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Zhang Y, Xu S, Cui EN, Yu L, Wang Z. Research and Application Progress of Laser-Processing Technology in Diamond Micro-Fabrication. MICROMACHINES 2024; 15:547. [PMID: 38675358 PMCID: PMC11052283 DOI: 10.3390/mi15040547] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Received: 03/24/2024] [Revised: 04/15/2024] [Accepted: 04/15/2024] [Indexed: 04/28/2024]
Abstract
Laser-processing technology has been widely used in the ultra-precision machining of diamond materials. It has the advantages of high precision and high efficiency, especially in the field of super-hard materials and high-precision parts manufacturing. This paper explains the fundamental principles of diamond laser processing, introduces the interaction mechanisms between various types of lasers and diamond materials, focuses on analyzing the current development status of various modes of laser processing of diamond, briefly discusses the relevant applications in diamond cutting, micro-hole forming, and micro-groove machining, etc., and finally discusses the issues, challenges, and potential future advancements of laser technology in the field of diamond processing at this point.
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Affiliation(s)
| | - Shuai Xu
- College of Intelligent System Science and Engineering, Shenyang University, Shenyang 110044, China; (Y.Z.); (L.Y.)
| | - E-Nuo Cui
- College of Intelligent System Science and Engineering, Shenyang University, Shenyang 110044, China; (Y.Z.); (L.Y.)
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Wu P, Cao X, Chu W, Chen Z, Yuan H, Wang R, Yao S, Juodkazis S, Zhang W. Fresnel zone plate sculptured out of diamond by femtosecond laser for harsh environments. OPTICS LETTERS 2023; 48:1379-1382. [PMID: 36946932 DOI: 10.1364/ol.482327] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/29/2022] [Accepted: 02/03/2023] [Indexed: 06/18/2023]
Abstract
With the rapid development of micro-optical applications, there is an increasing demand for micro-optical elements that can be made with minimal processing steps. Current research focuses on practical functionalities of optical performance, lightweight, miniaturization, and easy integration. As an important planar diffractive optical element, the Fresnel zone plate (FZP) provides a compact solution for focusing and imaging. However, the fabrication of FZPs with high quality out of hard and brittle materials remains challenging. Here, we report on the fabrication of diamond FZP by femtosecond laser direct writing. FZPs with the same outer diameter and different focal lengths of 250-1000 µm were made via ablation. The fabricated FZPs possess well-defined geometry and excellent focusing and imaging ability in the visible spectral range. Arrays of FZPs with different focal lengths were made for potential applications in imaging, sensing, and integrated optical systems.
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Xie X, Li Y, Wang G, Bai Z, Yu Y, Wang Y, Ding Y, Lu Z. Femtosecond Laser Processing Technology for Anti-Reflection Surfaces of Hard Materials. MICROMACHINES 2022; 13:mi13071084. [PMID: 35888901 PMCID: PMC9322106 DOI: 10.3390/mi13071084] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 06/18/2022] [Revised: 07/05/2022] [Accepted: 07/06/2022] [Indexed: 01/25/2023]
Abstract
The anti-reflection properties of hard material surfaces are of great significance in the fields of infrared imaging, optoelectronic devices, and aerospace. Femtosecond laser processing has drawn a lot of attentions in the field of optics as an innovative, efficient, and green micro-nano processing method. The anti-reflection surface prepared on hard materials by femtosecond laser processing technology has good anti-reflection properties under a broad spectrum with all angles, effectively suppresses reflection, and improves light transmittance/absorption. In this review, the recent advances on femtosecond laser processing of anti-reflection surfaces on hard materials are summarized. The principle of anti-reflection structure and the selection of anti-reflection materials in different applications are elaborated upon. Finally, the limitations and challenges of the current anti-reflection surface are discussed, and the future development trend of the anti-reflection surface are prospected.
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Affiliation(s)
- Xiaofan Xie
- Center for Advanced Laser Technology, Hebei University of Technology, Tianjin 300401, China; (X.X.); (Z.B.); (Y.Y.); (Y.W.); (Z.L.)
- Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China
| | - Yunfei Li
- Center for Advanced Laser Technology, Hebei University of Technology, Tianjin 300401, China; (X.X.); (Z.B.); (Y.Y.); (Y.W.); (Z.L.)
- Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China
- Tianjin Key Laboratory of Electronic Materials and Devices, Tianjin 300401, China
- National Demonstration Center for Experimental (Electronic and Communication Engineering) Education, Hebei University of Technology, Tianjin 300401, China
- Correspondence: (Y.L.); (G.W.); (Y.D.)
| | - Gong Wang
- Center for Advanced Laser Technology, Hebei University of Technology, Tianjin 300401, China; (X.X.); (Z.B.); (Y.Y.); (Y.W.); (Z.L.)
- Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China
- Tianjin Key Laboratory of Electronic Materials and Devices, Tianjin 300401, China
- National Demonstration Center for Experimental (Electronic and Communication Engineering) Education, Hebei University of Technology, Tianjin 300401, China
- Correspondence: (Y.L.); (G.W.); (Y.D.)
| | - Zhenxu Bai
- Center for Advanced Laser Technology, Hebei University of Technology, Tianjin 300401, China; (X.X.); (Z.B.); (Y.Y.); (Y.W.); (Z.L.)
- Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China
- Tianjin Key Laboratory of Electronic Materials and Devices, Tianjin 300401, China
- National Demonstration Center for Experimental (Electronic and Communication Engineering) Education, Hebei University of Technology, Tianjin 300401, China
| | - Yu Yu
- Center for Advanced Laser Technology, Hebei University of Technology, Tianjin 300401, China; (X.X.); (Z.B.); (Y.Y.); (Y.W.); (Z.L.)
- Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China
- Tianjin Key Laboratory of Electronic Materials and Devices, Tianjin 300401, China
- National Demonstration Center for Experimental (Electronic and Communication Engineering) Education, Hebei University of Technology, Tianjin 300401, China
| | - Yulei Wang
- Center for Advanced Laser Technology, Hebei University of Technology, Tianjin 300401, China; (X.X.); (Z.B.); (Y.Y.); (Y.W.); (Z.L.)
- Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China
- Tianjin Key Laboratory of Electronic Materials and Devices, Tianjin 300401, China
- National Demonstration Center for Experimental (Electronic and Communication Engineering) Education, Hebei University of Technology, Tianjin 300401, China
| | - Yu Ding
- Science and Technology on Electro-Optical Information Security Control Laboratory, Tianjin 300308, China
- Correspondence: (Y.L.); (G.W.); (Y.D.)
| | - Zhiwei Lu
- Center for Advanced Laser Technology, Hebei University of Technology, Tianjin 300401, China; (X.X.); (Z.B.); (Y.Y.); (Y.W.); (Z.L.)
- Hebei Key Laboratory of Advanced Laser Technology and Equipment, Tianjin 300401, China
- Tianjin Key Laboratory of Electronic Materials and Devices, Tianjin 300401, China
- National Demonstration Center for Experimental (Electronic and Communication Engineering) Education, Hebei University of Technology, Tianjin 300401, China
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