Curing of epoxy siloxane monomer with anhydride

Phase separation of ternary epoxy/PEI blends with higher molecular weight of tertiary component polysiloxane

A tertiary component with higher molecular weight of epoxy terminated polysiloxane (DMS-E11) was incorporated into the diglycidyl ether of bisphenol-A (DGEBA)/thermoplastic polyetherimide (PEI) blends. In this ternary DGEBA/PEI/DMS-E11 system, 25 or 30 wt% PEI and no more than 20 wt% DMS-E11 were used to ensure the formation of a continuous PEI-rich phase via reaction induced phase separation for optimum mechanical properties of blends. The results of morphology monitoring by OM and TRLS indicated that the addition of DMS-E11 could accelerate phase separation of DGEBA/PEI. Obvious differences were observed by SEM/EDS in the final morphologies of the blends. DMS-E11 localized in the PEI-rich phase continuously while it separated with DGEBA into spherical particles in the DGEBA-rich phase. DMA measurements found that the storage modulus and T_g decreased with DMS-E11 content but were compensated partly by the presence of PEI. The results of tensile tests confirmed the synergistic strengthening for epoxy resin from PEI and DMS-E11.

Effect of higher molecular weight epoxy-terminated polysiloxane DMS-E11 on morphologies and properties of DGEBA/PEI blends.

Novel Siloxane-Modified Epoxy Resins as Promising Encapsulant for LEDs

This study investigated a new category of transparent encapsulant materials for light-emitting diodes (LEDs). It comprised a phenyl group that contained siloxane-modified epoxy (SEP-Ph) hybridized with a cyclic tetrafunctional siloxane-modified epoxy (SEP-D4) with methylhexahydrophthalic anhydride (MHHPA) as a curing agent. The SEP-Ph/SEP-D4 = 0.5/0.5 (sample 3) and SEP-D4 (sample 4) could provide notably high optical transmittance (over 90% in the visible region), high-temperature discoloration resistance, low stress, and more crucially, noteworthy sulfurization resistance. The lumen flux retention of the SEP encapsulated surface mounted device LEDs remained between approximately 97% and 99% after a sulfurization test for 240 h. The obtained comprehensive optical, mechanical, and sulfurization resistance proved the validity and uniqueness of the present design concept with complementary physical and chemical characteristics.