High Thermal Stability and Low Dielectric Constant of BCB Modified Silicone Resins

Based on the excellent physical properties and flexible molecular modifiability, modified silicone resins have received favorable attention in the field of microelectronics, and recently a number of modified silicone resins have appeared while few breakthroughs have been made in low dielectric constant (low-k) materials field due to the limitations of structure or the curing process. In this work, functional silicone resin with different BCB contents was prepared with two monomers. The resins showed low dielectric constant (k = 2.77 at 10 MHz) and thermal stability (T_5% = 495.0 °C) after curing. Significant performance changes were observed with the increase in BCB structural units, and the functional silicone obtained does not require melting and dissolution during processing because of good fluidity at room temperature. Moreover, the mechanical properties of silicone resins can be also controlled by adjusting the BCB content. The obtained silicone resins could be potentially used in the field of electronic packaging materials.

Study on vinyl crosslinking and related properties of silicon-containing arylacetylene resin synthesised by zinc powder catalysis

A matrix resin poly(silicon-containing arylacetylene vinyl)s (PSAV) containing vinyl at both branch and terminal chains underwent synthesis via the zinc powder catalytic method using m-diacetylene benzene and dichloromethylvinylsilane as raw materials. Vinyl in the PSAV resin was crosslinked by the free radical initiator dibenzoyl peroxide to obtain a crosslinked network structure resin (PSAV-L). This approach sought to improve the thermal properties and other related properties of the matrix resin. A series of tests, such as rotated rheometer, FTIR, DSC, TGA, Py-GC-MS and universal testing machine, characterised processing property, curing behaviour, thermal properties and mechanical properties. The rheological curve shows that PSAV-L resin has a wide processing window (40–134.5°C), endowing the resin with excellent processing performance. Thermal curing behaviour indicates that PSAV-L resin can start curing at a lower temperature, namely, 32°C earlier than PSAV resin. TGA analysis shows that the degradation temperature at 5% weight loss (Td5) of PSAV-L resin stands at 579.4°C, 45.4°C higher than that of PSAV resin due to the fact that the crosslinking of vinyl gives PSAV-L resin a network structure. The flexural strength, flexural modulus and ILSS of the quartz fibre cloth reinforced PSAV-L resin composite (QF/PSAV-L) are 184.68 MPa, 15.50 GPa and 12.40 MPa. The PSAV-L resin exhibits the comprehensive properties of good processing performance, low curing temperature, excellent thermal performance and high mechanical properties.