Polyimide hollow glass microspheres composite films with low dielectric constant and excellent thermal performance

Research Advances of Porous Polyimide-Based Composites with Low Dielectric Constant

With the burgeoning of the microelectronics industry, in order to improve the transmission speed between chips in large-scale integrated circuits to meet the demands of high integration, it is necessary for interlayer insulation materials to possess a lower dielectric constant (k). Polyimide (PI) has been widely used as interlayer insulation materials for large-scale integrated circuits, and the exploration on reducing their dielectric constant has attracted extensive attention in recent years. In this work, porous PI-based composites with a low dielectric constant are mainly reviewed. The application of porous SiO2, graphene derivatives, polyoxometalates, polyhedral oligomeric silsesquioxane and hyperbranched polysiloxane in reducing the dielectric constant of PI is emphatically introduced. The key technical problems and challenges in the current research of porous polyimide materials are summarized, and the development prospect of low k polyimide is also expounded.

Reducing the Permittivity of Polyimides for Better Use in Communication Devices

Recent studies have shown that introducing fluorinated groups into polyimide (PI) molecules can effectively reduce the dielectric constant (Dk) and dielectric loss (Df) of PIs. In this paper, 2,2'-bis[4-(4-aminophenoxy) phenyl]-1,1',1',1',3,3',3'-hexafluoropropane (HFBAPP), 2,2'-bis(trifluoromethyl)-4,4'-diaminobenzene (TFMB), diaminobenzene ether (ODA), 1,2,4,5-Benzenetetracarboxylic anhydride (PMDA), 3,3',4,4'-diphenyltetracarboxylic anhydride (s-BPDA) and 3,3',4,4'-diphenylketontetracarboxylic anhydride (BTDA) were selected for mixed polymerization to find the relationship between the structure of PIs and dielectric properties. Firstly, different structures of fluorinated PIs were determined, and were put into simulation calculation to learn how structure factors such as fluorine content, the position of fluorine atom and the molecular structure of diamine monomer affect the dielectric properties. Secondly, experiments were carried out to characterize the properties of PI films. The observed change trends of performance were found to be consistent with the simulation results, and the possible basis of the interpretation of other performance was made from the molecular structure. Finally, the formulas with the best comprehensive performance were obtained respectively. Among them, the best dielectric properties were 14.3%TFMB/85.7%ODA//PMDA with dielectric constant of 2.12 and dielectric loss of 0.00698.

Design and synthesis of novel poly (aryl ether ketones) containing trifluoromethyl and trifluoromethoxy groups

The high-frequency and high-speed communication in the 5 G era puts forward requirements for the dielectric properties of polymers. Introducing fluorine into poly(ary ether ketone) can improve its dielectric properties. In this work, by introducing the fluorine group strategy, we successfully designed and synthesized three novel trifluoromethyl (-CF₃) or trifluoromethoxy (-OCF₃)-containing bisphenol monomers and their F-substitution PEK-based polymers (PEK-Ins). All these PEK-Ins exhibited good thermal, mechanical and dielectric properties. The T d5% of the three polymers is all higher than 520℃. The free volume fraction of novel polymers increased from 3.75% to 5.72%. Among the three polymers, exhibited the lowest dielectric constant of the films is 2.839, and the dielectric loss is 0.0048, ascribing to the increasing free volume. The Young's modulus of the polymer film is as high as 2.9 GPa and the tensile strength is as high as 84 MPa. PEK-Ins reduced the dielectric constant by introducing a low fluorine content. This study provides a new way to design PEK to synthesize low dielectric constant polymers.

Low Dielectric Properties and Transmission Loss of Polyimide/Organically Modified Hollow Silica Nanofiber Composites

In this study, a series of low dielectric constant and transmission loss of polyimide (PI)/organically modified hollow silica nanofiber (m-HSNF) nanocomposites were synthesized via two-step polymerization. Two different PIs were fabricated using two types of diamine monomers with or without fluorine-containing groups and biphenylene structure of dianhydride. The chemical structure and morphology of the fabricated composites were characterized using Nuclear magnetic resonance (NMR), Fourier transform infrared (FTIR) and field-emission scanning electron microscopy (FESEM). The two-step polymerization process successfully manufactured and converted from polyamic acid to polyimide after thermal imidization was proved by the NMR and FTIR results. The FESEM and their related energy-dispersive X-ray spectroscopy (EDS) images of nanocomposites indicate that the m-HSNF is extremely dispersed into the polyimide matrix. The high-frequency dielectric constants of the nanocomposite materials decrease as the presence of fluorine-containing groups in diamine monomers and the loadings of the m-HSNF increase. These findings are probably attributed to the presence of the steric hindrance effect brought by trifluoromethyl groups, and the m-HSNF can disrupt the chain packing and increase the free volume, thus reducing the dielectric properties of polyimides. The transmission loss and its related uncertainty of fabricated composite materials contain excellent performance, suggesting that the fabricated materials could be used as substrate materials for 5G printed circuit board.

Modified hollow glass microspheres composite isocyanate-based polyimide foam with improving mechanical and thermal insulation properties

In this work, hollow glass microspheres (HGM) were introduced into the polyimide matrix as an effective reinforcement filler to improve the mechanical and thermal insulation properties of the polyimide foams (PIF). The HGM was surface-modified with the silane coupling agent to enhance the interfacial compatibility with PIF. Experimental results revealed that the average cellular diameter of PIF decreased obviously with the addition of the modified HGM (M-HGM). The apparent density of foams also increased from 15.85 to 18.34 kg/m3 when the M-HGM combination was changed from 0 to 12 percent (wt.%). Compared with the pure PIF, the composite foams added 8 wt.% M-HGM showed high compression strength (65 kPa) and compression modulus (1147 kPa), resulting in a distinct enhancement in mechanical properties. Furthermore, the addition of M-HGM filler also improved the thermal insulation performance of PIF, which exhibited the minimum thermal conductivity of 29.48 mW·m−1·K−1 with 8 wt.% M-HGM. Thus, considering the improved mechanical and insulation properties of the prepared PIF, it could be a promising candidate for the high temperature-resistant thermal insulating applications.