Binary Silanization and Silver Nanoparticle Encapsulation to Create Superhydrophobic Cotton Fabrics with Antimicrobial Capability

Cotton fabrics are functionalized with a binary solution of fluorine-free organosilanes and "encapsulated" with silver nanoparticles to achieve both superhydrophobic and antimicrobial properties. Derived from cellulose, cotton is one of the most abundant biologically generated materials and has been used in a wide variety of consumer goods. Nonetheless, cotton fabrics are not waterproof and prone to microbial contamination. Herein we report the rapid functionalization of cotton fabrics with a binary hexane solution of methyltrichlorosilane (MTS) and octadecyltrichlorosilane (OTS) at low concentration (0.17% v/v) followed by coating with colloidal silver nanoparticles (AgNP). The combined effects of binary silanization and AgNP encapsulation produced a surface that has remarkable water contact angle of 153 ± 2° and antimicrobial properties (against gram-negative Escherichia coli). The superior performance of the modified cotton fabrics produced with fluorine-free organosilanes and silver nanoparticles augments the potential of improving the functionality of abundant biopolymers to be waterproof and contamination-resistant.

Electroless Deposition-Assisted 3D Printing of Micro Circuitries for Structural Electronics

Three-dimensional (3D) printing is a next-generation free-form manufacturing technology for structural electronics. The realization of structural electronic devices necessitates the direct integration of electronic circuits into 3D objects. However, creating highly conductive, high-resolution patterns in 3D remains a major challenge. Here, we report on a metallic 3D printing method that incorporates electroless deposition (ELD) into the direct ink writing method. Our approach consists of two steps: (1) direct ink writing of catalyst microstructures with a functional catalyst ink containing Ag ions and (2) ELD of Cu onto the printed catalyst structures. High-quality, stable Cu 3D printing is achieved through the design of the Ag catalyst ink; hydroxypropyl cellulose is added as both a rheological modifier (printing) and dissolution inhibitor (ELD). As a result, various two-dimensional (2D) and 3D Cu micro circuitries with high conductivity (∼65% of bulk) can be directly integrated onto 3D plastic substrates without the need for high-temperature annealing. A hybrid strategy that combines ELD-assisted 3D printing and conventional fused deposition modeling enables full fabrication of structural electronic devices. This 3D printing strategy can be a low-cost and facile method for obtaining highly conductive metallic 2D and 3D microstructures in structural electronics.