A cross-linkable triphenylamine derivative as a hole injection/transporting material in organic light-emitting diodes

A new thermally cross-linkable triphenylamine derivative containing a benzoxazine functional group for application in organic light-emitting diodes (OLEDs.)

Multifunctional polybenzoxazine nanocomposites containing photoresponsive azobenzene units, catalytic carboxylic acid groups, and pyrene units capable of dispersing carbon nanotubes

A new multifunctional benzoxazine monomer Azo-COOH-Py BZ includes an azobenzene unit, a carboxylic acid group, and a pyrene moiety.

Studies on MCM-41/PDMS based hybrid polybenzoxazine nanocomposites for interlayer low k dielectrics

The development of thermally stable mesoporous silica/siloxane based hybrid polybenzoxazine nanocomposites as an interlayer low k dielectric material.

Design of lamellar structured POSS/BPZ polybenzoxazine nanocomposites as a novel class of ultra low-k dielectric materials

A novel class of lamellar structured polyhedral oligomeric silsesquioxane/bisphenol Z (POSS/BPZ) polybenzoxazine (PBz) nanocomposites was successfully designed by a facile one-step copolymerization technique.

Studies on FMCM-41 reinforced cyanate ester nanocomposites for low k applications

The continual development of microelectronics needs insulation materials with lower dielectric constant (low k).

Vinyl silane-functionalized rice husk ash-reinforced unsaturated polyester nanocomposites

Organic–inorganic hybrid nanocomposites based on vinyl silane-functionalized rice husk ash-reinforced unsaturated polyester resin were developed and characterized.

Development of bio-based F-SBA-15 reinforced epoxy nanocomposites for low-k dielectric applications

The present work focuses on the utilization of renewable biomaterial as reinforcement for the development of nanocomposites for high-performance low- k microelectronic applications. In the present work, rice husk ash (RHA) was chemically treated and processed to obtain two-dimensional mesoporous silica (SBA-15), which was functionalized using 3-glycidoxypropyl trimethoxy silane through sonication process. The surface functionalized SBA-15 (F-SBA-15) with varying weight percentages (1, 3, and 5 wt%) was incorporated into the epoxy resin. The resulting F-SBA-15-reinforced epoxy composites were characterized by Fourier transform infrared spectroscopy, x-ray diffraction, differential scanning calorimetry, thermogravimetric analysis, and impedance analyzer. Among the composite samples with varying loadings, the dielectric behavior of 5 wt% F-SBA-15-loaded composite sample possesses the lowest value of dielectric constant, that is, 2.14 at 1 MHz frequency when compared with that of other samples. Further, the thermal stability was also enhanced to an appreciable extent, when compared with that of the samples with lower F-SBA-15 loadings.