High dielectric constant polyimide derived from 5,5′-bis[(4-amino) phenoxy]-2,2′-bipyrimidine

Intrinsic-designed polyimide dielectric materials with large energy storage density and discharge efficiency at harsh ultra-high temperatures

Polymer dielectric materials with excellent temperature stability are urgently needed for the ever-increasing energy storage requirements under harsh high-temperature conditions. In this work, a novel diamine monomer (bis(2-cyano-4-aminophenyl)amine) was successfully synthesized to prepare a series of cyano-containing polyimides (CPI-1-3), which possessed excellent dielectric properties and high thermostability. The maximum dielectric permittivity was up to 5.5 at 102 Hz for CPI-3, being 2.5 times higher than that of commercially used BOPP. In comparison, the CPI-1 exhibited an outstanding breakdown strength of 433 MV m-1 and a high energy density of 2.5 J cm-3 even at 250 °C, which was the highest value reported under the same conditions. The synthesized CPIs through such an intrinsic approach are potential candidate materials for energy storage and even other applications under simultaneously harsh electrical and thermal conditions.

Progress on Polymers Containing Imide Rings for Advanced Technologies: A Contribution from ICMPP of the Romanian Academy

Evolving technology has posed a constantly increasing need for materials that can work well under harsh conditions such as elevated temperatures. Aromatic polyimides have a great potential for this purpose, having excellent thermal, mechanical, dielectric, and optical properties, along with good chemical resistance and high dimensional stability. In spite of their general difficulty in processing and high cost, polyimides are intensively studied for applications in many areas due to their high-end value. This article reviews the progress made on polyimide materials in the “Petru Poni” Institute of Macromolecular Chemistry (ICMPP) of the Romanian Academy during the last decade, with focus on their performance as films, matrices for nanocomposites, coatings for microelectronics and opto-electronic devices, or dielectrics for thin film capacitors.

Synthesis of Superheat-Resistant Polyimides with Enhanced Dielectric Constant by Introduction of Cu(ΙΙ)-Coordination

To achieve polyimide-metal complexes with enhanced properties, 5-amine-2-(5-aminopyridin-2-yl)-1-methyl-benzimidazole (PyMePABZ) that contains stiff 2-(2'-pyridyl)benzimidazole (PyBI) was synthesized and exploited to construct the Cu(ΙΙ)-crosslinked polyimides (Cu-PIs). These Cu-PIs exhibited higher dielectric, thermal, and mechanical properties with an increase in Cu2+ content. Among them, their dielectric constants (εrS) were up to 43% superior to that of the neat PI, glass transition temperatures (Tgs) were all over 400 °C, and 5% weight loss temperature (T5%) maintained beyond 500 °C. These data indicate that the metal coordination crosslinking provided a useful guide to develop high performance PIs which possess potential application as useful high temperature capacitors.

Polymer Capacitor Dielectrics for High Temperature Applications

Much effort has been invested for nearly five decades to identify and develop new polymer capacitor dielectrics for higher than ambient temperature applications. Simultaneous demands of processability, dielectric permittivity, thermal conductivity, and dielectric breakdown strength dictated by increasing high power performance criteria limit the number of available materials. The present review first explains the advantages of metallized polymer film capacitors over the film-foil, ceramic, and electrolytic counterparts and then presents a comprehensive review on both past developmental effort of commercial resins and recent research progress on new polymers targeted for operating temperature above 150 °C. Some historical background and discussion on the limitation of the commercially available polymer film dielectrics for high temperature applications are also given. In many cases, further development of promising polymers that appear to possess all or most of the important criteria is limited by lack of large scale market incentives but could be of great value to niche applications in the military or aerospace realm.

Polyimide composites composed of covalently bonded BaTiO3@GO hybrids with high dielectric constant and low dielectric loss

Novel flexible three-phase high-k polyimide composites were fabricated by the incorporation of covalently bonded BaTiO₃@GO hybrids in which the BaTiO₃@GO hybrids were prepared by the reaction of amino modified BaTiO₃ particles and GO.

Enhancing the dielectric properties of highly compatible new polyimide/γ-ray irradiated MWCNT nanocomposites

Novel polyimide/γ-ray irradiated MWCNT (PI/γ-MWCNT) nanocomposites with improved dielectric properties were fabricated by casting and curing processes.