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Citation(s) in RCA

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Results Analysis
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Number Cited by Other Article(s)
51
Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing. ACTA ACUST UNITED AC 2003. [DOI: 10.1116/1.1622676] [Citation(s) in RCA: 458] [Impact Index Per Article: 21.8] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
52
Overview on Low Dielectric Constant Materials for IC Applications. ACTA ACUST UNITED AC 2003. [DOI: 10.1007/978-3-642-55908-2_1] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register]
53
Effects of Ti addition on the morphology, interfacial reaction, and diffusion of Cu on SiO[sub 2]. ACTA ACUST UNITED AC 2002. [DOI: 10.1116/1.1520552] [Citation(s) in RCA: 29] [Impact Index Per Article: 1.3] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/17/2022]
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