Thermally induced increase in energy transport capacity of silkworm silks

Research on In Situ Thermophysical Properties Measurement during Heating Processes

Biomass pyrolysis is an important way to produce biofuel. It is a chemical reaction process significantly involving heat, in which the heating rate will affect the yield and composition (or quality) of the generated biofuel. Therefore, the heat transfer inside the biomass pellets is important for determining the rate of temperature rise in the pellets. The accurate knowledge of the thermophysical properties of biomass pellets is required to clarify the process and mechanism of heat transfer in the particles and in the reactor. In this work, based on the transient thermoelectric technology, a continuous in situ thermal characterization method for a dynamic heating process is proposed. Multiple thermophysical properties, including thermal conductivity and volumetric heat capacity for corn leaves, are measured simultaneously within a heating process. In temperatures lower than 100 °C, the volumetric heat capacity slightly increases while the thermal conductivity decreases gradually due to the evaporation of water molecules. When the temperature is higher than 100 °C, the organic components in the corn leaves are cracked and carbonized, leading to the increase in the thermal conductivity and the decrease in the volumetric heat capacity against temperature.

Outstanding Bio-Tribological Performance Induced by the Synergistic Effect of 2D Diamond Nanosheet Coating and Silk Fibroin

Due to their excellent biocompatibility, outstanding mechanical properties, high strength-to-weight ratio, and good corrosion resistance, titanium (Ti) alloys are extensively used as implant materials in artificial joints. However, Ti alloys suffer from poor wear resistance, resulting in a considerably short lifetime. In this study, we demonstrate that the chemical self-assembly of novel two-dimensional (2D) diamond nanosheet coatings on Ti alloys combined with natural silk fibroin used as a novel lubricating fluid synergistically results in excellent friction and wear performance. Linear-reciprocating sliding tests verify that the coefficient of friction and the wear rate of the diamond nanosheet coating under silk fibroin lubrication are reduced by 54 and 98%, respectively, compared to those of the uncoated Ti alloy under water lubrication. The lubricating mechanism of the newly designed system was revealed by a detailed analysis of the involved microstructural and chemical changes. The outstanding tribological behavior was attributed to the establishment of artificial joint lubrication induced by the cross binding between the diamond nanosheets and silk fibroin. Additionally, excellent biocompatibility of the lubricating system was verified by cell viability, which altogether paves the way for the application of diamond coatings in artificial Ti joint implants.

Effects of Current Annealing on Thermal Conductivity of Carbon Nanotubes

This work documents the annealing effect on the thermal conductivity of nanotube film (CNTB) and carbon nanotube fiber (CNTF). The thermal properties of carbon nanotube samples are measured by using the transient electro-thermal (TET) technique, and the experimental phenomena are analyzed based on numerical simulation. During the current annealing treatment, CNTB1 always maintains the negative temperature coefficient of resistance (TCR), and its thermal diffusivity increases gradually. When the annealing current is 200 mA, it increases by 33.62%. However, with the increase of annealing current, the TCR of CNTB2 changes from positive to negative. The disparity between CNTB2 and CNTB1 suggests that they have different physical properties and even structures along their lengths. The high-level thermal diffusivity of CNTB2 and CNTF are 2.28–2.46 times and 1.65–3.85 times higher than the lower one. The results show that the decrease of the thermal diffusivity for CNTB2 and CNTF is mainly caused by enhanced Umklapp scattering, the high thermal resistance and torsional sliding during high temperature heating.

Effects of β-sheet crystals and a glycine-rich matrix on the thermal conductivity of spider dragline silk

We measured the thermal conductivity of Araneus ventricosus' spider dragline silk using a suspended microdevice. The thermal conductivity of the silk fiber was approximately 0.4Wm^-1K^-1 at room temperature and gradually increased with an increasing temperature in a manner similar to that of other disordered crystals or proteins. In order to elucidate the effect of β-sheet crystals in the silk, thermal denaturation was used to reduce the quantity of the β-sheet crystals. A calculation with an effective medium approximation supported this measurement result showing that the thermal conductivity of β-sheet crystals had an insignificant effect on the thermal conductivity of SDS. Additionally, the enhancement of bonding strength in a glycine-rich matrix by atomic layer deposition did not increase the thermal conductivity. Thus, this study suggests that the disordered part of the glycine-rich matrix prevented the peptide chains from being coaxially extended via the cross-linking covalent bonds.

Thermal conductivity of giant mono- to few-layered CVD graphene supported on an organic substrate

The thermal conductivity (k) of supported graphene is a critical property that reflects the graphene-substrate interaction, graphene structure quality, and is needed for thermal design of a graphene device. Yet the related k measurement has never been a trivial work and very few studies are reported to date, only at the μm level. In this work, for the first time, the k of giant chemical vapor decomposition (CVD) graphene supported on poly(methyl methacrylate) (PMMA) is characterized using our transient electro-thermal technique based on a differential concept. Our graphene size is ∼mm, far above the samples studied in the past. This giant graphene measurement eliminates the thermal contact resistance problems and edge phonon scattering encountered in μm-scale graphene k measurement. Such mm-scale measurement is critical for device/system-level thermal design since it reflects the effect of abundant grains in graphene. The k of 1.33-layered, 1.53-layered, 2.74-layered and 5.2-layered supported graphene is measured as 365 W m(-1) K(-1), 359 W m(-1) K(-1), 273 W m(-1) K(-1) and 33.5 W m(-1) K(-1), respectively. These values are significantly lower than the k of supported graphene on SiO2, and are about one order of magnitude lower than the k of suspended graphene. We speculate that the abundant C atoms in the PMMA promote more ready energy and momentum exchange with the supported graphene, and give rise to more phonon scattering than the SiO2 substrate. This leads to a lower k of CVD graphene on PMMA than that on SiO2. We attribute the existence of disorder in the sp(2) domain, graphene oxide (GO) and stratification in the 5.2-layered graphene to its more k reduction. The Raman linewidth (G peak) of the 5.2-layered graphene is also twice larger than that of the other three kinds of graphene, indicating the much more phonon scattering and shorter phonon lifetime in it. Also the electrical conductivity of the 5.2-layered graphene is about one-fifth of that for the other three. This further confirms the poor graphene quality of sample 4S, explaining its much lower k.

Thermal Conductivity of Ultrahigh Molecular Weight Polyethylene Crystal: Defect Effect Uncovered by 0 K Limit Phonon Diffusion

Crystalline ultrahigh molecular weight polyethylene (UHMWPE) has the highest reported thermal conductivity at room temperature: 104 W/(m·K), while theoretical predictions proposed an even higher value of 300 W/(m·K). Defects and amorphous fraction in practical UHMWPE fibers significantly reduces the thermal conductivity from the ideal value. Although the amorphous effect can be readily analyzed based on the effective medium theory, the defect effects are poorly understood. This work reports on the temperature-dependent behavior (down to 22 K) of thermal diffusivity and conductivity of UHMWPE fibers in anticipation of observing the reduction in phonon density and scattering rate against temperature and of freezing out high-momentum phonons to clearly observe the defect effects. By studying the temperature-dependent behavior of thermal reffusivity (Θ, inverse of thermal diffusivity) of UHMWPE fibers, we are able to quantify the defect effects on thermal conductivity. After taking out the amorphous region's effect, the residual thermal reffusivities (Θ0) for the studied two samples at the 0 K limit are determined as 3.45 × 10(4) and 2.95 × 10(4) s/m(2), respectively. For rare-/no-defects crystalline materials, Θ0 should be close to zero at the 0 K limit. The defect-induced low-momentum phonon mean free paths are determined as 8.06 and 9.42 nm for the two samples. They are smaller than the crystallite size in the (002) direction (19.7 nm) determined by X-ray diffraction. This strongly demonstrates the diffuse phonon scattering at the grain boundaries. The grain boundary thermal conductance (G) can be evaluated as G ≈ βρc(p)v with sound accuracy. At room temperature, G is around 3.73 GW/(m(2)·K) for S2, comparable to that of interfaces with tight atomic bonding.

Development of time-domain differential Raman for transient thermal probing of materials

A novel transient thermal characterization technology is developed based on the principles of transient optical heating and Raman probing: time-domain differential Raman. It employs a square-wave modulated laser of varying duty cycle to realize controlled heating and transient thermal probing. Very well defined extension of the heating time in each measurement changes the temperature evolution profile and the probed temperature field at μs resolution. Using this new technique, the transient thermal response of a tipless Si cantilever is investigated along the length direction. A physical model is developed to reconstruct the Raman spectrum considering the temperature evolution, while taking into account the temperature dependence of the Raman emission. By fitting the variation of the normalized Raman peak intensity, wavenumber, and peak area against the heating time, the thermal diffusivity is determined as 9.17 × 10(-5), 8.14 × 10(-5), and 9.51 × 10(-5) m(2)/s. These results agree well with the reference value of 8.66 × 10(-5) m(2)/s considering the 10% fitting uncertainty. The time-domain differential Raman provides a novel way to introduce transient thermal excitation of materials, probe the thermal response, and measure the thermal diffusivity, all with high accuracy.