Pilot-Scale Melt Electrospinning of Polybutylene Succinate Fiber Mats for a Biobased and Biodegradable Face Mask

The COVID-19 pandemic led to a huge demand for disposable facemasks. Billions were manufactured from nonbiodegradable petroleum-derived polymers, and many were discarded in the environment where they contributed to plastic pollution. There is an urgent need for biobased and biodegradable facemasks to avoid environmental harm during future disease outbreaks. Melt electrospinning is a promising alternative technique for the manufacturing of filter layers using sub-microfibers prepared from biobased raw materials such as polybutylene succinate (PBS). However, it is not yet possible to produce sub-micrometer PBS fibers or uniform nonwoven-like samples at the pilot scale, which hinders their investigation as filter layers. Further optimization of pilot-scale PBS melt electrospinning is therefore required. Here, we tested the effect of different parameters such as electric field strength, nozzle-to-collector distance and throughput on the final fiber diameter and sample uniformity during PBS melt electrospinning on a pilot-scale device. We also studied the effect of a climate chamber and an additional infrared heater on the solidification of PBS fibers and their final diameter and uniformity. In addition, a post-processing step, including a hot air stream of 90 °C for 30 s has been studied and successfully lead to a nonwoven-like structure including filaments that weld together without changing their structure. The finest fibers (1.7 µm in diameter) were produced at an applied electric field strength of -40 kV, a nozzle-to-collector distance of 5.5 cm, and a spin pump speed of 2 rpm. Three uniform nonwoven-like samples were tested as filter layers in a medical face mask by measuring their ability to prevent the transfer of bacteria, but the pore size was too large for effective retention. Our results provide insight into the process parameters influencing the suitability of melt-electrospun nonwoven-like samples as biobased and biodegradable filter materials and offer guidance for further process optimization.

Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many studies have been conducted to increase the thermal conductivity of epoxy-based TCAs by conductive fillers. This paper reviews and summarizes recent advances of these available fillers in TCAs that contribute to electronic packaging. It also covers the challenges of using the filler as a nano-composite. Moreover, the review reveals a broad scope for future research, particularly on thermal management by nanoparticles and improving bonding strength in electronic packaging.