1
|
Song S, Cho SM. Transparent Metal-Mesh heater using Silver-coated copper nanoparticles sintered with intense pulsed light irradiation on PET substrate. KOREAN J CHEM ENG 2021. [DOI: 10.1007/s11814-021-0811-7] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/28/2022]
|
2
|
Li Z, Chang S, Khuje S, Ren S. Recent Advancement of Emerging Nano Copper-Based Printable Flexible Hybrid Electronics. ACS NANO 2021; 15:6211-6232. [PMID: 33834763 DOI: 10.1021/acsnano.1c02209] [Citation(s) in RCA: 20] [Impact Index Per Article: 6.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/12/2023]
Abstract
Printed copper materials have been attracting significant attention prominently due to their electric, mechanical, and thermal properties. The emerging copper-based flexible electronics and energy-critical applications rely on the control of electric conductivity, current-carrying capacity, and reliability of copper nanostructures and their printable ink materials. In this review, we describe the growth of copper nanostructures as the building blocks for printable ink materials on which a variety of conductive features can be additively manufactured to achieve high electric conductivity and stability. Accordingly, the copper-based flexible hybrid electronics and energy-critical devices printed by different printing techniques are reviewed for emerging applications.
Collapse
Affiliation(s)
- Zheng Li
- Department of Mechanical and Aerospace Engineering, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States
- College of Material Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, Jiangsu 210016, China
| | - Shuquan Chang
- College of Material Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, Jiangsu 210016, China
| | - Saurabh Khuje
- Department of Mechanical and Aerospace Engineering, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States
| | - Shenqiang Ren
- Department of Mechanical and Aerospace Engineering, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States
- Department of Chemistry, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States
- Research and Education in Energy Environment & Water Institute, University at Buffalo, The State University of New York, Buffalo, New York 14260, United States
| |
Collapse
|
3
|
Xiao P, Zhou Y, Gan L, Pan Z, Chen J, Luo D, Yao R, Chen J, Liang H, Ning H. Study of Inkjet-Printed Silver Films Based on Nanoparticles and Metal-Organic Decomposition Inks with Different Curing Methods. MICROMACHINES 2020; 11:mi11070677. [PMID: 32664692 PMCID: PMC7407937 DOI: 10.3390/mi11070677] [Citation(s) in RCA: 4] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 06/23/2020] [Revised: 07/11/2020] [Accepted: 07/11/2020] [Indexed: 12/04/2022]
Abstract
Currently, inkjet printing conductive films have attracted more and more attention in the field of electronic device. Here, the inkjet-printed silver thin films based on nanoparticles (NP) ink and metal-organic decomposition (MOD) ink were cured by the UV curing method and heat curing method. We not only compared the electrical resistivity and adhesion strength of two types of silver films, but also studied the effect of different curing methods on silver films. The silver films based on NP ink had good adhesion strength with a lowest electrical resistivity of 3.7 × 10−8 Ω·m. However, the silver film based on MOD ink had terrible adhesion strength with a lowest electrical resistivity of 2 × 10−8 Ω·m. Furthermore, we found a simple way to improve the terrible adhesion strength of silver films based on MOD ink and tried to figure out the mechanisms. This work offers a further understanding of the different performances of two types of silver films with different curing methods.
Collapse
Affiliation(s)
- Peng Xiao
- School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528000, China; (P.X.); (J.C.)
- Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China; (Y.Z.); (J.C.); (H.L.); (H.N.)
| | - Yicong Zhou
- Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China; (Y.Z.); (J.C.); (H.L.); (H.N.)
| | - Liao Gan
- Air Force Representative Office in Zunyi District, Zunyi 563000, China;
| | - Zhipeng Pan
- Guizhou Meiling Power Supply Co., Ltd., Zunyi 563000, China;
| | - Jianwen Chen
- School of Physics and Optoelectronic Engineering, Foshan University, Foshan 528000, China; (P.X.); (J.C.)
| | - Dongxiang Luo
- School of Materials and Energy, Guangdong University of Technology, Guangzhou 510006, China
- Correspondence: (D.L.); (R.Y.)
| | - Rihui Yao
- Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China; (Y.Z.); (J.C.); (H.L.); (H.N.)
- Guangdong Province Key Lab of Display Material and Technology, Sun Yat-sen University, Guangzhou 510275, China
- Correspondence: (D.L.); (R.Y.)
| | - Jianqiu Chen
- Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China; (Y.Z.); (J.C.); (H.L.); (H.N.)
| | - Hongfu Liang
- Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China; (Y.Z.); (J.C.); (H.L.); (H.N.)
| | - Honglong Ning
- Institute of Polymer Optoelectronic Materials and Devices, State Key Laboratory of Luminescent Materials and Devices, South China University of Technology, Guangzhou 510640, China; (Y.Z.); (J.C.); (H.L.); (H.N.)
| |
Collapse
|
4
|
Kamarudin SF, Mustapha M, Kim JK. Green Strategies to Printed Sensors for Healthcare Applications. POLYM REV 2020. [DOI: 10.1080/15583724.2020.1729180] [Citation(s) in RCA: 9] [Impact Index Per Article: 2.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 02/07/2023]
Affiliation(s)
- Siti Fatimah Kamarudin
- School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Penang, Malaysia
| | - Mariatti Mustapha
- School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Penang, Malaysia
| | - Jang-Kyo Kim
- Department of Mechanical and Aerospace Engineering, The Hong Kong University of Science and Technology, Kowloon, Hong Kong
| |
Collapse
|
5
|
Efficiency enhancement of quantum-dot light-emitting diodes via rapid post-treatment of intense pulsed light sintering technique. Chem Phys Lett 2020. [DOI: 10.1016/j.cplett.2019.137048] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/20/2022]
|
6
|
Deore B, Paquet C, Kell AJ, Lacelle T, Liu X, Mozenson O, Lopinski G, Brzezina G, Guo C, Lafrenière S, Malenfant PRL. Formulation of Screen-Printable Cu Molecular Ink for Conductive/Flexible/Solderable Cu Traces. ACS APPLIED MATERIALS & INTERFACES 2019; 11:38880-38894. [PMID: 31550883 DOI: 10.1021/acsami.9b08854] [Citation(s) in RCA: 5] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/10/2023]
Abstract
Screen printing is the most common method used for the production of printed electronics. Formulating copper (Cu) inks that yield conductive fine features with oxidation and mechanical robustness on low-temperature substrates will open up opportunities to fabricate cost-effective devices. We have formulated a screen-printable Cu metal-organic decomposition (MOD) ink comprising Cu formate coordinated to 3-(diethylamino)-1,2-propanediol, a fractional amount of Cu nanoparticles (CuNPs), and a binder. This simple formulation enables ∼70-550 μm trace widths with excellent electrical [∼8-15 mΩ/□/mil or 20-38 μΩ·cm] and mechanical properties with submicron-thick traces obtained by intense pulse light (IPL) sintering on Kapton and poly(ethylene terephthalate) (PET) substrates. These traces are mechanically robust to flexing and creasing where less than 10% change in resistance is observed on Kapton and ∼20% change is observed on PET. Solderable Cu traces were obtained only with the combination of the Cu MOD precursor, CuNP, and polymer binder. Both thermally and IPL sintered traces showed shelf stability (<10% change in resistance) of over a month in ambient conditions and 10-70% relative humidity, suitable for day-to-day fabrication. To demonstrate utility, light-emitting diodes (LEDs) were directly soldered to IPL sintered Cu traces in a reflow oven without the need for a precious metal interlayer. The LEDs were functional not only during bending and creasing of the Cu traces but even after 180 min at 140 °C in ambient air without losing illumination intensity. High definition television antennas printed on Kapton and PET were found to perform well in the ultrahigh frequency region. Lastly, single-walled carbon nanotube-based thin-film transistors on a silicon wafer were fabricated with a screen-printed Cu source and drain electrodes, which performed comparably to silver electrodes with mobility values of 12-15 cm2 V-1 s-1 and current on/off ratios of ∼105 and as effective ammonia sensors providing parts per billion-level detection.
Collapse
Affiliation(s)
| | | | | | | | | | | | | | - Greg Brzezina
- Radio Frequency Qualification Facilities David Florida Laboratory , Canadian Space Agency/Government of Canada , Ottawa , Ontario K2H 8S2 , Canada
| | | | - Sylvie Lafrenière
- E2IP , 750 Boulevard Marcel-Laurin , Saint-Laurent , Quebec H4M 2M4 , Canada
| | | |
Collapse
|
7
|
Copper conductive patterns through spray-pyrolysis of copper-diethanolamine complex solution. PLoS One 2018; 13:e0200084. [PMID: 29969478 PMCID: PMC6029799 DOI: 10.1371/journal.pone.0200084] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 11/27/2017] [Accepted: 06/19/2018] [Indexed: 11/25/2022] Open
Abstract
A simple and low-cost method to fabricate copper conductive patterns at low temperature is critical for printed electronics. Low-temperature spray-pyrolysis of copper-alkanolamine complex solution shows high potential for this application. However, the produced copper patterns exhibit a granular structure consisting of connected fine copper particles. In this work, low-temperature spray-pyrolysis of copper formate-diethanolamine complex solution under N2 flow at a temperature of 200 °C was investigated. The effects of spraying conditions on microstructure and electrical properties of the patterns were examined. Our results revealed that the spraying rate is a critical parameter determining the degree of sintering and electrical resistivity of the patterns. A low spraying rate facilitates sintering, and hence well-sintered copper patterns with the lowest resistivity of 6.12 μΩ.cm (3.6 times of bulk copper) on a polyimide substrate could be fabricated.
Collapse
|
8
|
Chen X, Wu X, Shao S, Zhuang J, Xie L, Nie S, Su W, Chen Z, Cui Z. Hybrid Printing Metal-mesh Transparent Conductive Films with Lower Energy Photonically Sintered Copper/tin Ink. Sci Rep 2017; 7:13239. [PMID: 29038555 PMCID: PMC5643557 DOI: 10.1038/s41598-017-13617-4] [Citation(s) in RCA: 23] [Impact Index Per Article: 3.3] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 08/04/2017] [Accepted: 09/25/2017] [Indexed: 11/09/2022] Open
Abstract
With the help of photonic sintering using intensive pulse light (IPL), copper has started to replace silver as a printable conductive material for printing electrodes in electronic circuits. However, to sinter copper ink, high energy IPL has to be used, which often causes electrode destruction, due to unreleased stress concentration and massive heat generated. In this study, a Cu/Sn hybrid ink has been developed by mixing Cu and Sn particles. The hybrid ink requires lower sintering energy than normal copper ink and has been successfully employed in a hybrid printing process to make metal-mesh transparent conductive films (TCFs). The sintering energy of Cu/Sn hybrid films with the mass ratio of 2:1 and 1:1 (Cu:Sn) were decreased by 21% compared to sintering pure Cu film, which is attributed to the lower melting point of Sn for hybrid ink. Detailed study showed that the Sn particles were effectively fused among Cu particles and formed conducting path between them. The hybrid printed Cu/Sn metal-mesh TCF with line width of 3.5 μm, high transmittance of 84% and low sheet resistance of 14 Ω/□ have been achieved with less defects and better quality than printed pure copper metal-mesh TCFs.
Collapse
Affiliation(s)
- Xiaolian Chen
- School of Nano-Tech and Nano-Bionics, University of Science and Technology of China, Hefei, 230026, People's Republic of China.,Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China
| | - Xinzhou Wu
- Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China
| | - Shuangshuang Shao
- Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China
| | - Jinyong Zhuang
- Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China
| | - Liming Xie
- Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China
| | - Shuhong Nie
- Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China
| | - Wenming Su
- Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China.
| | - Zheng Chen
- Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China.
| | - Zheng Cui
- Printable Electronics Research Centre, Suzhou Institute of Nano-Tech and Nano-Bionics, Chinese Academy of Sciences, Suzhou, 215123, People's Republic of China
| |
Collapse
|