A reactive polymer for toughening epoxy resin

Study on the Synthesis and Properties of Waterborne Polyurea Modified by Epoxy Resin

The most notable features of polyurea are its fast reaction, energy-saving and high efficiency. In order to meet the needs of environmental protection, waterborne polyurea (WPUA) has become a research hotspot. However, the presence of hydrophilic groups in WPUA reduces its solvent resistance, heat resistance and mechanical properties. Therefore, it is necessary and valuable to develop a high-performance WPUA. In this study, epoxy-modified waterborne polyurea (WPUAE) emulsions were prepared using epoxy resin as a modifier. Fourier transform infrared spectroscopy (FT-IR) showed that E44 was successfully introduced into the molecular chain of WPUA. The WPUAE was tested for gel fraction, adhesion, contact angle, solvent resistance, tensile properties and thermal stability. The results showed that when the E44 content was 8 wt%, the performance of WPUAE was best, the adhesion of WPUAE coating film was 1.53 MPa, the gel fraction, water contact angle, water absorption, toluene absorption, tensile strength and decomposition temperature were 96.94%, 70.3°, 16.43%, 131.04%, 9.05 MPa and 365 °C, respectively. The results showed that epoxy resin as an emulsion modifier improved the comprehensive properties of WPUA.

A facile approach to the scalable preparation of thermoplastic/carbon nanotube composites

Disentangling and dispersing multiwalled carbon nanotubes (MWCNTs) in thermoplastics by the existing melt compounding facilities where neither solvent nor liquid chemicals are allowed remains a great challenge. This challenge is addressed herein by combining ball milling with melt compounding. Specifically, ball milling is applied to disentangle MWCNTs and to eventually liberate each tube from agglomeration, and then the tubes are melt compounded with SSFs (PA6). A uniformly distributed MWCNT network is observed; obvious load transfer from the matrix to the tubes is evidenced by the presence of many firmly embedded tubes on the fracture surface. The electrical conductivity percolation threshold of PA6/MWCNT composites is found to be 2.5-3.0 wt%, in comparison with 5.0-8.0 wt% for PA6/stainless steel fiber composites. The PA6/MWCNT composite at 10.0 wt% shows a 76% increase in flexural modulus and 58% in flexural strength.

Thermally and electrically conductive multifunctional sensor based on epoxy/graphene composite

Flexible electronics is expected to be one of the most active research areas in the next decade. In this study, a mechanically strong and flexible epoxy/GnP composite film was fabricated having a percolation threshold of electrical conductivity at 1.08 vol% GnPs and high thermal conductivity as 1.07 W m^-1 K^-1 at 10 vol% GnPs. The composite film shows high mechanical performance: Young's modulus and tensile strength were improved by 1344% and 66.7%, respectively, at 10 vol%. The film demonstrated high sensitivity to various mechanical loads: (i) it has gauge factors of 2 at strain range 0%-7% and 6 at range 7%-10%; (ii) it gives good electrical response with bending and twisting angles up to 180°; and (iii) it displays a good compressive load response up to 2 N where the absolute value of electrical resistance change increased by 71%. Furthermore, the film showed an excellent reliability up to 5.5 × 10³ cycles with minor zero-point error. Above 20 °C, the film solely acts as a temperature sensor; upon cyclic temperature testing, the film demonstrated a stable resistive response in the range of 30-75 °C with a temperature sensitivity coefficient of 0.0063 °C^-1. This flexible composite film has remarkable properties that enable it to be used as a full-fledged sensor for universal applications in aerospace, automotive and civil engineering.

Epoxy/graphene oxide/liquid polysulfide ternary nano-composites: rheological, thermal and mechanical, characterization

Despite its functionality, one major drawback associated with cured epoxy resin is its brittle nature.

Processable 3-nm thick graphene platelets of high electrical conductivity and their epoxy composites

Graphene platelets (GnPs) are a class of novel 2D nanomaterials owing to their very small thickness (∼3 nm), high mechanical strength and electric conductivity (1460 S cm(-1)), and good compatibility with most polymers as well as cost-effectiveness. In this paper we present a low-cost processing technique for producing modified GnPs and an investigation of the electrical and mechanical properties of the resulting composites. After dispersing GnPs in solvent N-methyl-2-pyrrolidone, a long-chain surfactant (Jeffamine D 2000, denoted J2000) was added to covalently modify GnPs, yielding J2000-GnPs. By adjusting the ratio of GnPs to the solvent, the modified GnPs show different average thickness and thus electrical conductivity ranging from 694 to 1200 S cm(-1). To promote the exfoliation and dispersion of J2000-GnPs in a polymeric matrix, they were dispersed in the solvent again and further modified using diglycidyl ether of bisphenol A (DGEBA) producing m-GnPs, which were then compounded with an epoxy resin for the development of epoxy/m-GnP composites. A percolation threshold of electrical volume resistivity for the resulting composites was observed at 0.31 vol%. It was found that epoxy/m-GnP composites demonstrated far better mechanical properties than those of unmodified GnPs of the same volume fraction. For example, m-GnPs at 0.25 vol% increased the fracture energy release rate G1c from 0.204 ± 0.03 to 1.422 ± 0.24 kJ m(-2), while the same fraction of unmodified GnPs increased G1c to 1.01 ± 0.24 kJ m(-2). The interface modification also enhanced the glass transition temperature of neat epoxy from 58.9 to 73.8 °C.

Melt compounding with graphene to develop functional, high-performance elastomers

Rather than using graphene oxide, which is limited by a high defect concentration and cost due to oxidation and reduction, we adopted cost-effective, 3.56 nm thick graphene platelets (GnPs) of high structural integrity to melt compound with an elastomer-ethylene-propylene-diene monomer rubber (EPDM)-using an industrial facility. An elastomer is an amorphous, chemically crosslinked polymer generally having rather low modulus and fracture strength but high fracture strain in comparison with other materials; and upon removal of loading, it is able to return to its original geometry, immediately and completely. It was found that most GnPs dispersed uniformly in the elastomer matrix, although some did form clusters. A percolation threshold of electrical conductivity at 18 vol% GnPs was observed and the elastomer thermal conductivity increased by 417% at 45 vol% GnPs. The modulus and tensile strength increased by 710% and 404% at 26.7 vol% GnPs, respectively. The modulus improvement agrees well with the Guth and Halpin-Tsai models. The reinforcing effect of GnPs was compared with silicate layers and carbon nanotube. Our simple fabrication would prolong the service life of elastomeric products used in dynamic loading, thus reducing thermosetting waste in the environment.

From carbon nanotubes and silicate layers to graphene platelets for polymer nanocomposites

In spite of extensive studies conducted on carbon nanotubes and silicate layers for their polymer-based nanocomposites, the rise of graphene now provides a more promising candidate due to its exceptionally high mechanical performance and electrical and thermal conductivities. The present study developed a facile approach to fabricate epoxy-graphene nanocomposites by thermally expanding a commercial product followed by ultrasonication and solution-compounding with epoxy, and investigated their morphologies, mechanical properties, electrical conductivity and thermal mechanical behaviour. Graphene platelets (GnPs) of 3.57 ± 0.50 nm in thickness were created after the expanded product was dispersed in tetrahydrofuran using 60 min ultrasonication. Since epoxy resins cured by various hardeners are widely used in industries, we chose two common hardeners: polyoxypropylene (J230) and 4,4'-diaminodiphenylsulfone (DDS). DDS-cured nanocomposites showed a better dispersion and exfoliation of GnPs, a higher improvement (573%) in fracture energy release rate and a lower percolation threshold (0.612 vol%) for electrical conductivity, because DDS contains benzene groups which create π-π interactions with GnPs promoting a higher degree of dispersion and exfoliation of GnPs during curing. This research pointed out a potential trend where GnPs would replace carbon nanotubes and silicate layers for many applications of polymer nanocomposites.