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Kandanarachchi P, Meyer GA, Musolino SF, Wulff JE, Rhodes LF. Crosslinking Vinyl-Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric-Constant and Low Dielectric-Loss Thermosets. Macromol Rapid Commun 2024:e2400200. [PMID: 38875712 DOI: 10.1002/marc.202400200] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/07/2024] [Revised: 05/23/2024] [Indexed: 06/16/2024]
Abstract
Thermosets having low dielectric constant (Dk < 3) and low dielectric dissipation factor (Df < 0.003), high glass transition temperature (Tg > 150 °C), and good adhesion to copper are desirable for the low loss layers of the copper clad laminates (CCL) in next generation printed circuit boards. Three different difunctional diazirines are evaluated for both thermal and photochemical crosslinking of a high Tg vinyl-addition polynorbornene resin: poly(5-hexyl-1-norbornene) (poly(HNB)). The substrate polymer, crosslinked by the carbenes generated from the activated diazirines, forms thermosets with Dk < 2.3 and Df < 0.001 at 10 GHz depending on the identity of the diazirine and the loading. The Dk and Df values for one composition are stable for 1600 h at 125 °C in air and for 1400 h at 85 °C and 85% relative humidity, suggesting good long-term reliability of this thermoset. Adhesion of poly(HNB) to copper can be enhanced by priming the copper surface with a diazirine prior to high temperature lamination; peel strength values of greater than 7.5 N cm-1 are achieved. Negative-tone photopatterning of poly(HNB) with diazirines upon exposure to 365 nm light is demonstrated.
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Affiliation(s)
| | | | | | - Jeremy E Wulff
- Department of Chemistry, University of Victoria, Victoria, BC, V8W 3V6, Canada
| | - Larry F Rhodes
- Promerus, LLC, 225 W. Bartges Street, Akron, OH, 44307, USA
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Xu W, Wang Z, Cao H, Zhou L, Jiang N, Ke K, Liu Z, Yang W, Yang M. Optimization of the Thermally Conductive Low- k Polymer Dielectrics Based on Multisource Free-Volume Effects. ACS APPLIED MATERIALS & INTERFACES 2024; 16:16809-16819. [PMID: 38502907 DOI: 10.1021/acsami.4c00553] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 03/21/2024]
Abstract
Polymers/polymer matrix composites possessing low dielectric constants (low-k polymer dielectrics) contribute to the advance of electronics, for instance, microprocessor chips, mobile phone antennas, and data communication terminals. However, the intrinsic long-chain structural characteristic results in poor thermal conductivities, which draw heat accumulation and undermine the outstanding low-k performance of polymers. Herein, multisource free-volume effects that combine two novel kinds of extra free volume with the known in-cage free volume of polyhedral oligomeric silsesquioxanes (POSSs) are discussed to reduce the capacity for dielectric constant reduction. The multisource free-volume effects of POSSs are associated with the thermal conductive network formed by the hexagonal boron nitride (BN) in the polymer matrix. The results show a decent balance between low-k performance (dielectric constant is 2.08 at 1 MHz and 1.98 at 10 GHz) and thermal conductivity (0.555 W m-1 K-1, 4.91 times the matrix). The results provide a new idea to maximize the free-volume effects of POSSs to optimize dielectric properties together with other desired performances for the dielectrics.
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Affiliation(s)
- Weidi Xu
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China
| | - Ziyang Wang
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China
| | - Hong Cao
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China
| | - Ling Zhou
- School of Materials Scence and Engineering, Hubei University of Technology, Wuhan, Hubei 430068, China
| | - Niu Jiang
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China
| | - Kai Ke
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China
| | - Zhengying Liu
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China
| | - Wei Yang
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China
- State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
| | - Mingbo Yang
- College of Polymer Science and Engineering, Sichuan University, Chengdu 610065, China
- State Key Laboratory of Polymer Materials Engineering, Sichuan University, Chengdu 610065, China
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Zheng K, Zhang Y, Qiu J, Xie G, Huang Z, Lin W, Liu Z, Liu Q, Wang X. Flame-Retardant GF-PSB/DOPO-POSS Composite with Low Dk/Df and High Thermal Stability for High-Frequency Copper Clad Applications. Polymers (Basel) 2024; 16:544. [PMID: 38399922 PMCID: PMC10892954 DOI: 10.3390/polym16040544] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 01/06/2024] [Revised: 02/14/2024] [Accepted: 02/15/2024] [Indexed: 02/25/2024] Open
Abstract
In the field of high-frequency communications devices, there is an urgent need to develop high-performance copper clad laminates (CCLs) with low dielectric loss (Df) plus good flame retardancy and thermal stability. The hydrocarbon resin styrene-butadiene block copolymer (PSB) was modified with the flame-retardant 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide/polyhedral oligomeric silsesquioxanes (DOPO-POSS) to meet the demands of high-frequency and high-speed applications. The resulting DOPO-POSS-modified PSB was used as the resin matrix along with other additives to fabricate PSB/DOPO-POSS laminates. At a high-frequency of 10 GHz, the laminates containing 20 wt.% of DOPO-POSS and with a thickness of 0.09 mm exhibited a Df of 0.00328, which is much lower compared with the commercial PSB/PX-200 composite (Df: 0.00498) and the PSB without flame retardancy (Df: 0.00453). Afterwards, glass fiber cloth (GF) was used as a reinforcing material to manufacture GF-PSB/DOPO-POSS composite laminates with a thickness of 0.25 mm. The flame retardancy of GF-PSB/DOPO-POSS composite laminate reached vertical burning (UL-94) V-1 grade, and GF-PSB/DOPO-POSS exhibited higher thermal and dynamic mechanical properties than GF-PSB/PX-200. The results of a limited oxygen index (LOI) and self-extinguishing time tests also demonstrated the superior flame-retardant performance of DOPO-POSS compared with PX-200. The investigation indicates that GF-PSB/DOPO-POSS composite laminates have significant potential for use in fabricating a printed circuit board (PCB) for high-frequency and high-speed applications.
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Affiliation(s)
- Ke Zheng
- Sub Center of Dongguan University of Technology of National Engineering Research Center of Electronic Circuits Base Materials, School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523808, China; (K.Z.); (Y.Z.); (Z.L.)
| | - Yizhi Zhang
- Sub Center of Dongguan University of Technology of National Engineering Research Center of Electronic Circuits Base Materials, School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523808, China; (K.Z.); (Y.Z.); (Z.L.)
| | - Jiaxiang Qiu
- School of Environment and Civil Engineering, Dongguan University of Technology, Dongguan 523808, China;
| | - Guanqun Xie
- School of Environment and Civil Engineering, Dongguan University of Technology, Dongguan 523808, China;
| | - Zengbiao Huang
- National Engineering Research Center of Electronic Circuits Base Materials, SHENGYI Technology Co., Ltd., Dongguan 523808, China; (Z.H.); (W.L.); (Q.L.)
| | - Wei Lin
- National Engineering Research Center of Electronic Circuits Base Materials, SHENGYI Technology Co., Ltd., Dongguan 523808, China; (Z.H.); (W.L.); (Q.L.)
| | - Zhimeng Liu
- Sub Center of Dongguan University of Technology of National Engineering Research Center of Electronic Circuits Base Materials, School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523808, China; (K.Z.); (Y.Z.); (Z.L.)
| | - Qianfa Liu
- National Engineering Research Center of Electronic Circuits Base Materials, SHENGYI Technology Co., Ltd., Dongguan 523808, China; (Z.H.); (W.L.); (Q.L.)
| | - Xiaoxia Wang
- Sub Center of Dongguan University of Technology of National Engineering Research Center of Electronic Circuits Base Materials, School of Materials Science and Engineering, Dongguan University of Technology, Dongguan 523808, China; (K.Z.); (Y.Z.); (Z.L.)
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Lee P, Jung H, Yoo CS, Lee HH. Low Dielectric Constant Characteristics of Styrene and Maleimide Anhydride Copolymer with Modification for High Frequency Application of Printed Circuit Board. Polymers (Basel) 2023; 15:polym15092078. [PMID: 37177239 PMCID: PMC10181387 DOI: 10.3390/polym15092078] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 02/28/2023] [Revised: 04/22/2023] [Accepted: 04/24/2023] [Indexed: 05/15/2023] Open
Abstract
Recently, due to the intensive and fast progress of the high frequency wireless communication environment, including 5th generation (5G) wireless communication, more robust substrate for printed circuit board (PCB) application, especially with less power consumption, is required. In this study, modified resins based on styrene-maleic anhydride (SMA) copolymer were prepared and evaluated as binder resin to accomplish a low dielectric constant or relative permittivity (εr: <3.0) substrate for the PCB application under ultrahigh frequencies (UHF; 1 GHz~9.4 GHz). The low εr dielectric characteristics of the modified SMA copolymer could be correlated with effects from the stereo-structure of carbon chains or conformational orientation, where the degree of crystallization was analyzed by X-ray diffraction (XRD) and nuclear magnetic resonance (NMR) spectroscopies. Prepreg films of the low εr modified SMA copolymers and their compounds with epoxy resins were also characterized in terms of dielectric loss or dissipation factor (Df), which have shown more noticeable relation with their stereo-structures as well.
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Affiliation(s)
- Pilwoo Lee
- Department of Chemical Engineering, Myongji University, Yongin-si 17058, Gyeonggi-do, Republic of Korea
| | - Hunsang Jung
- Department of Chemical Engineering, Myongji University, Yongin-si 17058, Gyeonggi-do, Republic of Korea
| | - Chan-Sei Yoo
- Electronic Convergence Materials & Devices Research Center, Korea Electronics Technology Institute, Seongnam-si 13509, Gyeonggi-do, Republic of Korea
| | - Hyun Ho Lee
- Department of Chemical Engineering, Myongji University, Yongin-si 17058, Gyeonggi-do, Republic of Korea
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Deterioration of microwave dielectric properties of low-loss thermosetting polyphenylene oxide/hydrocarbon resin induced by short-term thermo-oxidative aging. Polym Degrad Stab 2022. [DOI: 10.1016/j.polymdegradstab.2022.110193] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]
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Dai T, Jiang X, Ge Y, Zou H, Liu P. Thermosetting epoxidized polybutadiene/low‐molecular weight polyphenylene oxide compatible system with quite low‐dielectric constant and loss prepared through co‐curing reaction. POLYM ADVAN TECHNOL 2022. [DOI: 10.1002/pat.5901] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/06/2022]
Affiliation(s)
- Tianwen Dai
- State Key Laboratory of Polymer Materials Engineering Polymer Research Institute of Sichuan University Chengdu China
| | - Xinyue Jiang
- State Key Laboratory of Polymer Materials Engineering Polymer Research Institute of Sichuan University Chengdu China
| | - Ying Ge
- State Key Laboratory of Polymer Materials Engineering Polymer Research Institute of Sichuan University Chengdu China
| | - Huawei Zou
- State Key Laboratory of Polymer Materials Engineering Polymer Research Institute of Sichuan University Chengdu China
| | - Pengbo Liu
- State Key Laboratory of Polymer Materials Engineering Polymer Research Institute of Sichuan University Chengdu China
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Design and synthesis of liquid crystal copolyesters with high-frequency low dielectric loss and inherent flame retardancy. CHINESE CHEM LETT 2022. [DOI: 10.1016/j.cclet.2022.06.038] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/22/2022]
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Lee TN, Lau JH, Ko CT, Xia T, Lin E, Yang KM, Lin PB, Peng CY, Chang L, Chen JS, Fang YH, Liao LY, Charn E, Wang J, Tseng TJ. Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications. MATERIALS 2022; 15:ma15072396. [PMID: 35407726 PMCID: PMC9000071 DOI: 10.3390/ma15072396] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 12/22/2021] [Revised: 03/09/2022] [Accepted: 03/18/2022] [Indexed: 11/21/2022]
Abstract
In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry–Perot open resonator (FPOR) technique. Emphasis is placed on the sample preparation, data collection, and the comparison with the data sheet values provided from vendors. A coplanar waveguide with ground (CPWG) test vehicle with one of these raw dielectric materials (vendor 1) is designed (through Polar and simulation) and fabricated. The impedance of the test vehicle is measured by TDR (time-domain reflectometer), and the effective Dk of the test vehicle is calculated by the real cross-section of the metal line width, spacing, and thickness of the test vehicle and a closed-form equation. In parallel, the insertion loss and return loss are measured with the VNA (vector network analyzer) of the test vehicle. Finally, the measurement and simulation results are correlated. Some recommendations on the low-loss dielectric materials of the Dk and Df are also provided.
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Study of two novel siloxane-containing polybenzoxazines with intrinsic low dielectric constant. POLYMER 2022. [DOI: 10.1016/j.polymer.2022.124572] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/18/2022]
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10
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Wang Q, Wang H, Zhang C, Zhang Q, Yang H. Core-Shell Sr 2CeO 4@SiO 2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates. Polymers (Basel) 2021; 13:4006. [PMID: 34833303 PMCID: PMC8625303 DOI: 10.3390/polym13224006] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/08/2021] [Revised: 11/01/2021] [Accepted: 11/16/2021] [Indexed: 11/17/2022] Open
Abstract
High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m-1·K-1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/°C. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.
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Affiliation(s)
- Qinlong Wang
- State Key Laboratory Silicon Mat, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; (Q.W.); (H.W.); (H.Y.)
| | - Hao Wang
- State Key Laboratory Silicon Mat, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; (Q.W.); (H.W.); (H.Y.)
| | - Caixia Zhang
- Jiaxing Glead Elect Co., Ltd., Jiaxing 314003, China;
| | - Qilong Zhang
- State Key Laboratory Silicon Mat, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; (Q.W.); (H.W.); (H.Y.)
| | - Hui Yang
- State Key Laboratory Silicon Mat, School of Materials Science and Engineering, Zhejiang University, Hangzhou 310027, China; (Q.W.); (H.W.); (H.Y.)
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11
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Fluorinated low molecular weight poly(phenylene oxide): Synthesis, characterization, and application in epoxy resin toward improved thermal and dielectric properties. Eur Polym J 2021. [DOI: 10.1016/j.eurpolymj.2021.110674] [Citation(s) in RCA: 8] [Impact Index Per Article: 2.7] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/23/2022]
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12
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Kunčická L, Jambor M, Weiser A, Dvořák J. Structural Factors Inducing Cracking of Brass Fittings. MATERIALS 2021; 14:ma14123255. [PMID: 34204723 PMCID: PMC8231648 DOI: 10.3390/ma14123255] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.7] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 05/11/2021] [Revised: 06/03/2021] [Accepted: 06/09/2021] [Indexed: 12/04/2022]
Abstract
Cu–Zn–Pb brasses are popular materials, from which numerous industrially and commercially used components are fabricated. These alloys are typically subjected to multiple-step processing—involving casting, extrusion, hot forming, and machining—which can introduce various defects to the final product. The present study focuses on the detailed characterization of the structure of a brass fitting—i.e., a pre-shaped medical gas valve, produced by hot die forging—and attempts to assess the factors beyond local cracking occurring during processing. The analyses involved characterization of plastic flow via optical microscopy, and investigations of the phenomena in the vicinity of the crack, for which we used scanning and transmission electron microscopy. Numerical simulation was implemented not only to characterize the plastic flow more in detail, but primarily to investigate the probability of the occurrence of cracking based on the presence of stress. Last, but not least, microhardness in specific locations of the fitting were examined. The results reveal that the cracking occurring in the location with the highest probability of the occurrence of defects was most likely induced by differences in the chemical composition; the location the crack in which developed exhibited local changes not only in chemical composition—which manifested as the presence of brittle precipitates—but also in beta phase depletion. Moreover, as a result of the presence of oxidic precipitates and the hard and brittle alpha phase, the vicinity of the crack exhibited an increase in microhardness, which contributed to local brittleness.
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