Research Advances of Porous Polyimide-Based Composites with Low Dielectric Constant

With the burgeoning of the microelectronics industry, in order to improve the transmission speed between chips in large-scale integrated circuits to meet the demands of high integration, it is necessary for interlayer insulation materials to possess a lower dielectric constant (k). Polyimide (PI) has been widely used as interlayer insulation materials for large-scale integrated circuits, and the exploration on reducing their dielectric constant has attracted extensive attention in recent years. In this work, porous PI-based composites with a low dielectric constant are mainly reviewed. The application of porous SiO2, graphene derivatives, polyoxometalates, polyhedral oligomeric silsesquioxane and hyperbranched polysiloxane in reducing the dielectric constant of PI is emphatically introduced. The key technical problems and challenges in the current research of porous polyimide materials are summarized, and the development prospect of low k polyimide is also expounded.

Preparation of a Crosslinked Poly(imide-siloxane) for Application to Transistor Insulation

Insulated gate bipolar transistor (IGBT) is an important power device for the conversion, control, and transmission of semiconductor power, and is used in various industrial fields. The IGBT module currently uses silicone gel as an insulating layer. Since higher power density and more severe temperature applications have become the trend according to the development of electronic device industry, insulating materials with improved heat resistance and insulation performances should be developed. In this study, we intended to synthesize a new insulating material with enhanced thermal stability and reduced thermal conductivity. Poly(imide-siloxane) (PIS) was prepared and crosslinked through a hydrosilylation reaction to obtain a semi-solid Crosslinked PIS. Thermal decomposition temperature, thermal conductivity, optical transparency, dielectric constant, and rheological property of the Crosslinked PIS were investigated and compared to those of a commercial silicone gel. The Crosslinked PIS showed high thermal stability and low thermal conductivity, along with other desirable properties, and so could be useful as an IGBT-insulating material.

High temperature shape memory poly(amide-imide)s with strong mechanical robustness

Shape memory poly(amide-imide)s with strong mechanical robustness, outstanding heat resistance and low water uptake were fabricated.

Revealing the High-Modulus Mechanism of Polyimide Films Prepared with 3,4'-ODA

To prepare PIs (polyimides) with desirable thermal and mechanical properties is highly demanded due to their widespread applications in flexible optoelectronic devices and printed circuit boards. Here, the PI films of BPDA/4,4′-ODA, BPDA/3,4′-ODA, PMDA/4,4′-ODA, PMDA/3,4′-ODA systems were prepared, and it was found that the PIs with 3,4′-ODA always exhibit a high modulus compared with the PIs with 4,4′-ODA. To disclose the mechanism of high-modulus PI films with 3,4′-ODA, amorphous PI models and uniaxial drawing PI models were established and calculated based on MD simulation. The PI structural deformations at different length scales, i.e., molecular chain cluster scale and repeat unit scale, under the same stress were detailed and analyzed, including the variation of chain conformation, bond length, bond angle, internal rotation energy, and torsion angle. The results indicate that PIs with 3,4-ODA have higher internal rotation energy and smaller deformation with the same stress, consistent with the high modulus.

Simultaneously improving the ductility and strength of aromatic thermoset films

Aromatic thermoset materials have shown great potential applications in various fields owing to their excellent mechanical strengths. However, their poor ductility is still hinders their large-scale applications. In this study, a new class of aromatic thermosets consisting of two types of crosslinks was successfully developed by incorporating the special group imidazole into a type of crosslinked thermoset. One crosslink is constituted of reversible multiple noncovalent interactions containing “face-face” π–π stacking, “point-point” hydrogen bonds, and ion-pair electrostatic interactions, whereas the other is composed of permanent covalent bonds. Most importantly, the synergetic interplay among these reversible multiple noncovalent interactions enables them to evade the restrictions from the aromatic polymer skeletons to proceed with their dynamic dissociating-rebuilding processes, which can timely and effectively dissipate the internal stress. Finally, owing to the coefficient of these two types of crosslinks, a significantly enhanced ductility was successfully obtained on these aromatic thermosets and their tensile strengths were also improved. Such thermosets having simultaneously enhanced strengths and ductility are predicted to be eventually used in a wide range of applications.

Hyperbranched polyamide modified graphene oxide-reinforced polyurethane nanocomposites with enhanced mechanical properties

As is well known, it is difficult to simultaneously improve both the strength and elongation at break of polymers filled with nanomaterials. This work obtained high-performance composites with enhanced strength and elongation at break via cross-linking hydroxyl-terminated polybutadiene (HTPB) chains with hyperbranched-polyamide-modified graphene oxide (HGO), and the preparation, characterization, and mechanical properties of the composites serving as a composite solid-propellant binder have been described in detail. Compared with pure HTPB polyurethane (P-HTPB), the tensile strength and elastic modulus of the composite containing 0.1 wt% HGO (H-0.1/HTPB) increase by 57.8% and 65.3%, respectively. Notably, the elongation at break of the H-0.1/HTPB composite can reach up to 1292.6%, which is even higher than that of P-HTPB. Moreover, the capabilities of the composites to resist deformation have also been enhanced significantly. The glass transition temperatures of the composites are still extremely low (∼-73 °C), which is beneficial for their applications. It can be expected that this study can provide an effective fabrication approach and strategy for preparing high-performance polyurethane composites.

Synthesis and properties of colorless copolyimides derived from 4,4′-diaminodiphenyl ether-based diamines with different substituents

Highly transparent PI films with excellent mechanical strength, high heat-resistance and superior fracture toughness were fabricated.

Polyphenylsilsesquioxanes. New structures-new properties

The review describes the synthesis and properties of various forms of polyphenylsilsesquioxane (PPSQ). Among the forms described, we present the well-known ladder (l-PPSQ) and polyhedral (p-PPSQ) forms, from the first studies to the latest achievements. The practical prospects of these compounds and the possibility of their modification are estimated. These PPSQ have a regular polycyclic structure, which allowed us to compare them with random polycyclic analogs (r-PPSQ). The last part of the review describes the acyclic PPSQ (a-PPSQ) obtained recently. The methods for their synthesis and modification are presented. Modification of (a-PPSQ) allows two new forms of PPSQ to be obtained. The first one is a hyperbranched PPSQ. The second one is a globular PPSQ or a nanogel as it is called by the authors. Both forms are of great interest because their physicochemical properties differ greatly from the known ones (l-PPSQ, p-PPSQ, r-PPSQ). The areas of practical application of the new PPSQ forms are predicted.

The review describes the synthesis and properties of various forms of polyphenylsilsesquioxane (PPSQ).

Dielectric Property and Space Charge Behavior of Polyimide/Silicon Nitride Nanocomposite Films

Polymeric materials have many applications in multiple industries. In this paper, silicon nitride nanoparticles (Si₃N₄) were incorporated into a polyimide (PI) matrix to obtain composite films via the in situ polymerization method. The Si₃N₄ nanoparticles were consistently scattered in the composites, and the thickness of PI/Si₃N₄ films was around 50 µm. The effects of nanoparticle content on the dielectric constant, loss tangent and breakdown strength were simultaneously studied. A 3 wt.% doped PI/Si₃N₄ film revealled excellent dielectric properties, a dielectric constant (ε) of 3.62, a dielectric loss tangent (tanδ) of 0.038, and a breakdown strength of 237.42 MV/m. The addition of Si₃N₄ formed an interface layer inside PI, resulting in a large amount of space charge polarization in the electric field. The space charge of materials from the microscopic point of view was analyzed. The results show that there are trapenergy levels in the composites, which can be used as a composite carrier center and transport channel, effectively improving the performance of a small amount of nanoparticles film.

Evading the strength–ductility trade-off dilemma of rigid thermosets by incorporating triple cross-links of varying strengths

A new class of rigid thermosets with simultaneously enhanced strengths and ductilities have been successfully designed and synthesised.