Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications

Bayesian Optimization of Low-Temperature Nonthermal Plasma Jet Sintering of Nanoinks

In response to the escalating demand for flexible devices in applications such as wearables, sensors, and touch panels, there is a need for innovative fabrication approaches for devices made from nanomaterial-based inks. Subsequent to ink deposition, a pivotal stage in device manufacturing typically involves high-temperature sintering, posing challenges for heat-sensitive substrates. Nonthermal plasma jet sintering utilizing an atmospheric pressure dielectric barrier discharge (DBD) plasma jet enables sintering at room temperature and standard pressure, facilitating the sintering of printed nanoparticle films without compromising substrate or film surface integrity. However, determining optimal plasma jet sintering conditions can be challenging due to multiple processing variables with intricate interrelationships. This work employed Bayesian optimization (BO) and machine learning (ML) to identify optimal values for seven primary plasma jet sintering variables. Optimization yielded a 99.2% increase in the measured electrical conductivity for plasma jet-sintered indium tin oxide (ITO) films after five rounds of experiments. Moreover, the optimal sintering conditions achieved an electrical conductivity that was 81.4% of conventional furnace sintering at 300 °C, but was three times faster and with a peak substrate temperature below 47 °C. This result demonstrates the prospect of applying BO to optimize processing techniques for emerging low-temperature requirements.

Fabrication and Characterization of Biomedical Ti-Mg Composites via Spark Plasma Sintering

The fabrication of Ti-Mg composite biomaterials was investigated using spark plasma sintering (SPS) with varying Mg contents and sintering pressures. The effects of powder mixing, Mg addition, and sintering pressure on the microstructure and mechanical properties of the composite materials were systematically analyzed. Uniform dispersion of Mg within the Ti matrix was achieved, confirming the efficacy of ethanol-assisted ball milling for consistent mixing. The Young's modulus of the composite materials exhibited a linear decrease with increasing Mg content, with Ti-30vol%Mg and Ti-50vol%Mg demonstrating reduced modulus values compared to pure Ti. Based on density measurements, compression tests, and Young's modulus results, it was determined that the sinterability of Ti-30vol%Mg saturates at a sintering pressure of approximately 50 MPa. Moreover, our immersion tests in physiological saline underscore the profound significance of our findings. Ti-30vol%Mg maintained compressive strength above that of cortical bone for 6-to-10 days, with mechanical integrity improving under higher sintering pressures. These findings mark a significant leap towards the development of Ti-Mg composite biomaterials with tailored mechanical properties, thereby enhancing biocompatibility and osseointegration for a wide range of biomedical applications.

Low-Temperature Sintering of Ag Composite Pastes with Different Metal Organic Decomposition Additions

Rapid developments in wide-bandgap semiconductors have led to the demand for interconnection materials that can withstand harsh conditions. In this study, novel Ag composite pastes were developed with the assistance of metal organic decomposition (MOD) to significantly reduce the sintering temperature of commercial Ag pastes. The effects of the decomposition characteristics of different MODs on the microstructure, morphology, and the shear strength of the Ag-sintered joints were systematically investigated. Additionally, the low-temperature sintering mechanisms of the MOD-assisted Ag composite pastes were studied and proposed. Among all the MODs studied, the one consisting of propylamine complexed with silver oxalate demonstrated the best performance due to its ability to form Ag nanoclusters with the smallest size (~25 nm) and highest purity (~99.07 wt.%). Notably, the bonding temperature of the MOD-modified Ag pastes decreased from 250 °C to 175 °C, while the shear strength increased from 20 MPa to 40.6 MPa when compared to the commercial Ag pastes.

Critical Salt Loading in Flexible Poly(vinyl alcohol) Sensors Fabricated by an Inkjet Printing and Plasma Reduction Method

We report a low-temperature inkjet printing and plasma treatment method using silver nitrate ink that allows the fabrication of conductive silver traces on poly(vinyl alcohol) (PVA) film with good fidelity and without degrading the polymer substrate. In doing so, we also identify a critical salt loading in the film that is necessary to prevent the polymer from reacting with the silver nitrate-based ink, which improves the resolution of the silver trace while simultaneously lowering its sheet resistance. Silver lines printed on PVA film using this method have sheet resistances of around 0.2 Ω/□ under wet/dry and stretched/unstretched conditions, while PVA films without prior treatment double in sheet resistance upon wetting or stretching the substrate. This low resistance of printed lines on salt-treated films can be preserved under multiple bending cycles of 0-90° and stretching cycles of 0-6% strain if the polymer is prestretched prior to inkjet printing.

Molecular Dynamics Simulation of Sintering Densification of Multi-Scale Silver Layer

Based on molecular dynamics (MD), in this study, a model was established to simulate the initial coating morphology of silver paste by using a random algorithm, and the effects of different sizes of particles on sintering porosity were also analyzed. The MD result reveals that compared with the sintering process using large-scale silver particles, the sintering process using multi-scale silver particles would enhance the densification under the same sintering conditions, which authenticates the feasibility of adding small silver particles to large-scale silver particles in theory. In addition, to further verify the feasibility of the multi-scale sintering, a semi in-situ observation was prepared for a sintering experiment using micro-nano multi-scale silver paste. The feasibility of multi-scale silver sintering is proved by theoretical and experimental means, which can provide a meaningful reference for optimizing the sintering process and the preparation of silver paste for die-attach in powering electronics industry. In addition, it is hoped that better progress can be made on this basis in the future.

Atmospheric Pressure and Ambient Temperature Plasma Jet Sintering of Aerosol Jet Printed Silver Nanoparticles

Atmospheric pressure nonthermal plasmas hold great promise for applications in environmental control, energy conversion, and material processing. Even at room temperature, nonthermal plasmas produce energetic and reactive species that can initiate surface modifications at a plasma-surface interface, including thin-film nanoparticle assemblies, in a nondestructive and effective way. Here, we present the plasma-activated sintering of aerosol jet printed silver thin films on substrates ranging from glass to delicate materials including blotting paper, fruits, and flexible plastic. We characterize the microstructural evolutions and electrical properties of printed films along with the electrical, thermal, and optical properties of an argon plasma jet. We demonstrate an electrical conductivity as high as 1.4 × 10⁶ S/m for printed films sintered under atmospheric conditions in which the surface temperature stays below 50 °C. These results highlight a future direction where additive manufacturing of electronic devices can be achieved on flexible and low-melting-point materials under ambient conditions without requiring additional thermal processing by utilizing nonthermal plasmas.

A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging

Metal nanoparticles (NPs) have attracted growing attention in recent years for electronic packaging applications. Ag NPs have emerged as a promising low-temperature bonding material owing to their unique characteristics. In this study, we mainly review our research progress on the interconnection of using polyol-based Ag NPs for electronic packaging. The synthesis, sintering-bonding process, bonding mechanism, and high-temperature joint properties of Ag NP pastes are investigated. The paste containing a high concentration of Ag NPs was prepared based on the polyol method and concentration. A nanoscale layer of organic components coated on the NPs prevents the coalescence of Ag NPs. The effects of organic components on the bondability of the Ag NP paste were studied. Compared to the aqueous-based Ag NP paste, the polyol-based Ag NP with the reduction of organic component can improve the bondability, and the coffee ring effect was successfully depressed due to the increased Marangoni flow. The sintering behaviors of Ag NPs during the bonding process were investigated using the classical sphere-to-sphere approach. The mechanical property of joints using this Ag paste was better than that using Pb₉₅Sn₅ solders after storage at high temperatures. The sintering–bonding technology using polyol-based Ag NPs was helpful to the low-temperature interconnection for electronic packaging applications.

Light-Induced Coalescence of Plasmonic Dimers and Clusters

The properties of nanoplasmonic structures depend strongly on their geometry, creating the need for high-precision control and characterization. Here, by exploiting the low activation energy of gold atoms on nanoparticle surfaces, we show how laser irradiation reshapes nanoparticle dimers. Time-course dark-field microspectroscopy allows this process to be studied in detail for individual nanostructures. Three regimes are identified: facet growth, formation of a conductive bridge between particles, and bridge growth. Electromagnetic simulations confirm the growth dynamics and allow measurement of bridge diameter, found to be highly reproducible and also self-limiting. Correlations in spectral resonances for the initial and final states give insight into the energy barriers for bridge growth. Dark-field microscopy shows that coalescence of multiple gaps in nanoparticle clusters can be digitally triggered, with each gap closing after discrete increases in irradiation power. Such control is important for light-induced nanowire formation or trimming of electronic and optoelectronic devices.

Microstructure and Properties of Porous Titanium Prepared by Spark Plasma Sintering

Porous titanium samples with a porosity of 1.34~15.54% were prepared by a spark plasma sintering (SPS) process at sintering temperatures of 800 °C, 850 °C and 900 °C, and a sintering pressure of 10 MPa. The microstructures and fracture morphology of the samples were investigated by scanning electron microscopy (SEM) and X-ray diffraction (XRD) analyses. The compressive strength and elastic modulus were likewise measured. The results showed that no new phase occurred after the samples were sintered, and the main phases were α phase of hcp structure. The porosity of the samples decreased significantly with the increase of sintering temperature. At 800 °C, the sample phase was dominated by equiaxed α. There were more irregular coarse pores in the samples. At 850 °C, the microstructure was mainly zigzag α, and the pores were finely and relatively uniform in distribution. At 900 °C, the sample’s structure transformed into a dense sheet-like α. The sample’s densities increased and the pores disappeared. The room temperature compression test showed that the porous titanium sintered by SPS had excellent compressive strength. The yield strength, compressive strength, compressive strain and elastic modulus were 81.85~122.36 MPa, 161.65~498.86 MPa, 36.75~59.97% and 2.79~4.22 GPa, respectively.

Editorial for the Special Issue on Interface Circuits for Microsensor Integrated Systems

Recent advances in sensing technologies, especially those for Microsensor Integrated Systems, have led to several new commercial applications. [...].