Synthesis and characterization of organosoluble polyfluorinated polyimides derived from 3,3′,5,5′-tetrafluoro-4,4′-diaminodiphenylmethane and various aromatic dianhydrides

Fluorinated Polyimide-Film Based Temperature and Humidity Sensor Utilizing Fiber Bragg Grating

We propose and demonstrate a temperature and humidity sensor based on a fluorinated polyimide film and fiber Bragg grating. Moisture-induced film expansion or contraction causes an extra strain, which is transferred to the fiber Bragg grating and leads to a humidity-dependent wavelength shift. The hydrophobic fluoride doping in the polyimide film helps to restrain its humidity hysteresis and provides a short moisture breathing time less than 2 min. Additionally, another cascaded fiber Bragg grating is used to exclude its thermal crosstalk, with a temperature accuracy of ±0.5 °C. Experimental monitoring over 9000 min revealed a considerable humidity accuracy better than ±3% relative humidity, due to the sensitized separate film-grating structure. The passive and electromagnetic immune sensor proved itself in field tests and could have sensing applications in the electro-sensitive storage of fuel, explosives, and chemicals.

A high-performance functional phthalonitrile resin with a low melting point and a low dielectric constant

A monomer of fluorinated phthalonitrile, namely 4,4'-bis(p-perfluoro-phenol-(bis(p-phenol)propane-2,2-diyl)-p-oxy-diphthalonitrile) (PBDP), was synthesized by the nucleophilic substitution reaction of bisphenol A, decafluorobiphenyl and 4-nitrophthalonitrile. The structure of the monomer was characterized by nuclear magnetic resonance (NMR) spectroscopy and Fourier transform infrared (FTIR) spectroscopy. The results indicated that the PBDP monomer was synthesized successfully. The monomer was cured in the presence of 4-(aminophenoxy)phthalonitrile (APPH) and the curing behaviour was investigated by differential scanning calorimetry (DSC), suggesting a low melting point of 96 °C and an excellent processing window (96-262 °C). Thermogravimetric analysis (TGA) and dynamic mechanical analysis (DMA) showed that the fluorinated phthalonitrile resin possessed outstanding thermal and thermo-oxidative stabilities as well as good mechanical properties. The glass transition temperature was >400 °C and the 5% thermal degradation temperature was 501 °C. When the frequency was 50 MHz, the dielectric constant and dielectric loss of the polymer were 2.84 and 0.007, respectively. The PBDP resin has ultra-low water absorption of 0.77% and 1.4%, when exposed to an aqueous environment for 50 days at 24 °C and for 24 h at 100 °C, respectively. The prepared PBDP resin with outstanding thermal stability and low dielectric constant is an ideal candidate for aerospace industries, and microelectronic and other electronic packaging materials.

Synthesis and characterization of low-CTE polyimide films containing trifluoromethyl groups with water-repellant characteristics

A novel fluorinated ester-bridged aromatic diamine, bis(2-trifluoromethyl-4-aminophenyl)terephthalate (CF3-BPTP) was synthesized, which was employed to prepare a series of fluorinated ester-bridged polyimide (PFEI) films with controlled ester-bridged segments and fluorine contents in the polymer backbone. The PFEI films were prepared by copolymerization of biphenyl tetracarboxylic dianhydride as aromatic dianhydride monomer and the aromatic diamine monomer mixture consisting of p-phenylenediamine and different amounts of CF3-BPTP. Experimental results indicated that the films’ water uptakes (Wus) reduced with increasing of the CF3 groups loadings in the ester-bridged polyimide backbones while keeping the films with low enough coefficient of thermal expansion (CTE). By controlling CF3 group loadings, polyimide films with desirable combination of thermal, mechanical, and dielectric properties for application in high density and thinner flexible printed circuits (FPCs) have been obtained. Thus, polyimide films with CTE of ≤20 × 10−6 1/K (ppm/K) at 50–200°C, glass transition temperature of ≥310°C, Young’s modulus of ≥6.0 GPa, Wu of as low as 0.7 wt%, dielectric constant ( ε) of 3.3 have been obtained. The two-layer flexible copper clad laminate prepared by coating the polyimide precursor resin poly(amid acid) solution on the surface of copper foil followed by thermal imidization at elevated temperature did not show apparent curling due to its closed CTE value.

High organosolubility of novel asymmetric polyimides-containing benzimidazole rings

Two tetramethyl-substituted diphenylmethane diamines, α,α-bis(4-amino-3,5-dimethylphenyl) phenylmethane (BADP) and 3,3′,5,5′-tetramethyl-4,4′-diaminodiphenylmethane (TMDA), were synthesized. Two series of novel soluble polyimides (PIs) with high glass transition temperature ( Tg) were derived from 3,3′4,4′-benzophenone tetracarboxylic dianhydride with 6,4′-diamino-2-phenylbenzimidazole and BADP (or TMDA) via one-pot synthesis using anhydrous N-methyl-2-pyrrolidone as a solvent. Precipitation or gelation does not occur during polymerization and imidization, and the resulting products dissolve well in polar aprotic solvents and phenolic solvents. The two series of PI films have good transparency in the visible light region, with a cutoff wavelength at 365 nm and higher than 50% of the transmittance at 450 nm. Tgs are in the range of 381–431°C, and 10% weight loss in nitrogen occurs above 530°C in all cases. Upon increasing BADP (or TMDA) moieties content, the Tg values decrease, whereas the thermal stability tends to increase. Moreover, the PIs-containing TMDA units have a higher thermal stability than those containing BADP units.

Epoxy resin containing trifluoromethyl and pendant polyfluorinated phenyl groups: Synthesis and properties

A novel epoxy resin containing trifluoromethyl and pendant polyfluorinted phenyl groups, 1,1-bis[4-(2,3-epoxypropoxy)phenyl]-1-(3,4,5-trifluorophenyl) -2,2,2-trifluoroethane (6FEP) was synthesized and characterized. The reactivtiy of 6FEP with two aromatic diamines, 4,4′-diaminodiphenyl methane (DDM) and 1,4-bis(4-amino-2-trifluoromethylphenoxy) benzene (6FAPB), and the properties of the cured 6FEP were investigated and compared with those of the commonly used epoxy resin diglycidyl ether of bisphenol A (DGEBA). The experimental results indicated that 6FEP showed lower reactivity than DGEBA. The cured 6FEP exhibited good thermal stabilities with decomposition temperature at 5% weight loss of 374–397°C, high glass transition temperature of 159–177°C and good mechanical properties. The cured 6FEP epoxy resin also showed low dielectric constants at 1 MHz in the range of 3.2–3.4 and dielectric dissipation factors (tan δ) in the range of 2.10–2.48 × 10−3. Moreover, the cured 6FEP epoxy resins exhibited higher surface hydrophobicity and lower moisture absorption compared with DGEBA. The improved dielectric properties and hydrophobic properties of the cured 6FEP epoxy resin could be attributed to the introduction of trifluoromethyl and pendant polyfluorinated phenyl groups into the molecular structure of the epoxy resin.

Dendronized polyimides bearing long-chain alkyl groups and their application for vertically aligned nematic liquid crystal displays

Polyimides having dendritic side chains were investigated. The terphenylene diamine monomer having a first-generation monodendron, 3,4,5-tris(n-dodecyloxy)-benzoate and the monomer having a second-generation monodendron, 3,4,5-tris[-3’,4’,5’-tri(n-dodecyloxy)benzyloxy]benzoate were successfully synthesized and the corresponding soluble dendritic polyimides were obtained by polycondensation with conventional tetracarboxylic dianhydride monomers such as benzophenone tertracarboxylic dianhydride (BTDA). The two-step polymerizations in NMP that is a general method for the synthesis of soluble polyimides is difficult; however, the expected dendritic polyimides can be obtained in aromatic polar solvents such as m-cresol and pyridine. The solubility of these dendoronized polyimides is characteristic; soluble in common organic solvents such as dichloromethane, chloroform, toluene and THF. These dendronized polyimides exhibited high glass transition temperatures and good thermal stability in both air and under nitrogen. Their application as alignment layers for LCDs was investigated, and it was found that these polyimides having dendritic side chains were applicable for the vertically aligned nematic liquid crystal displays (VAN-LCDs).