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Dong X, Wan B, Zheng MS, Huang L, Feng Y, Yao R, Gao J, Zhao QL, Zha JW. Dual-Effect Coupling for Superior Dielectric and Thermal Conductivity of Polyimide Composite Films Featuring "Crystal-Like Phase" Structure. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2307804. [PMID: 37844305 DOI: 10.1002/adma.202307804] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 08/03/2023] [Revised: 10/02/2023] [Indexed: 10/18/2023]
Abstract
To match the increasing miniaturization and integration of electronic devices, higher requirements are put on the dielectric and thermal properties of the dielectrics to overcome the problems of delayed signal transmission and heat accumulation. Here, a 3D porous thermal conductivity network is successfully constructed inside the polyimide (PI) matrix by the combination of ionic liquids (IL) and calcium fluoride (CaF2 ) nanofillers, motivated by the bubble-hole forming orientation force. Benefiting from the 3D thermal network formed by IL as a porogenic template and "crystal-like phase" structures induced by CaF2 - polyamide acid charge transfer, IL-10 vol% CaF2 /PI porous film exhibits a low permittivity of 2.14 and a thermal conductivity of 7.22 W m-1 K-1 . This design strategy breaks the bottleneck that low permittivity and high thermal conductivity in microelectronic systems are difficult to be jointly controlled, and provides a feasible solution for the development of intelligent microelectronics.
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Affiliation(s)
- Xiaodi Dong
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China
- Shunde Innovation School, University of Science and Technology Beijing, Foshan, 528300, China
| | - Baoquan Wan
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China
- Shunde Innovation School, University of Science and Technology Beijing, Foshan, 528300, China
| | - Ming-Sheng Zheng
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China
- Shunde Innovation School, University of Science and Technology Beijing, Foshan, 528300, China
| | - Langbiao Huang
- School of Mechanical and Materials Engineering, North China University of Technology, Beijing, 100144, China
| | - Yang Feng
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiao Tong University, Xi'an, 710049, China
| | - Ruifeng Yao
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiao Tong University, Xi'an, 710049, China
| | - Jinghui Gao
- State Key Laboratory of Electrical Insulation and Power Equipment, Xi'an Jiao Tong University, Xi'an, 710049, China
| | - Quan-Liang Zhao
- School of Mechanical and Materials Engineering, North China University of Technology, Beijing, 100144, China
| | - Jun-Wei Zha
- Beijing Advanced Innovation Center for Materials Genome Engineering, School of Chemistry and Biological Engineering, University of Science and Technology Beijing, Beijing, 100083, China
- Shunde Innovation School, University of Science and Technology Beijing, Foshan, 528300, China
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