Novel acetylene-terminated polyisoimides with excellent processability and properties comparison with corresponding polyimides

Resin Transfer Moldable Fluorinated Phenylethynyl-Terminated Imide Oligomers with High Tg: Structure-Melt Stability Relationship

Phenylethynyl-terminated aromatic polyimides meet requirements of resin transfer molding (RTM) and exhibits high glass transition temperature (T_g) were prepared. Moreover, the relationship between the polyimide backbones structure and their melting stability was investigated. The phenylethynyl-terminated polyimides were based on 4,4′-(hexafluorosiopropylidene)-diphthalic anhydride (6FDA) and different diamines of 3,4′-oxydianiline (3,4′-ODA), m-phenylenediamine (m-PDA) and 2,2′-bis(trifluoromethyl)benzidine (TFDB) were prepared. These oligoimides exhibit excellent melting flowability with wide processing temperature window and low minimum melt viscosities (<1 Pa·s). Two of the oligoimides display good melting stability at 280–290 °C, which meet the requirements of resin transfer molding (RTM) process. After thermally cured, all resins show high glass transition temperatures (T_gs, 363–391 °C) and good tensile strength (51–66 MPa). The cure kinetics studied by the differential scanning calorimetry (DSC), ¹³C nuclear magnetic resonance (¹³C NMR) characterization and density functional theory (DFT) definitely confirmed that the electron-withdrawing ability of oligoimide backbone can tremendously affect the curing reactivity of terminated phenylethynyl groups. The replacement of 3,4′-ODA units by m-PDA or TFDB units increase the electron-withdrawing ability of the backbone, which increase the curing rate of terminated phenylethynyl groups at processing temperatures, hence results in the worse melting stability.

Preparation and properties of propargyl ether-terminated poly(imide siloxane)s and their composites

The novel propargyl ether-terminated oligo(imide siloxane)s (PTISs) based on 2,2’-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA), aminopropyl-terminated polydimethylsiloxane (APPS), 4,4’-diaminodiphenylmethane (MDA) and p-aminophenyl propargyl ether (APPE) were synthesized. The chemical structures of PTISs were characterized by proton nuclear magnetic resonance (1H NMR) and Fourier transform infrared spectroscopy (FTIR). The PTISs exhibited excellent solubility in organic solvent and had broad processing window. The T300 carbon fabric was used to reinforce the PTIS matrices and prepare the composites (T300CF/PTISs). The thermal stability of the cured PTISs was analyzed by thermogravimetric analysis (TGA). The dynamic thermal mechanical properties of the composites were measured by dynamic thermomechanical analysis (DMA). The results show that the temperature at 5% weight loss (Td5) and residual yield at 800°C (Yr800°C) of the cured PTISs in N2 increase with incorporation of the aromatic diamine, whereas the Yr800°C of the cured PTISs in air decreases with introduction of the aromatic diamine. The elasticity of the composite increases with incorporation of the aromatic diamine, and the peak temperature of loss factor for the composites are higher than 300°C. The flexural strength, tensile strength and interlaminar layer shear strength (ILSS) of the T300CF/PTIS composite display the values of 439 MPa, 427 MPa and 32 MPa at room temperature, respectively. The retention of the flexural strength and ILSS for the T300CF/PTIS composite are above 80% at 250°C.

Study on the Relationships between Microscopic Cross-Linked Network Structure and Properties of Cyanate Ester Self-Reinforced Composites

Bisphenol A dicyanate (BADCy) resin microparticles were prepared by precipitation polymerization synthesis and were homogeneously dispersed in a BADCy prepolymer matrix to prepare a BADCy self-reinforced composites. The active functional groups of the BADCy resin microparticles were characterized by Fourier transform infrared (FT-IR) spectroscopy. The results of an FT-IR curve showed that the BADCy resin microparticles had a triazine ring functional group and also had an active reactive group -OCN, which can initiate a reaction with the matrix. The structure of the BADCy resin microparticles was characterized by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). From the TEM results, the BADCy resin microparticles dispersed in the solvent were nano-sized and distributed at 40-60 nm. However, from the SEM results, agglomeration occurred after drying, the BADCy resin particels were micron-sized and distributed between 0.3 μm and 0.6 μm. The BADCy resin prepolymer was synthesized in our laboratory. A BADCy self-reinforced composite was prepared by using BADCy resin microparticles as a reinforcement phase. This corresponds to a composite in which the matrix and reinforcement phase are made from different morphologies of the same monomer. The DSC curve showed that the heat flow of the microparticles is different from the matrix during the curing reaction, this means the cured materials should be a microscopic two-phase structure. The added BADCy resin microparticles as reaction sites induced the formation of a more complete and regular cured polymer structure, optimizing the cross-linked network as well as increasing the interplay between the BADCy resin microparticles and prepolymer matrix. Relative to the neat BADCy resin material, the tensile strength, flexural strength, compressive strength and impact strength increased by 98.1%, 40.2%, 27.4%, and 85.4%, respectively. A particle toughening mechanism can be used to explain the improvement of toughness. The reduction in the dielectric constant showed that the cross-linked network of the self-reinforced composite was more symmetrical and less polar than the neat resin material, which supports the enhanced mechanical properties of the self-reinforced composite. In addition, the thermal behavior of the self-reinforced composite was characterized by thermogravimetric analysis (TGA) and dynamic mechanical thermal analysis (DMTA). The results of DMTA also establishes a basis for enhancing mechanical properties of the self-reinforced composite.

Synthesis, characterization, and properties of thermoplastic polyimides derived from 4,4’-(hexafluoroisopropylidene)diphthalic anhydride in diethylene glycol dimethyl ether

By regulating the order of monomer addition, four kinds of copolymer polyimides (PIs) were prepared using diethylene glycol dimethyl ether (DEGDE) and N, N-dimethylacetamide (DMAc) as the solvents. The molecular weights of polyamide acids (PAAs) ranged from 3.8 × 105 to 9.2 × 105. All of the films displayed high glass transition temperatures ( Tgs) ranging from 313°C to 346°C. The polymer films show excellent thermal stabilities with 5% weight loss at temperatures of 505–524°C and char yields at 800°C were as high as 55% under nitrogen. The peel strengths of flexible copper (Cu) clads were in the range from 0.337 N cm−1 to 0.598 N cm−1. Compared to the molecular weight and peel strength of fresh PAA, those of PAAs prepared using DMAc significantly decreased after storage for 3 months at 0°C. However, when DEGDE was used as the solvent, the molecular weights of the PAAs and the thermal properties of the PIs were maintained after long storage time.

Synthesis and characterization of hyperbranched polyether imides based on 1,3,5-tris[4-(4′-aminophenoxy)phenoxy]benzene

A new triamine monomer 1,3,5-tris[4-(4′-aminophenoxy)phenoxy]benzene, was synthesized by a three step process using hydroquinone, 1-chloro-4-nitrobenzene and 1,3,5-trichlorobenzene.

Transient color changes in oxidative-stable fluorinated polyimide film for flexible display substrates

Stable optical properties of high transmittance and low yellow index, which are required for a polyimide film as a flexible display substrate could be affected by thermal imidization even in oxidative-stable fluorinated polyimides.

Thermosetting polyimides and composites based on highly soluble phenylethynyl-terminated isoimide oligomers

Highly soluble phenylethynyl-terminated isoimide oligomers were investigated as matrix resins which can produce high performance thermosetting polyimides and composites.