Preparation and Properties of Inherently Black Polyimide Films with Extremely Low Coefficients of Thermal Expansion and Potential Applications for Black Flexible Copper Clad Laminates

Flame-Retardant GF-PSB/DOPO-POSS Composite with Low Dk/Df and High Thermal Stability for High-Frequency Copper Clad Applications

In the field of high-frequency communications devices, there is an urgent need to develop high-performance copper clad laminates (CCLs) with low dielectric loss (Df) plus good flame retardancy and thermal stability. The hydrocarbon resin styrene-butadiene block copolymer (PSB) was modified with the flame-retardant 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide/polyhedral oligomeric silsesquioxanes (DOPO-POSS) to meet the demands of high-frequency and high-speed applications. The resulting DOPO-POSS-modified PSB was used as the resin matrix along with other additives to fabricate PSB/DOPO-POSS laminates. At a high-frequency of 10 GHz, the laminates containing 20 wt.% of DOPO-POSS and with a thickness of 0.09 mm exhibited a Df of 0.00328, which is much lower compared with the commercial PSB/PX-200 composite (Df: 0.00498) and the PSB without flame retardancy (Df: 0.00453). Afterwards, glass fiber cloth (GF) was used as a reinforcing material to manufacture GF-PSB/DOPO-POSS composite laminates with a thickness of 0.25 mm. The flame retardancy of GF-PSB/DOPO-POSS composite laminate reached vertical burning (UL-94) V-1 grade, and GF-PSB/DOPO-POSS exhibited higher thermal and dynamic mechanical properties than GF-PSB/PX-200. The results of a limited oxygen index (LOI) and self-extinguishing time tests also demonstrated the superior flame-retardant performance of DOPO-POSS compared with PX-200. The investigation indicates that GF-PSB/DOPO-POSS composite laminates have significant potential for use in fabricating a printed circuit board (PCB) for high-frequency and high-speed applications.

Research Progress and Application of Polyimide-Based Nanocomposites

Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal, mechanical, chemical stability and dielectric performance. Further improving the versatility of PIs is of great significance, broadening their application prospects. Thus, integrating functional nanofillers can finely tune the individual characteristic to a certain extent as required by the function. Integrating the two complementary benefits, PI-based composites strongly expand applications, such as aerospace, microelectronic devices, separation membranes, catalysis, and sensors. Here, from the perspective of system science, the recent studies of PI-based composites for molecular design, manufacturing process, combination methods, and the relevant applications are reviewed, more relevantly on the mechanism underlying the phenomena. Additionally, a systematic summary of the current challenges and further directions for PI nanocomposites is presented. Hence, the review will pave the way for future studies.

Preparation and Properties of Intrinsically Black Polyimide Films with CIE Lab Color Parameters Close to Zero and High Thermal Stability for Potential Applications in Flexible Printed Circuit Boards

Black polymer films with high thermal stability are highly desired in flexible electrical and electronic fields. Conventional black polymer films based on high-temperature resistant polymers and black inorganic dyes are usually suffered from the poor electrical and tensile properties. In the current work, a series of intrinsically black polyimide (BPI) films with International Commission on Illumination (CIE) Lab optical parameters close to zero and high thermal stability have been designed and prepared. For this purpose, an electron-rich aromatic diamine, 4,4′-iminodianiline (NDA), was copolymerized with 1,4-phenylenediamine (PDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA) to afford a series of poly(amic acid) (PAA) solutions, which were then thermally dehydrated to provide the final BPI films at elevated temperatures up to 400 °C in air. The molar fraction of NDA in the total diamine monomers was 0 for BPI-0 (sBPDA-PDA), 10% for BPI-1, 20% for BPI-2, 30% for BPI-3, 40% for BPI-4, 50% for BPI-5, and 100% for BPI-6. For comparison, two referenced polyimide (PI) films, including PI-ref1 and PI-ref2, were prepared according to a similar procedure. The former was derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) and the latter was from PMDA and NDA. The BPI films exhibited an increasing degree of blackness with the increasing contents of NDA units in the polymer films. For example, the BPI-6 (sBPDA-NDA) film exhibited the optical transmittance of 1.4% at a wavelength of 650 nm (T₆₅₀), which was obviously lower than those of PI-ref1 (T₆₅₀ = 74.6%) and PI-ref2 (T₆₅₀ = 3.6%). In addition, the BPI-6 film showed the CIE Lab parameters of 0.39 for L*, 2.65 for a*, 0.66 for b*, and haze of 1.83, which was very close to the criterion of “pure blackness” for polymer films (L* = a* = b* = 0). At last, incorporation of the NDA units in the rigid-rod BPI-0 (BPDA-PDA) film slightly deteriorated the high-temperature dimensional stability of the derived BPI films. BPI-6 film showed a linear coefficient of thermal expansion (CTE) value of 34.8 × 10⁻⁶/K in the temperature range of 50 to 250 °C, which was higher than those of the BPI-0 (CTE = 12.3 × 10⁻⁶/K), PI-ref1 (CTE = 29.5 × 10⁻⁶/K), and PI-ref2 (CTE = 18.8 × 10⁻⁶/K) films. Nevertheless, the BPI films maintained good thermal stability with the 5% weight loss temperatures (T_5%) higher than 590 °C, and the glass transition temperatures (T_g) higher than 340 °C.

Effects of high polyamic acid content and curing process on properties of epoxy resins

Epoxy/polyamic acid (EP/PAA) adhesives with high polyimide precursor-PAA content have been synthesized and then cured. The structure, thermal, and adhesive properties were investigated by Fourier transform infrared spectroscopy, thermogravimetric analysis, and tensile shear test. The effects of PAA content and curing process on the tensile shear strength were also studied. The results showed that the addition of PAA improved the heat resistance and reduced the water absorption. EP/PAA adhesive kept good adhesion. A kind of EP/PAA composite adhesive with excellent comprehensive properties was prepared in this study.

Preparation and Characterization of Semi-alicyclic Polyimides Containing Trifluoromethyl Groups for Optoelectronic Application

Transparent polyimides (PI) films with outstanding overall performance are attractive for next generation optoelectronic and microelectronic applications. Semi-alicyclic PIs derived from alicyclic dianhydrides and aromatic diamines have proved effective to prepare transparent PIs with high transmittance. To optimize the combined properties of semi-alicyclic PIs, incorporating bulky trifluoromethyl groups into the backbones is regarded as a powerful tool. However, the lack of fundamental understanding of structure–property relationships of fluorinated semi-alicyclic PIs constrains the design and engineering of advanced films for such challenging applications. Herein, a series of semi-alicyclic PIs derived from alicyclic dianhydrides and trifluoromethyl-containing aromatic diamines was synthesized by solution polycondensation at high temperature. The effects of alicyclic structures and bulky trifluoromethyl groups on thermal, dielectric and optical properties of PIs were investigated systematically. These PI films had excellent solubility, low water absorption and good mechanical property. They showed high heat resistance with T_g in the range of 294–390 °C. It is noted that tensile strength and thermal stability were greatly affected by the rigid linkages and alicyclic moieties, respectively. These films exhibited obviously low refractive indices and significantly reduced dielectric constants from 2.61 to 2.76, together with low optical birefringence and dielectric anisotropy. Highly transparent films exhibited cutoff wavelength even as low as 298 nm and transmittance at 500 nm over 85%, displaying almost colorless appearance with yellowness index (b*) below 4.2. The remarkable optical improvement should be mainly ascribed to both weak electron-accepting alicyclic units and bulky electron-withdrawing trifluoromethyl or sulfone groups. The present work provides an effective strategy to design molecular structures of optically transparent PIs for a trade-off between solution-processability, low water uptake, good toughness, high heat resistance, low dielectric constant and excellent optical transparency.