• Reference Citation Analysis
  • v
  • v
  • Find an Article
Find an Article PDF (4624939)   Today's Articles (5651)   Subscriber (49431)
For: Geng T, Zeller SJ, Kibler LA, Ceblin MU, Jacob T. Electrodeposition of Cu onto Au(111) from Deep Eutectic Solvents: Molar Ratio of Salt and Hydrogen Bond Donor. ChemElectroChem 2022. [DOI: 10.1002/celc.202101283] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/11/2022]
Number Cited by Other Article(s)
1
Doneux T, Sorgho A, Soma F, Rayée Q, Bougouma M. Electrodeposition in Deep Eutectic Solvents: The "Obvious", the "Unexpected" and the "Wonders". Molecules 2024;29:3439. [PMID: 39065016 PMCID: PMC11279597 DOI: 10.3390/molecules29143439] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/21/2024] [Revised: 07/05/2024] [Accepted: 07/06/2024] [Indexed: 07/28/2024]  Open
2
Tan Z, Li K, Gu Y, Nan Z, Wang W, Sun L, Mao B, Yan J. Unconventional Electrochemical Behaviors of Cu Underpotential Deposition in a Chloride-Based Deep Eutectic Solvent: High Underpotential Shift and Low Coverage. Anal Chem 2023;95:6458-6466. [PMID: 37027511 DOI: 10.1021/acs.analchem.3c00637] [Citation(s) in RCA: 2] [Impact Index Per Article: 2.0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 04/09/2023]
3
Uhl M, Geng T, Schuster PA, Schick BW, Kruck M, Fuoss A, Kuehne AJC, Jacob T. Combining Deep Eutectic Solvents with TEMPO-based Polymer Electrodes: Influence of Molar Ratio on Electrode Performance. Angew Chem Int Ed Engl 2023;62:e202214927. [PMID: 36336655 PMCID: PMC10107120 DOI: 10.1002/anie.202214927] [Citation(s) in RCA: 1] [Impact Index Per Article: 1.0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 10/10/2022] [Indexed: 11/09/2022]
4
Geng T, Schick BW, Uhl M, Kuehne AJC, Kibler LA, Ceblin MU, Jacob T. Influence of Chloride and Nitrate Anions on Copper Electrodeposition onto Au(111) from Deep Eutectic Solvents. ChemElectroChem 2022. [DOI: 10.1002/celc.202101263] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/10/2022]
PrevPage 1 of 1 1Next
© 2004-2024 Baishideng Publishing Group Inc. All rights reserved. 7041 Koll Center Parkway, Suite 160, Pleasanton, CA 94566, USA