High-Thermal Stable Epoxy Resin through Blending Nanoarchitectonics with Double-Decker-Shaped Polyhedral Silsesquioxane-Functionalized Benzoxazine Derivatives

A series of di-functional benzoxazine (BZ) monomers was synthesized, specifically the double-decker silsesquioxane (DDSQ) cage structure (DDSQ-BZ). Comparative analyses were conducted between DDSQ-BZ monomers and the most commonly utilized bisphenol A-functionalized bifunctional benzoxazine (BPA-BZ) monomer. DDSQ-BZ compounds possess better thermal properties such as high char yield and high thermal decomposition temperature (Td10) after thermal ring-opening polymerization (ROP) because the inorganic DDSQ cage nanostructure features a nano-reinforcement effect. In addition, blending inorganic DDSQ-BZ compounds with epoxy resin was explored to form organic/inorganic hybrids with enhanced thermal and mechanical properties following thermal ROP. The improvement in mechanical properties is primarily attributed to the network structure formed by the cross-linking between DDSQ-BZ and the epoxy resin during thermal ROP, as well as hydrogen bonding interactions formed between the hydroxyl groups generated during thermal ROP and the Si-O-Si bonds in the DDSQ structure.

Study on properties of copolymers based on different types of benzoxazines and branched epoxy resins

Previous studies on linear epoxy (bisphenol A epoxy) resin/benzoxazine composites showed that with the addition of epoxy (EP) resin, the resulting copolymers exhibited an increased glass transition temperature ( Tg) ( Tg reached a maximum value at a specific content), improved flexural strength, lower heat resistance, and reduced tensile strength. Herein, branched EP resin (AG-80)/benzoxazine copolymers featuring novolac (N-box) and siloxane (Si-box) chains were prepared without any external curing agent. In both systems, the EP resin endowed the copolymers with an increased crosslinking density; however, Tg continued to increase with increasing EP content. In addition, the heat resistance of the copolymers gradually enhanced. Different types of benzoxazines have various effects on the properties of copolymers. In terms of mechanical properties, AG-80/N-box copolymers exhibited brittle fracture characteristics; with increasing EP content, the flexural strength of the copolymer decreased while the tensile strength increased. AG-80/Si-box copolymers exhibited ductile fracture characteristics, with gradual increases in flexural and tensile strengths. Furthermore, with increasing EP content, the molecular chain migration ability and network homogeneity of the AG-80/N-box copolymers decreased gradually. Alternatively, in the case of the AG-80/Si-box copolymers, the molecular chain migration ability remained unchanged and network homogeneity improved. Hence, the developed copolymers can be used as resin matrices for the fabrication of advanced composites.

Double-Decker-Shaped Polyhedral Silsesquioxanes Reinforced Epoxy/Bismaleimide Hybrids Featuring High Thermal Stability

In this study, we synthesized bismaleimide into a functionalized double-decker silsesquioxane (DDSQ) cage. This was achieved by hydrosilylation of DDSQ with nadic anhydride (ND), reacting it with excess p-phenylenediamine to obtain DDSQ-ND-NH₂, and treating with maleic anhydride (MA), which finally created a DDSQ-BMI cage structure. We observed that the thermal decomposition temperature (T_d) and char yield were both increased upon increasing the thermal polymerization temperature, and that these two values were both significantly higher than pure BMI without the DDSQ cage structure since the inorganic DDSQ nanoparticle could strongly enhance the thermal stability based on the nano-reinforcement effect. Based on FTIR, TGA, and DMA analyses, it was found that blending epoxy resin with the DDSQ-BMI cage to form epoxy/DDSQ-BMI hybrids could also enhance the thermal and mechanical properties of epoxy resin due to the organic/inorganic network formation created by the ring-opening polymerization of the epoxy group and the addition polymerization of the BMI group due to the combination of the inorganic DDSQ cage structure and hydrogen bonding effect. The epoxy/DDSQ-BMI = 1/1 hybrid system displayed high T_g value (188 °C), T_d value (397 °C), and char yield (40.4 wt%), which was much higher than that of the typical DGEBA type epoxy resin with various organic curing agents.

Flexible Epoxy Resins Formed by Blending with the Diblock Copolymer PEO-b-PCL and Using a Hydrogen-Bonding Benzoxazine as the Curing Agent

In this study, we enhanced the toughness of epoxy resin by blending it with the diblock copolymer poly(ethylene oxide⁻b⁻ε-caprolactone) (PEO-b-PCL) with a benzoxazine monomer (PA-OH) as the thermal curing agent. After thermal curing, Fourier transform infrared spectroscopy revealed that intermolecular hydrogen bonding existed between the OH units of the epoxy⁻benzoxazine copolymer and the C⁻O⁻C (C=O) units of the PEO (PCL) segment. Differential scanning calorimetry and dynamic mechanical analysis revealed that the glass transition temperature and storage modulus of the epoxy⁻benzoxazine matrix decreased significantly upon increasing the concentration of PEO-b-PCL. The Kwei equation predicted a positive value of q, consistent with intermolecular hydrogen bonding in this epoxy⁻benzoxazine/PEO-b-PCL blend system. Scanning electron microscopy revealed a wormlike structure with a high aspect ratio for PEO-b-PCL as the dispersed phase in the epoxy⁻benzoxazine matrix; this structure was responsible for the improved toughness.

High-Tg, Low-Dielectric Epoxy Thermosets Derived from Methacrylate-Containing Polyimides

Three methacrylate-containing polyimides (Px⁻MMA; x = 1⁻3) were prepared from the esterification of hydroxyl-containing polyimides (Px⁻OH; x = 1⁻3) with methacrylic anhydride. Px⁻MMA exhibits active ester linkages (Ph⁻O⁻C(=O)⁻) that can react with epoxy in the presence of 4-dimethylaminopyridine (DMAP), so Px⁻MMA acted as a curing agent for a dicyclopentadiene-phenol epoxy (HP7200) to prepare epoxy thermosets (Px⁻MMA/HP7200; x = 1⁻3) thermosets. For property comparisons, P1⁻OH/HP7200 thermosets were also prepared. The reaction between active ester and epoxy results in an ester linkage, which is less polar than secondary alcohol resulting from the reaction between phenolic OH and epoxy, so P1⁻MMA/HP7200 are more hydrophobic and exhibit better dielectric properties than P1⁻OH/HP7200. The double bond of methacrylate can cure at higher temperatures, leading to epoxy thermosets with a high-Tg and moderate-to-low dielectric properties.

Polybenzoxazine/Polyhedral Oligomeric Silsesquioxane (POSS) Nanocomposites

The organic/inorganic hybrid materials from polyhedral oligomeric silsesquioxane (POSS, inorganic nanoparticles) and polybenzoxazine (PBZ) have received much interesting recently due to their excellent thermal and mechanical properties, flame retardance, low dielectric constant, well-defined inorganic framework at nanosized scale level, and higher performance relative to those of non-hybrid PBZs. This review describes the synthesis, dielectric constants, and thermal, rheological, and mechanical properties of covalently bonded mono- and multifunctionalized benzoxazine POSS hybrids, other functionalized benzoxazine POSS derivatives, and non-covalently (hydrogen) bonded benzoxazine POSS composites.