1
|
Ki S, Shin S, Cho S, Bang S, Choi D, Nam Y. Sustainable Thermal Regulation of Electronics via Mitigated Supercooling of Porous Gallium-Based Phase Change Materials. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2024; 11:e2310185. [PMID: 38634574 PMCID: PMC11186057 DOI: 10.1002/advs.202310185] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/24/2023] [Revised: 03/19/2024] [Indexed: 04/19/2024]
Abstract
Gallium liquid metal is one of the promising phase change materials for passive thermal management of electronics due to their high thermal conductivity and latent heat per volume. However, it suffers from severe supercooling, in which molten gallium does not return to solid due to the lack of nucleation. It may require 28.2 °C lower temperature than the original freezing point to address supercooling, leading to unstable thermal regulation performance along fluctuations of cooling condition. Here, gallium is infused into porous copper in an oxide-free environment, forming intermetallic compound impurities at the interfaces to reduce the activation energy for heterogeneous nucleation. The porous-shaped gallium provides ≈63% smaller supercooling than that of the bulk type due to large specific surface area (≈9,070 cm2 per cm3) and high wetting characteristics (≈16° of contact angle) on CuGa2 intermetallic layer. During repetitive heating-cooling cycles, porous-shaped gallium consistently shows propagation of crystallization at even near room temperature (≈25 °C) while maintaining stable performance as thermal buffer, whereas droplet-shaped gallium is gradually degraded due to partial-supercooled state. The findings will improve the responsive thermal regulation performance to relieve a rapid increase in temperature of semiconductors/batteries, and also have a potential for energy storage applications.
Collapse
Affiliation(s)
- Seokkan Ki
- Department of Mechanical EngineeringKorea Advanced Institute of Science and Technology (KAIST)Daejeon34 141Republic of Korea
| | - Seongjong Shin
- Department of Mechanical EngineeringKorea Advanced Institute of Science and Technology (KAIST)Daejeon34 141Republic of Korea
| | - Sumin Cho
- Department of Mechanical EngineeringKyung Hee UniversityYongin17 104Republic of Korea
| | - Soosik Bang
- Department of Mechanical EngineeringKorea Advanced Institute of Science and Technology (KAIST)Daejeon34 141Republic of Korea
| | - Dongwhi Choi
- Department of Mechanical EngineeringKyung Hee UniversityYongin17 104Republic of Korea
| | - Youngsuk Nam
- Department of Mechanical EngineeringKorea Advanced Institute of Science and Technology (KAIST)Daejeon34 141Republic of Korea
| |
Collapse
|
2
|
Li L, Zhai W, Wang C, Li S, Peng P, Fan P, Yang G. Improvement of Mechanical and Thermoelectric Properties of AgCuTe by Pinning Effect and Enhanced Liquid-Like Behavior via SiC Alloying. ACS APPLIED MATERIALS & INTERFACES 2024; 16:16290-16299. [PMID: 38520333 DOI: 10.1021/acsami.4c01019] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 03/25/2024]
Abstract
With the development and application of thermoelectric (TE) devices, it requires not only high-performance of TE materials but also high mechanical properties. Here, we report a medium-temperature liquid material, AgCuTe, with high mechanical properties. The results demonstrate that AgCuTe possesses a multiphase structure characterized by abundant grain boundaries, resulting in reduced lattice thermal conductivity and inherently high mechanical strength. Furthermore, nano-SiC was alloyed into the AgCuTe material to further improve its mechanical and TE properties. Nano-SiC exhibited a button-like distribution within the grain boundaries, introducing a pinning effect that significantly elevated the Vickers hardness of the samples. Additionally, nano-SiC induced strong lattice distortion energy in the vicinity, which promotes Ag/Cu ions to escape from the lattice and enhances the liquid-like behavior of Ag/Cu ions. Finally, these enhancements led to a 21% improvement in the mechanical properties and a 40% improvement in the TE properties for AgCuTe. Notably, AgCuTe achieved its peak TE performance, with a latest peak ZT value of 1.32 at 723 K. This research expands the potential applications of AgCuTe.
Collapse
Affiliation(s)
- Lanwei Li
- Institute for Computational Materials Science, School of Physics and Electronics, Henan University, Kaifeng 475004, P. R. China
- Department of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510641, China
| | - Wenya Zhai
- Institute for Computational Materials Science, School of Physics and Electronics, Henan University, Kaifeng 475004, P. R. China
| | - Chao Wang
- Institute for Computational Materials Science, School of Physics and Electronics, Henan University, Kaifeng 475004, P. R. China
| | - Shuyao Li
- Institute for Computational Materials Science, School of Physics and Electronics, Henan University, Kaifeng 475004, P. R. China
| | - Panpan Peng
- Institute for Computational Materials Science, School of Physics and Electronics, Henan University, Kaifeng 475004, P. R. China
| | - Pengya Fan
- Institute for Computational Materials Science, School of Physics and Electronics, Henan University, Kaifeng 475004, P. R. China
| | - Gui Yang
- School of Mechanical and Electrical Engineering, Chuzhou University, Chuzhou 239000, China
| |
Collapse
|
3
|
Kwon DA, Lee S, Kim CY, Kang I, Park S, Jeong JW. Body-temperature softening electronic ink for additive manufacturing of transformative bioelectronics via direct writing. SCIENCE ADVANCES 2024; 10:eadn1186. [PMID: 38416839 PMCID: PMC10901467 DOI: 10.1126/sciadv.adn1186] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 11/23/2023] [Accepted: 01/29/2024] [Indexed: 03/01/2024]
Abstract
Mechanically transformative electronic systems (TESs) built using gallium have emerged as an innovative class of electronics due to their ability to switch between rigid and flexible states, thus expanding the versatility of electronics. However, the challenges posed by gallium's high surface tension and low viscosity have substantially hindered manufacturability, limiting high-resolution patterning of TESs. To address this challenge, we introduce a stiffness-tunable gallium-copper composite ink capable of direct ink write printing of intricate TES circuits, offering high-resolution (~50 micrometers) patterning, high conductivity, and bidirectional soft-rigid convertibility. These features enable transformative bioelectronics with design complexity akin to traditional printed circuit boards. These TESs maintain rigidity at room temperature for easy handling but soften and conform to curvilinear tissue surfaces at body temperature, adapting to dynamic tissue deformations. The proposed ink with direct ink write printing makes TES manufacturing simple and versatile, opening possibilities in wearables, implantables, consumer electronics, and robotics.
Collapse
Affiliation(s)
- Do A Kwon
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Simok Lee
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Choong Yeon Kim
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Inho Kang
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, Daejeon 34141, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
- KAIST Institute for Health Science and Technology, Daejeon 34141, Republic of Korea
| |
Collapse
|
4
|
Tang W, Sun Q, Wang ZL. Self-Powered Sensing in Wearable Electronics─A Paradigm Shift Technology. Chem Rev 2023; 123:12105-12134. [PMID: 37871288 PMCID: PMC10636741 DOI: 10.1021/acs.chemrev.3c00305] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [MESH Headings] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/05/2023] [Revised: 10/04/2023] [Accepted: 10/05/2023] [Indexed: 10/25/2023]
Abstract
With the advancements in materials science and micro/nanoengineering, the field of wearable electronics has experienced a rapid growth and significantly impacted and transformed various aspects of daily human life. These devices enable individuals to conveniently access health assessments without visiting hospitals and provide continuous, detailed monitoring to create comprehensive health data sets for physicians to analyze and diagnose. Nonetheless, several challenges continue to hinder the practical application of wearable electronics, such as skin compliance, biocompatibility, stability, and power supply. In this review, we address the power supply issue and examine recent innovative self-powered technologies for wearable electronics. Specifically, we explore self-powered sensors and self-powered systems, the two primary strategies employed in this field. The former emphasizes the integration of nanogenerator devices as sensing units, thereby reducing overall system power consumption, while the latter focuses on utilizing nanogenerator devices as power sources to drive the entire sensing system. Finally, we present the future challenges and perspectives for self-powered wearable electronics.
Collapse
Affiliation(s)
- Wei Tang
- CAS
Center for Excellence in Nanoscience, Beijing Institute of Nanoenergy
and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- School
of Nanoscience and Technology, University
of Chinese Academy of Sciences, Beijing 100049, China
- Institute
of Applied Nanotechnology, Jiaxing, Zhejiang 314031, P.R. China
| | - Qijun Sun
- CAS
Center for Excellence in Nanoscience, Beijing Institute of Nanoenergy
and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- School
of Nanoscience and Technology, University
of Chinese Academy of Sciences, Beijing 100049, China
| | - Zhong Lin Wang
- CAS
Center for Excellence in Nanoscience, Beijing Institute of Nanoenergy
and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China
- Yonsei
Frontier Lab, Yonsei University, Seoul 03722, Republic of Korea
- Georgia
Institute of Technology, Atlanta, Georgia 30332-0245, United States
| |
Collapse
|
5
|
Agno KC, Yang K, Byun SH, Oh S, Lee S, Kim H, Kim K, Cho S, Jeong WI, Jeong JW. A temperature-responsive intravenous needle that irreversibly softens on insertion. Nat Biomed Eng 2023:10.1038/s41551-023-01116-z. [PMID: 37903901 DOI: 10.1038/s41551-023-01116-z] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 04/06/2022] [Accepted: 09/26/2023] [Indexed: 11/01/2023]
Abstract
The high stiffness of intravenous needles can cause tissue injury and increase the risk of transmission of blood-borne pathogens through accidental needlesticks. Here we describe the development and performance of an intravenous needle whose stiffness and shape depend on body temperature. The needle is sufficiently stiff for insertion into soft tissue yet becomes irreversibly flexible after insertion, adapting to the shape of the blood vessel and reducing the risk of needlestick injury on removal, as we show in vein phantoms and ex vivo porcine tissue. In mice, the needles had similar fluid-delivery performance and caused substantially less inflammation than commercial devices for intravenous access of similar size. We also show that an intravenous needle integrated with a thin-film temperature sensor can monitor core body temperature in mice and detect fluid leakage in porcine tissue ex vivo. Temperature-responsive intravenous needles may improve patient care.
Collapse
Affiliation(s)
- Karen-Christian Agno
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Keungmo Yang
- Graduate School of Medical Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
- Division of Gastroenterology and Hepatology, Department of Internal Medicine, College of Medicine, The Catholic University of Korea, Seoul, Republic of Korea
| | - Sang-Hyuk Byun
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Subin Oh
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Simok Lee
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Heesoo Kim
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Kyurae Kim
- Graduate School of Medical Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Sungwoo Cho
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea
| | - Won-Il Jeong
- Graduate School of Medical Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea.
- KAIST Institute for Health Science and Technology, Daejeon, Republic of Korea.
| |
Collapse
|
6
|
Lee S, Byun SH, Kim CY, Cho S, Park S, Sim JY, Jeong JW. Beyond Human Touch Perception: An Adaptive Robotic Skin Based on Gallium Microgranules for Pressure Sensory Augmentation. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2022; 34:e2204805. [PMID: 36190163 DOI: 10.1002/adma.202204805] [Citation(s) in RCA: 9] [Impact Index Per Article: 4.5] [Reference Citation Analysis] [Abstract] [Key Words] [MESH Headings] [Track Full Text] [Subscribe] [Scholar Register] [Received: 05/27/2022] [Revised: 07/27/2022] [Indexed: 06/16/2023]
Abstract
Robotic skin with human-skin-like sensing ability holds immense potential in various fields such as robotics, prosthetics, healthcare, and industries. To catch up with human skin, numerous studies are underway on pressure sensors integrated on robotic skin to improve the sensitivity and detection range. However, due to the trade-off between them, existing pressure sensors have achieved only a single aspect, either high sensitivity or wide bandwidth. Here, an adaptive robotic skin is proposed that has both high sensitivity and broad bandwidth with an augmented pressure sensing ability beyond the human skin. A key for the adaptive robotic skin is a tunable pressure sensor built with uniform gallium microgranules embedded in an elastomer, which provides large tuning of the sensitivity and the bandwidth, excellent sensor-to-sensor uniformity, and high reliability. Through the mode conversion based on the solid-liquid phase transition of gallium microgranules, the sensor provides 97% higher sensitivity (16.97 kPa-1 ) in the soft mode and 262.5% wider bandwidth (≈1.45 MPa) in the rigid mode compared to the human skin. Successful demonstration of the adaptive robotic skin verifies its capabilities in sensing a wide spectrum of pressures ranging from subtle blood pulsation to body weight, suggesting broad use for various applications.
Collapse
Affiliation(s)
- Simok Lee
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Sang-Hyuk Byun
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Choong Yeon Kim
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Sungwoo Cho
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Steve Park
- Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, Republic of Korea
| | - Joo Yong Sim
- Department of Mechanical Systems Engineering, Sookmyung Women's University, Seoul, 04310, Republic of Korea
| | - Jae-Woong Jeong
- School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), KAIST Institute for Health Science and Technology, Daejeon, 34141, Republic of Korea
| |
Collapse
|
7
|
Ji S, Wu X, Jiang Y, Wang T, Liu Z, Cao C, Ji B, Chi L, Li D, Chen X. Self-Reporting Joule Heating Modulated Stiffness of Polymeric Nanocomposites for Shape Reconfiguration. ACS NANO 2022; 16:16833-16842. [PMID: 36194555 DOI: 10.1021/acsnano.2c06682] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Shape reconfigurable devices, e.g., foldable phones, have emerged with the development of flexible electronics. But their rigid frames limit the feasible shapes for the devices. To achieve freely changeable shapes yet keep the rigidity of devices for user-friendly operations, stiffness-tunable materials are desired, especially under electrical control. However, current such systems are multilayer with at least a heater layer and a structural layer, leading to complex fabrication, high cost, and loss of reprocessability. Herein, we fabricate covalent adaptable networks-carbon nanotubes (CAN-CNT) composites to realize Joule heating controlled stiffness. The nanocomposites function as stiffness-tunable matrices, electric heaters, and softening sensors all by themselves. The self-reporting of softening is used to regulate the power control, and the sensing mechanism is investigated by simulating the CNT-polymer chain interactions at the nanoscale during the softening process. The nanocomposites not only have adjustable mechanical and thermodynamic properties but also are easy to fabricate at low cost and exhibit reprocessability and recyclability benefiting from the dynamic exchange reactions of CANs. Shape and stiffness control of flexible display systems are demonstrated with the nanocomposites as framing material, where freely reconfigurable shapes are realized to achieve convenient operation, wearing, or storage, fully exploiting their flexible potential.
Collapse
Affiliation(s)
- Shaobo Ji
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798Singapore
- Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials, Soochow University, Suzhou, 215123China
| | - Xuwei Wu
- Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Department of Engineering Mechanics, Zhejiang University, Hangzhou, 310027China
| | - Ying Jiang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798Singapore
| | - Ting Wang
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798Singapore
- State Key Laboratory of Organic Electronics and Information Displays & Jiangsu Key Laboratory for Biosensors, Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing University of Posts and Telecommunications, Nanjing, 210023China
| | - Zhihua Liu
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798Singapore
- Agency for Science Technology and Research, Institute of Materials Research and Engineering (IMRE), Singapore, 138634, Singapore
| | - Can Cao
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798Singapore
| | - Baohua Ji
- Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Department of Engineering Mechanics, Zhejiang University, Hangzhou, 310027China
- Oujiang Lab, Wenzhou Institute, Chinese Academy of Sciences, Wenzhou, 325001China
| | - Lifeng Chi
- Jiangsu Key Laboratory for Carbon-Based Functional Materials & Devices, Institute of Functional Nano & Soft Materials, Soochow University, Suzhou, 215123China
| | - Dechang Li
- Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Department of Engineering Mechanics, Zhejiang University, Hangzhou, 310027China
| | - Xiaodong Chen
- Innovative Centre for Flexible Devices (iFLEX), Max Planck-NTU Joint Lab for Artificial Senses, School of Materials Science and Engineering, Nanyang Technological University, Singapore, 639798Singapore
- Agency for Science Technology and Research, Institute of Materials Research and Engineering (IMRE), Singapore, 138634, Singapore
| |
Collapse
|
8
|
Xue Z, Jin T, Xu S, Bai K, He Q, Zhang F, Cheng X, Ji Z, Pang W, Shen Z, Song H, Shuai Y, Zhang Y. Assembly of complex 3D structures and electronics on curved surfaces. SCIENCE ADVANCES 2022; 8:eabm6922. [PMID: 35947653 PMCID: PMC9365271 DOI: 10.1126/sciadv.abm6922] [Citation(s) in RCA: 11] [Impact Index Per Article: 5.5] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 01/11/2022] [Accepted: 06/27/2022] [Indexed: 05/25/2023]
Abstract
Electronic devices with engineered three-dimensional (3D) architectures are indispensable for frictional-force sensing, wide-field optical imaging, and flow velocity measurement. Recent advances in mechanically guided assembly established deterministic routes to 3D structures in high-performance materials, through controlled rolling/folding/buckling deformations. The resulting 3D structures are, however, mostly formed on planar substrates and cannot be transferred directly onto another curved substrate. Here, we introduce an ordered assembly strategy to allow transformation of 2D thin films into sophisticated 3D structures on diverse curved surfaces. The strategy leverages predefined mechanical loadings that deform curved elastomer substrates into flat/cylindrical configurations, followed by an additional uniaxial/biaxial prestretch to drive buckling-guided assembly. Release of predefined loadings results in an ordered assembly that can be accurately captured by mechanics modeling, as illustrated by dozens of complex 3D structures assembled on curved substrates. Demonstrated applications include tunable dipole antennas, flow sensors inside a tube, and integrated electronic systems capable of conformal integration with the heart.
Collapse
Affiliation(s)
- Zhaoguo Xue
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Tianqi Jin
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Shiwei Xu
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Ke Bai
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Qi He
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
| | - Fan Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Xu Cheng
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Ziyao Ji
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Wenbo Pang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Zhangming Shen
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Honglie Song
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Yumeng Shuai
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| | - Yihui Zhang
- Applied Mechanics Laboratory, Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
- Center for Flexible Electronics Technology, Tsinghua University, Beijing 100084, P.R. China
| |
Collapse
|
9
|
Byun S, Yun JH, Heo S, Shi C, Lee GJ, Agno K, Jang K, Xiao J, Song YM, Jeong J. Self-Cooling Gallium-Based Transformative Electronics with a Radiative Cooler for Reliable Stiffness Tuning in Outdoor Use. ADVANCED SCIENCE (WEINHEIM, BADEN-WURTTEMBERG, GERMANY) 2022; 9:e2202549. [PMID: 35661444 PMCID: PMC9404411 DOI: 10.1002/advs.202202549] [Citation(s) in RCA: 7] [Impact Index Per Article: 3.5] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Figures] [Subscribe] [Scholar Register] [Received: 05/02/2022] [Indexed: 06/15/2023]
Abstract
Reconfigurability of a device that allows tuning of its shape and stiffness is utilized for personal electronics to provide an optimal mechanical interface for an intended purpose. Recent approaches in developing such transformative electronic systems (TES) involved the use of gallium liquid metal, which can change its liquid-solid phase by temperature to facilitate stiffness control of the device. However, the current design cannot withstand excessive heat during outdoor applications, leading to undesired softening of the device when the rigid mode of operation is favored. Here, a gallium-based TES integrated with a flexible and stretchable radiative cooler is presented, which offers zero-power thermal management for reliable rigid mode operation in the hot outdoors. The radiative cooler can both effectively reflect the heat transfer from the sun and emit thermal energy. It, therefore, allows a TES-in-the-air to maintain its temperature below the melting point of gallium (29.8 ℃) under hot weather with strong sun exposure, thus preventing unwanted softening of the device. Comprehensive studies on optical, thermal, and mechanical characteristics of radiative-cooler-integrated TES, along with a proof-of-concept demonstration in the hot outdoors verify the reliability of this design approach, suggesting the possibility of expanding the use of TES in various environments.
Collapse
Affiliation(s)
- Sang‐Hyuk Byun
- School of Electrical EngineeringKorea Advanced Institute of Science and Technology (KAIST)Daejeon34141Republic of Korea
| | - Joo Ho Yun
- School of Electrical Engineering and Computer ScienceGwangju Institute of Science and Technology (GIST)Gwangju61005Republic of Korea
| | - Se‐Yeon Heo
- School of Electrical Engineering and Computer ScienceGwangju Institute of Science and Technology (GIST)Gwangju61005Republic of Korea
| | - Chuanqian Shi
- Department of Mechanical EngineeringUniversity of ColoradoBoulderCO80309USA
| | - Gil Ju Lee
- Department of Electronics EngineeringPusan National UniversityBusan46241Republic of Korea
| | - Karen‐Christian Agno
- School of Electrical EngineeringKorea Advanced Institute of Science and Technology (KAIST)Daejeon34141Republic of Korea
| | - Kyung‐In Jang
- Department of Robotics EngineeringDaegu Gyeongbuk Institute of Science and Technology (DGIST)Daegu42988Republic of Korea
| | - Jianliang Xiao
- Department of Mechanical EngineeringUniversity of ColoradoBoulderCO80309USA
| | - Young Min Song
- School of Electrical Engineering and Computer ScienceGwangju Institute of Science and Technology (GIST)Gwangju61005Republic of Korea
| | - Jae‐Woong Jeong
- School of Electrical EngineeringKorea Advanced Institute of Science and Technology (KAIST)Daejeon34141Republic of Korea
| |
Collapse
|
10
|
Lim T, Kim M, Akbarian A, Kim J, Tresco PA, Zhang H. Conductive Polymer Enabled Biostable Liquid Metal Electrodes for Bioelectronic Applications. Adv Healthc Mater 2022; 11:e2102382. [PMID: 35112800 DOI: 10.1002/adhm.202102382] [Citation(s) in RCA: 5] [Impact Index Per Article: 2.5] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 12/09/2021] [Revised: 01/14/2022] [Indexed: 12/11/2022]
Abstract
Gallium (Ga)-based liquid metal materials have emerged as a promising material platform for soft bioelectronics. Unfortunately, Ga has limited biostability and electrochemical performance under physiological conditions, which can hinder the implementation of its use in bioelectronic devices. Here, an effective conductive polymer deposition strategy on the liquid metal surface to improve the biostability and electrochemical performance of Ga-based liquid metals for use under physiological conditions is demonstrated. The conductive polymer [poly(3,4-ethylene dioxythiophene):tetrafluoroborate]-modified liquid metal surface significantly outperforms the liquid metal.based electrode in mechanical, biological, and electrochemical studies. In vivo action potential recordings in behaving nonhuman primate and invertebrate models demonstrate the feasibility of using liquid metal electrodes for high-performance neural recording applications. This is the first demonstration of single-unit neural recording using Ga-based liquid metal bioelectronic devices to date. The results determine that the electrochemical deposition of conductive polymer over liquid metal can improve the material properties of liquid metal electrodes for use under physiological conditions and open numerous design opportunities for next-generation liquid metal-based bioelectronics.
Collapse
Affiliation(s)
- Taehwan Lim
- Department of Chemical Engineering University of Utah Salt Lake City Utah 84112 USA
| | - Minju Kim
- Department of Mechanical Engineering University of Utah Salt Lake City Utah 84112 USA
| | - Amir Akbarian
- Department of Ophthalmology and Visual Science University of Utah Salt Lake City Utah 84112 USA
| | - Jungkyu Kim
- Department of Mechanical Engineering University of Utah Salt Lake City Utah 84112 USA
| | - Patrick A. Tresco
- Department of Biomedical Engineering University of Utah Salt Lake City Utah 84112 USA
| | - Huanan Zhang
- Department of Chemical Engineering University of Utah Salt Lake City Utah 84112 USA
| |
Collapse
|