1
|
Xu L, Zhou X, Zhao F, Fu Y, Tang L, Zeng Y, Chen G, Wu C, Wang L, Chen Q, Yang K, Sun D, Hai Z. Rapid laser fabrication of indium tin oxide and polymer-derived ceramic composite thin films for high-temperature sensors. J Colloid Interface Sci 2024; 658:913-922. [PMID: 38157615 DOI: 10.1016/j.jcis.2023.12.119] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/24/2023] [Revised: 11/29/2023] [Accepted: 12/19/2023] [Indexed: 01/03/2024]
Abstract
Thin-film sensors are essential for real-time monitoring of components in high-temperature environments. Traditional fabrication methods often involve complicated fabrication steps or require prolonged high-temperature annealing, limiting their practical applicability. Here, we present an approach using direct ink writing and laser scanning (DIW-LS) to fabricate high-temperature functional thin films. An indium tin oxide (ITO)/preceramic polymer (PP) ink suitable for DIW was developed. Under LS, the ITO/PP thin film shrank in volume. Meanwhile, the rapid pyrolysis of PP into amorphous precursor-derived ceramic (PDC) facilitated the faster sintering of ITO nanoparticles and improved the densification of the thin film. This process realized the formation of a conductive network of interconnected ITO nanoparticles. The results show that the ITO/PDC thin film exhibits excellent stability, with a drift rate of 4.7 % at 1000 °C for 25 h, and withstands temperatures up to 1250 °C in the ambient atmosphere. It is also sensitive to strain, with a maximum gauge factor of -6.0. As a proof of concept, we have used DIW-LS technology to fabricate a thin-film heat flux sensor on the surface of the turbine blade, capable of measuring heat flux densities over 1 MW/m2. This DIW-LS process provides a viable approach for the integrated, rapid, and flexible fabrication of thin film sensors for harsh environments.
Collapse
Affiliation(s)
- Lida Xu
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Xiong Zhou
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Fuxin Zhao
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Yanzhang Fu
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Lantian Tang
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Yingjun Zeng
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Guochun Chen
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Chao Wu
- Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Lingyun Wang
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Qinnan Chen
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China
| | - Kai Yang
- China Aerodynamics Research and Development Center, Mianyang 621000, China.
| | - Daoheng Sun
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China.
| | - Zhenyin Hai
- Discipline of Intelligent Instrument and Equipment, Xiamen University, Xiamen 361102, China; Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361102, China; Fujian Micro/nano Manufacturing Engineering Technology Research Center, Xiamen University, Xiamen 361102, China.
| |
Collapse
|