Synchronous curable deoxidizing capability of epoxy-anhydride adhesive: Deoxidation quantification via spectroscopic analysis

Catalysis of Silver and Bismuth in Various Epoxy Resins

Epoxy resins find extensive utility across diverse applications owing to their exceptional adhesion capabilities and robust mechanical and thermal characteristics. However, the demanding reaction conditions, including extended reaction times and elevated reaction temperature requirements, pose significant challenges when using epoxy resins, particularly in advanced applications seeking superior material properties. To surmount these limitations, the conventional approach involves incorporating organic catalysts. Within the ambit of this investigation, we explored the catalytic potential of metallic powders, specifically bismuth (Bi) and silver (Ag), in epoxy resins laden with various curing agents, such as diacids, anhydrides, and amines. Metallic powders exhibited efficacious catalytic activity in epoxy-diacid and epoxy-anhydride systems. In contrast, their influence on epoxy-amine systems was rendered negligible, attributed to the absence of requisite carboxylate functional groups. Additionally, the catalytic performance of Bi and Ag are different, with Bi displaying superior efficiency owing to the presence of inherent metal oxide layers on its powder surfaces. Remarkably, the thermal and mechanical properties of uncatalyzed, fully cured epoxy resins closely paralleled those of their catalyzed counterparts. These findings accentuate the potential of Bi and Ag metal catalysts, particularly in epoxy-diacid and epoxy-anhydride systems, spanning a spectrum of epoxy-based applications. In summary, this investigation elucidates the catalytic capabilities of Bi and Ag metal powders, underscoring their ability to enhance the curing rate of epoxy resin systems involving diacids and anhydrides but not amines. This research points toward a promising trajectory for multifarious epoxy-related applications.

Epoxy-Based Copper (Cu) Sintering Pastes for Enhanced Bonding Strength and Preventing Cu Oxidation after Sintering

The investigation of interconnection technologies is crucial for advancing semiconductor packaging technology. This study delved into the various methods of achieving electrical interconnections, focusing on the sintering process and composition of the epoxy. Although silver (Ag) has traditionally been utilized in the sintering process, its high cost often precludes widespread commercial applications. Copper (Cu) is a promising alternative that offers advantages, such as cost-effectiveness and high thermal and electrical conductivities. However, the mechanical robustness of the oxide layers formed on Cu surfaces results in several challenges. This research addresses these challenges by integrating epoxy, which has advantages such as adhesive capabilities, chemical resistance, and robust mechanical properties. The chemical reactivity of the epoxy was harnessed to both fortify adhesion and inhibit oxide layer formation. However, the optimal sintering performance required considering both the composite composition (20 wt% epoxy) and the specific sintering conditions (pre-heating at 200 °C and sintering at 250 °C). The experimental findings reveal a balance in the incorporation of epoxy (20 wt%) for the desired electrical and mechanical properties. In particular, the bisphenol A epoxy (Da)-containing sintered Cu chip exhibited the highest lab shear strength (35.9 MPa), whereas the sintered Cu chip without epoxy represented the lowest lab shear strength of 2.7 MPa. Additionally, the introduction of epoxy effectively curtailed the onset of oxidation in the sintered Cu chips, further enhancing their durability. For instance, 30 days after sintering, the percentage of oxygen atoms in the Da-containing sintered Cu chip (4.5%) was significantly lower than that in the sintered Cu chip without epoxy (37.6%), emphasizing the role of epoxy in improving Cu oxidation resistance. Similarly, the samples sintered with bisphenol-based epoxy binders exhibited the highest electrical and thermal conductivities after 1 month. This study provides insights into interactions between epoxy, carboxylic acid, solvents, and Cu during sintering and offers a foundation for refining the sintering conditions.

Effects of Filler Functionalization on Filler-Embedded Natural Rubber/Ethylene-Propylene-Diene Monomer Composites

Natural rubber (NR) presents a number of advantages over other types of rubber but has poor resistance to chemicals and aging. The incorporation of ethylene propylene diene monomer (EPDM) into the NR matrix may be able to address this issue. Mineral fillers, such as carbon black (CB) and silica are routinely incorporated into various elastomers owing to their low cost, enhanced processability, good functionality, and high resistance to chemicals and aging. Other fillers have been examined as potential alternatives to CB and silica. In this study, phlogopite was surface-modified using 10 phr of compatibilizers, such as aminopropyltriethoxysilane (A1S), aminoethylaminopropyltrimethoxysilane (A2S), or 3-glycidoxypropyltrimethoxysilane (ES), and mixed with NR/EPDM blends. The effects of untreated and surface-treated phlogopite on the mechanical properties of the rubber blend were then compared with those of common fillers (CB and silica) for rubbers. The incorporation of surface-modified phlogopite into NR/EPDM considerably enhanced various properties. The functionalization of the phlogopite surface using silane-based matters (amino- and epoxide-functionalized) led to excellent compatibility between the rubber matrix and phlogopite, thereby improving diverse properties of the elastomeric composites, with effects analogous to those of CB. The tensile strength and elongation at break of the phlogopite-embedded NR/EPDM composite were lower than those of the CB-incorporated NR/EPDM composite by 30% and 10%, respectively. Among the prepared samples, the ES-functionalized phlogopite showed the best compatibility with the rubber matrix, exhibiting a tensile strength and modulus of composites that were 35% and 18% higher, respectively, compared with those of the untreated phlogopite-incorporated NR/EPDM composite. The ES-functionalized phlogopite/NR/EPDM showed similar strength and higher modulus (by 18%) to the CB/NR/EPDM rubber composite, despite slightly lower elongation at break and toughness. The results of rebound resilience and compression set tests indicated that the elasticity of the surface-modified phlogopite/NR/EPDM rubber composite was higher than that of the silica- and CB-reinforced composites. These improvements could be attributed to enhancements in the physical and chemical interactions among the rubber matrix, stearic acid, and functionalized (compatibilized) phlogopite. Therefore, the functionalized phlogopite can be utilized in a wide range of applications for rubber compounding.

Physical and Chemical Compatibilization Treatment with Modified Aminosilanes for Aluminum/Polyamide Adhesion

Metal/polymer bilayer composites feature high strength-to-weight ratios and low manufacturing costs despite the weak interfacial adhesion between their components. In this study, aluminum surfaces were modified to generate microporous architectures and hydroxyl moieties by various physical and chemical treatments, including thermal, plasma, anodizing, and hexafluorozirconic acid treatments to overcome the weak interfacial adhesion. The maximum shear strength of the obtained metal/polymer bilayer composites was achieved by anodizing treatment, whereas all treatment methods substantially improved the material toughness. In addition, modified compatibilizing agents with tailorable hydroxyl moieties were applied to enhance the interfacial adhesion using aminoethylaminopropyl trimethoxysilane (AEAPS) and modified AEAPS as a coupling agent. AEAPS modified by monoepoxide (glycidol) produced the strongest positive effect on the composite mechanical properties. These findings can be useful in a myriad of metal/polymer multilayer composites.

Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities

Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic–thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.

Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining

An epoxy-based solder paste (ESP) is a promising alternative to conventional solder pastes to improve the reliability of fine-pitch electrical joining because the epoxy encapsulates the solder joint. However, development of an appropriate epoxy formulation and investigation of its reaction mechanism with solder powder is challenging. In this study, we demonstrate a newly designed ESP consisting of diglycidyl ether of bisphenol F (DGEBF) resin, Sn-3.0 Ag-0.5 Cu (SAC305) solder powder, and L-glutamic acid (Glu), which is a proteinogenic amino acid for biosynthesis of proteins in living systems. The mechanism of the thermochemical reaction was explored and tentatively proposed, which reveals that the products of the reaction between SAC305 and Glu function as catalysts for the etherification of epoxides and alcohols produced by chemical bonding between DGEBF and Glu, consequently leading to highly crosslinked polymeric networks and an enhancement of impact resistance. Our findings provide further insight into the mechanism of the reaction between various formulations comprising an epoxy, amino acid, and solder powder, and their potential use as ESPs for electrical joining.

Recycling Waste Circuit Board Efficiently and Environmentally Friendly through Small-Molecule Assisted Dissolution

With the increasing amount of electronic waste (e-waste) generated globally, it is an enormous challenge to recycle printed circuit boards (PCBs) efficiently and environmentally friendly. However, conventional recycling technologies have low efficiency and require tough treatment such as high temperature (>200 °C) and high pressure. In this paper, a small-molecule assisted approach based on dynamic reaction was proposed to dissolve thermosetting polymers containing ester groups and recycle electronic components from PCBs. This effective approach operates below 200 °C and the polymer could be dissolved in a short time. It has a remarkable ability to recycle a wide range of commercial PCBs, including boards made of typical anhydride epoxy or polyester substrate. Besides, it is environmentally friendly as even the recycling solution could be reused multiple times. In addition, the wasted solution after recycling could be used for board bonding and damage repair. This work also demonstrates the advantage of using polymers containing ester groups as the PCB substrate in consideration of eco-friendly and efficient recycling.