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For: Inagaki N, Tasaka S, Onodera A. Improved adhesion between Kapton film and copper metal by silane-coupling reactions. J Appl Polym Sci 1999. [DOI: 10.1002/(sici)1097-4628(19990829)73:9<1645::aid-app5>3.0.co;2-l] [Citation(s) in RCA: 16] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/10/2022]
Number Cited by Other Article(s)
1
Chen YH, Lai YH, Wu PH, Chen LS, Lin YS, Chen CM. Mutual intercropping-inspired co-silanization to graft well-oriented organosilane as adhesion promotion nanolayer for flexible conductors. J IND ENG CHEM 2020. [DOI: 10.1016/j.jiec.2019.11.017] [Citation(s) in RCA: 6] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/25/2022]
2
Stanford MG, Li JT, Chyan Y, Wang Z, Wang W, Tour JM. Laser-Induced Graphene Triboelectric Nanogenerators. ACS NANO 2019;13:7166-7174. [PMID: 31117382 DOI: 10.1021/acsnano.9b02596] [Citation(s) in RCA: 43] [Impact Index Per Article: 8.6] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/20/2023]
3
Kameyama T, Ohno Y, Kurimoto T, Okazaki KI, Uematsu T, Kuwabata S, Torimoto T. Size control and immobilization of gold nanoparticles stabilized in an ionic liquid on glass substrates for plasmonic applications. Phys Chem Chem Phys 2010;12:1804-11. [DOI: 10.1039/b914230d] [Citation(s) in RCA: 50] [Impact Index Per Article: 3.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/20/2023]
4
Inagaki N. Role of polymer chain end groups in plasma modification for surface metallization of polymeric materials. POLYM INT 2009. [DOI: 10.1002/pi.2546] [Citation(s) in RCA: 9] [Impact Index Per Article: 0.6] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]
5
Matsui J, Kubota K, Kado Y, Miyashita T. Electroless Copper Plating onto Polyimide Using Polymer Nanosheet as a Nano-Adhesive. Polym J 2006. [DOI: 10.1295/polymj.pj2006099] [Citation(s) in RCA: 18] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/08/2022]
6
Yu Z, Kang E, Neoh K. Electroless plating of copper on polyimide films modified by surface grafting of tertiary and quaternary amines polymers. POLYMER 2002. [DOI: 10.1016/s0032-3861(02)00263-x] [Citation(s) in RCA: 63] [Impact Index Per Article: 2.9] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/18/2022]
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