Highly Thermally Conductive Adhesion Elastomer Enhanced by Vertically Aligned Folded Graphene

Consistent Thermal Conductivities of Spring-Like Structured Polydimethylsiloxane Composites under Large Deformation

Flexible and highly thermally conductive materials with consistent thermal conductivity (λ) during large deformation are urgently required to address the heat accumulation in flexible electronics. In this study, spring-like thermal conduction pathways of silver nanowire (S-AgNW) fabricated by 3D printing are compounded with polydimethylsiloxane (PDMS) to prepare S-AgNW/PDMS composites with excellent and consistent λ during deformation. The S-AgNW/PDMS composites exhibit a λ of 7.63 W m-1 K-1 at an AgNW amount of 20 vol%, which is ≈42 times that of PDMS (0.18 W m-1 K-1) and higher than that of AgNW/PDMS composites with the same amount and random dispersion of AgNW (R-AgNW/PDMS) (5.37 W m-1 K-1). Variations in the λ of 20 vol% S-AgNW/PDMS composites are less than 2% under a deformation of 200% elongation, 50% compression, or 180° bending, which benefits from the large deformation characteristics of S-AgNW. The heat-transfer coefficient (0.29 W cm-2 K-1) of 20 vol% S-AgNW/PDMS composites is ≈1.3 times that of the 20 vol% R-AgNW/PDMS composites, which reduces the temperature of a full-stressed central processing unit by 6.8 °C compared to that using the 20 vol% R-AgNW/PDMS composites as a thermally conductive material in the central processing unit.

Lateral Heterostructure Formed by Highly Thermally Conductive Fluorinated Graphene for Efficient Device Thermal Management

The continued miniaturization of chips demands highly thermally conductive materials and effective thermal management strategies. Particularly, the high-field transport of the devices built with 2D materials is limited by self-heating. Here a systematic control of heat flow in single-side fluorinated graphene (FG) with varying degrees of fluorination is reported, revealing a superior room-temperature thermal conductivity as high as 128 W m-1 K-1. Monolayer graphene/FG lateral heterostructures with seamless junctions are approached for device fabrication. Efficient in-plane heat removal paths from graphene channel to side FG are created, contributing significant reduction of the channel peak temperature and improvement in the current-carrying capability and power density. Molecular dynamics simulations indicate that the interfacial thermal conductance of the heterostructure is facilitated by the high degree of overlap in the phonon vibrational spectra. The findings offer novel design insights for efficient heat dissipation in micro- and nanoelectronic devices.

Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction

Adhesion ability and interfacial thermal transfer capacity at soft/hard interfaces are of critical importance to a wide variety of applications, ranging from electronic packaging and soft electronics to batteries. However, these two properties are difficult to obtain simultaneously due to their conflicting nature at soft/hard interfaces. Herein, we report a polyurethane/silicon interface with both high adhesion energy (13535 J m-2) and low thermal interfacial resistance (0.89 × 10-6 m2 K W-1) by regulating hydrogen interactions at the interface. This is achieved by introducing a soybean-oil-based epoxy cross-linker, which can destroy the hydrogen bonds in polyurethane networks and meanwhile can promote the formation of hydrogen bonds at the polyurethane/silicon interface. This study provides a comprehensive understanding of enhancing adhesion energy and reducing interfacial thermal resistance at soft/hard interfaces, which offers a promising perspective to tailor interfacial properties in various material systems.

Regulatable Orthotropic 3D Hybrid Continuous Carbon Networks for Efficient Bi-Directional Thermal Conduction

Vertically oriented carbon structures constructed from low-dimensional carbon materials are ideal frameworks for high-performance thermal interface materials (TIMs). However, improving the interfacial heat-transfer efficiency of vertically oriented carbon structures is a challenging task. Herein, an orthotropic three-dimensional (3D) hybrid carbon network (VSCG) is fabricated by depositing vertically aligned carbon nanotubes (VACNTs) on the surface of a horizontally oriented graphene film (HOGF). The interfacial interaction between the VACNTs and HOGF is then optimized through an annealing strategy. After regulating the orientation structure of the VACNTs and filling the VSCG with polydimethylsiloxane (PDMS), VSCG/PDMS composites with excellent 3D thermal conductive properties are obtained. The highest in-plane and through-plane thermal conductivities of the composites are 113.61 and 24.37 W m-1 K-1, respectively. The high contact area of HOGF and good compressibility of VACNTs imbue the VSCG/PDMS composite with low thermal resistance. In addition, the interfacial heat-transfer efficiency of VSCG/PDMS composite in the TIM performance was improved by 71.3% compared to that of a state-of-the-art thermal pad. This new structural design can potentially realize high-performance TIMs that meet the need for high thermal conductivity and low contact thermal resistance in interfacial heat-transfer processes.

Developing conductive hydrogels for biomedical applications

Conductive hydrogels have attracted copious attention owing to their grateful performances, such as similarity to biological tissues, compliance, conductivity and biocompatibility. A diversity of conductive hydrogels have been developed and showed versatile potentials in biomedical applications. In this review, we highlight the recent advances in conductive hydrogels, involving the various types and functionalities of conductive hydrogels as well as their applications in biomedical fields. Furthermore, the current challenges and the reasonable outlook of conductive hydrogels are also given. It is expected that this review will provide potential guidance for the advancement of next-generation conductive hydrogels.

Patterned liquid metal embedded in brush-shaped polymers for dynamic thermal management

Interface thermal resistance has become a crucial barrier to effective thermal management in high-performance electronics and sensors. The growing complexity of operational conditions, such as irregular and dynamic surfaces, demands thermal interface materials (TIMs) to possess high thermal conductivity and soft elasticity. However, developing materials that simultaneously combine soft elasticity and high thermal conductivity remains a challenging task. Herein, we utilize a vertically oriented graphene aerogel (VGA) and rationally design liquid metal (LM) networks to achieve directional and adjustable pathways within the composite. Subsequently, we leverage the advantages of the low elastic modulus and high deformation capabilities of brush-shaped polydimethylsiloxane (BPDMS), together with the bicontinuous thermal conduction path constructed by VGA and LM networks. Ultimately, the designed composite of patterned liquid metal/vertically oriented graphene aerogel/brush-shaped PDMS (LM-VGA/BPDMS) shows a high thermal conductivity (7.11 W m-1 K-1), an ultra-low elastic modulus (10.13 kPa), excellent resilience, and a low interface thermal resistance (14.1 K mm2 W-1). This LM-VGA/BPDMS soft composite showcases a stable heat dissipation capability at dynamically changing interfaces, as well as excellent adaptability to different irregular surfaces. This strategy holds important application prospects in the fields of interface thermal management and thermal sensing in extremely complex environments.

Application and Development of Smart Thermally Conductive Fiber Materials

In recent years, with the rapid advancement in various high-tech technologies, efficient heat dissipation has become a key issue restricting the further development of high-power-density electronic devices and components. Concurrently, the demand for thermal comfort has increased; making effective personal thermal management a current research hotspot. There is a growing demand for thermally conductive materials that are diversified and specific. Therefore, smart thermally conductive fiber materials characterized by their high thermal conductivity and smart response properties have gained increasing attention. This review provides a comprehensive overview of emerging materials and approaches in the development of smart thermally conductive fiber materials. It categorizes them into composite thermally conductive fibers filled with high thermal conductivity fillers, electrically heated thermally conductive fiber materials, thermally radiative thermally conductive fiber materials, and phase change thermally conductive fiber materials. Finally, the challenges and opportunities faced by smart thermally conductive fiber materials are discussed and prospects for their future development are presented.

Constructing Hierarchical Polymer Nanocomposites with Strongly Enhanced Thermal Conductivity

The rapid advancement of communication technology has substantially increased the demand for advanced electronic packaging materials with high thermal conductivity and outstanding electrical insulation properties. In this study, we design polyvinyl alcohol/polydopamine-modified boron nitride nanosheet (PVA/BNNS@PDA) nanocomposites with hierarchical structures by combining electrospinning, vacuum filtration deposition, and hot pressing. The modified BNNS@PDA improves the interaction between the filler and the polymer matrix while reducing the interfacial thermal resistance, resulting in superior thermal conductivity, excellent insulation, and perfect flexibility. The PVA/BNNS@PDA nanocomposites possess an ultrahigh in-plane thermal conductivity of 16.6 W/(m·K) at 35.54 wt % BNNS@PDA content. Even after 2000 folds, the nanocomposites do not undergo any crack, showing their ultrahigh thermal conductivity behavior. Furthermore, the nanocomposites exhibit a volume resistivity above 1014 Ω·cm, which is well above the standard for insulating materials. Based on these results, this work provides a novel method to produce nanocomposites with high thermal conductivity, offering a new perspective to design advanced thermal management materials.

Stretchable and Self-Adhesive Humidity-Sensing Patch for Multiplexed Non-Contact Sensing

The slippage of moisture-sensitive materials from substrates during bending or stretching is a common issue that causes baseline drift and even failure of the flexible humidity sensors, which are essential components of wearable electronic devices. In this study, we report a stretchable, self-adhesive, and transparent humidity-sensing electronic patch comprising liquid metal particle electrodes with a stretchable serpentine structure and a humidity-sensing layer made of Ti3C2Tx MXene/carboxymethyl cellulose. This patch is constructed on a soft-hard integrated heterostructure substrate and demonstrates stable humidity-sensitive response performance at 100% tensile strain, along with autonomous adhesion to human skin. Additionally, it exhibits maximum response (1145.4%) at 90% relative humidity (RH), fast response and recovery time (1.4/5.9 s), elevated sensitivity (64.63%/% RH), and preserved humidity sensing under deformation, as well as easy scalability for multiplexed detection. We further illustrate the patch's potential applications in healthcare and environmental monitoring through a non-contact security door control system and wind monitor system. Our proposed strain-isolation strategy can be extended to other rigid conductive materials and stretchable substrates, providing a feasible mechanism for producing stretchable electronic skin patches.

Advances and mechanisms in polymer composites toward thermal conduction and electromagnetic wave absorption

Polymer composites have essential applications in electronics due to their versatility, stable performance, and processability. However, with the increasing miniaturization and high power of electronics in the 5G era, there are significant challenges related to heat accumulation and electromagnetic wave (EMW) radiation in narrow spaces. Traditional solutions involve using either thermally conductive or EMW absorbing polymer composites, but these fail to meet the demand for multi-functional integrated materials in electronics. Therefore, designing thermal conduction and EMW absorption integrated polymer composites has become essential to solve the problems of heat accumulation and electromagnetic pollution in electronics and adapt to its development trend. Researchers have developed different approaches to fabricate thermal conduction and EMW absorption integrated polymer composites, including integrating functional fillers with both thermal conduction and EMW absorption functions and innovating processing methods. This review summarizes the latest research progress, factors that affect performance, and the mechanisms of thermal conduction and EMW absorption integrated polymer composites. The review also discusses problems that limit the development of these composites and potential solutions and development directions. The aim of this review is to provide references for the development of thermal conduction and EMW absorption integrated polymer composites.

The Synergy of Hydrogen Bond and Entanglement of Elastomer Captures Unprecedented Flaw Insensitivity Rate

Elastomers are regarded as one of the best candidates for the matrix material of soft electronics, yet they are susceptible to fracture due to the inevitable flaws generated during applications. Introducing microstructures, sacrificial bonds, and sliding cross-linking has been recognized as an effective way to improve the flaw insensitivity rate (R_insen ). However, these elastomers still prone to failure under tensile loads with the presence of even small flaws. Here, this work reports a polybutadiene elastomer with unprecedented R_insen via the synergy of hydrogen bond and entanglement. The resulting polybutadiene elastomer exhibits a R_insen  ≈1.075, which is much higher than those of reported elastomers. By molecular chain interaction and molecular chain conformation analysis, this work demonstrates that the synergistic effect of hydrogen bond dissociation and entanglement slip in the polybutadiene elastomers during stretching leads to the high R_insen . Using polybutadiene elastomer as matrix of thermal interface materials, this work demonstrates effective heat transfer for strain sensor and electronic devices. In addition, cytocompatibility of the elastomers is verified by cell proliferation and live/dead viability assays. The combination of outstanding biocompatible and excellent mechanical properties of the elastomers creates new opportunities for their applications in electronic skin.

Tailoring Dense, Orientation-Tunable, and Interleavedly Structured Carbon-Based Heat Dissipation Plates

The controllability of the microstructure of a compressed hierarchical building block is essential for optimizing a variety of performance parameters, such as thermal management. However, owing to the strong orientation effect during compression molding, optimizing the alignment of materials perpendicular to the direction of pressure is challenging. Herein, to illustrate the effect of the ordered microstructure on heat dissipation, thermally conductive carbon-based materials are fabricated by tailoring dense, orientation-tunable, and interleaved structures. Vertically aligned carbon nanotube arrays (VACNTs) interconnected with graphene films (GF) are prepared as a 3D core-ordered material to fabricate compressed building blocks of O-VA-GF and S-VA-GF. Leveraging the densified interleaved structure offered by VACNTs, the hierarchical O-VA-GF achieves excellent through-plane (41.7 W m^-1 K^-1 ) and in-plane (397.9 W m^-1 K^-1 ) thermal conductivities, outperforming similar composites of S-VA-GF (through-plane: 10.3 W m^-1 K^-1 and in-plane: 240.9 W m^-1 K^-1 ) with horizontally collapsed carbon nanotubes. As heat dissipation plates, these orderly assembled composites yield a 144% and 44% enhancement in the cooling coefficient compared with conventional Si₃ N₄ for cooling high-power light-emitting diode chips.

Flexible, Highly Thermally Conductive and Electrically Insulating Phase Change Materials for Advanced Thermal Management of 5G Base Stations and Thermoelectric Generators

Thermal management has become a crucial problem for high-power-density equipment and devices. Phase change materials (PCMs) have great prospects in thermal management applications because of their large capacity of heat storage and isothermal behavior during phase transition. However, low intrinsic thermal conductivity, ease of leakage, and lack of flexibility severely limit their applications. Solving one of these problems often comes at the expense of other performance of the PCMs. In this work, we report core-sheath structured phase change nanocomposites (PCNs) with an aligned and interconnected boron nitride nanosheet network by combining coaxial electrospinning, electrostatic spraying, and hot-pressing. The advanced PCN films exhibit an ultrahigh thermal conductivity of 28.3 W m-1 K-1 at a low BNNS loading (i.e., 32 wt%), which thereby endows the PCNs with high enthalpy (> 101 J g-1), outstanding ductility (> 40%) and improved fire retardancy. Therefore, our core-sheath strategies successfully balance the trade-off between thermal conductivity, flexibility, and phase change enthalpy of PCMs. Further, the PCNs provide powerful cooling solutions on 5G base station chips and thermoelectric generators, displaying promising thermal management applications on high-power-density equipment and thermoelectric conversion devices.