high modulus, which are unfavorable in certain applications such as foldable display. To solve these problems, four types of hydrogen-bonding (meth)acrylic monomers (carbamate acrylate, carbamate methacrylate, urea acrylate, and urea methacrylate) with different Ka and Tg were readily synthesized. Among them, urea acrylates displayed the highest Ka while still maintaining moderate Tg. These H-monomers were copolymerized with 2-ethylhexyl acrylate (EHA) and cross-linked to obtain a series of copolymers (H-copolymers) as pressure-sensitive adhesives. After the characterization of rheology, optics, and peel adhesion, urea-acrylic H-copolymers showed the best overall performance by combining great optical property (>98% in transmittance, < 1% in haze) and mechanical performance (8-12 N/25 mm in peel adhesion, 84-92% in creep recovery). This work provides a new path to prepare acrylic CVF for flexible display application.

Reversible fluorescent adhesives based on covalent adaptable networks with dynamic AIE crosslinking: in situ visualization of adhesion capability

A new family of reversible fluorescent adhesives based on Diels-Alder covalent adaptable networks with dynamic AIE crosslinks was developed. The accurate intrinsic correlation between the emission behavior, cross-linking state, and adhesion capability can be established, enabling the in situ visualization of adhesion capacity.

Stimuli-responsive temporary adhesives: enabling debonding on demand through strategic molecular design

Stimuli-responsive temporary adhesives constitute a rapidly developing class of materials defined by the modulation of adhesion upon exposure to an external stimulus or stimuli. Engineering these materials to shift between two characteristic properties, strong adhesion and facile debonding, can be achieved through design strategies that target molecular functionalities. This perspective reviews the recent design and development of these materials, with a focus on the different stimuli that may initiate debonding. These stimuli include UV light, thermal energy, chemical triggers, and other potential triggers, such as mechanical force, sublimation, electromagnetism. The conclusion discusses the fundamental value of systematic investigations of the structure-property relationships within these materials and opportunities for unlocking novel functionalities in future versions of adhesives.