Theoretical and Experimental Studies on the Mechanism of Coloration of Polyimides

Thermally Stable and Transparent Polyimide Derived from Side-Group-Regulated Spirobifluorene Unit for Substrate Application

Advancements in flexible electronic technology, especially the progress in foldable displays and under-display cameras (UDC), have created an urgent demand for high-performance colorless polyimide (CPI). However, current CPIs lack sufficient heat resistance for substrate applications. In this work, four kinds of rigid spirobifluorene diamines are designed, and the corresponding polyimides are prepared by their condensation with 5,5'-(perfluoropropane-2,2-diyl) bis(isobenzofuran-1,3-dione) (6FDA) or 9,9-bis(3,4-dicarboxyphenyl) fluorene dianhydride (BPAF). The rigid and conjugated spirobifluorene units endow the polyimides with higher glass transition temperature (Tg) ranging from 356 to 468 °C. Their optical properties are regulated by small side groups and spirobifluorene structure with a periodically twisted molecular conformation. Consequently, a series of CPIs with an average transmittance ranging from 75% to 88% and a yellowness index (YI) as low as 2.48 are obtained. Among these, 27SPFTFA-BPAF presents excellent comprehensive performance, with a Tg of 422 °C, a 5 wt.% loss temperature (Td5) of 562 °C, a YI of 3.53, and a tensile strength (δmax) of 140 MPa, respectively. The mechanism underlying the structure-property relationship is investigated by experimental comparison and theoretical calculation, and the proposed method provides a pathway for designing highly rigid conjugated CPIs with excellent thermal stability and transparency for photoelectric engineering.

Controlling Fluorination Density of Soluble Polyimide Gate Dielectrics and its Influence on Organic Crystal Growth and Device Operational Stability

Fluorinated polyimides (PIs) are among the most promising candidates for gate dielectric materials in organic electronic devices because of their solution processability and outstanding chemical, mechanical, and thermal stabilities. Additionally, fluorine (F) substitution improves the electrical properties of PI thin films, such as enhanced dielectric properties and reduced surface trap densities. However, the relationship between the fluorination density of PIs and crystal growth modes of vacuum-deposited conjugated molecules on PI thin films, which is directly related to the lateral charge transport along the PI-organic semiconductor interface, has not been systematically studied. Herein, five different soluble PIs with different F densities were synthesized, and the correlation between fluorination and thin-film properties was systematically investigated. Not only were their dielectric properties modulated, but the growth modes of the organic molecules deposited on the PI thin films also changed with increasing surface F density. This phenomenon was observed by both surface and crystallographic analyses, which resulted in extremely high operational stability of field-effect transistors and the successful fabrication of organic complementary circuits. We believe that the correlation between PI backbone fluorination and its thin-film properties will provide practical insights into the material design based on controlled molecular directed surface assembly on fluorinated polymer dielectrics.

A Comprehensive Review on the Thermal Stability Assessment of Polymers and Composites for Aeronautics and Space Applications

This review article provides an exhaustive survey on experimental investigations regarding the thermal stability assessment of polymers and polymer-based composites intended for applications in the aeronautical and space fields. This review aims to: (1) come up with a systematic and critical overview of the state-of-the-art knowledge and research on the thermal stability of various polymers and composites, such as polyimides, epoxy composites, and carbon-filled composites; (2) identify the key factors, mechanisms, methods, and challenges that affect the thermal stability of polymers and composites, such as the temperature, radiation, oxygen, and degradation; (3) highlight the current and potential applications, benefits, limitations, and opportunities of polymers and composites with high thermal stability, such as thermal control, structural reinforcement, protection, and energy conversion; (4) give a glimpse of future research directions by providing indications for improving the thermal stability of polymers and composites, such as novel materials, hybrid composites, smart materials, and advanced processing methods. In this context, thermal analysis plays a crucial role in the development of polyimide-based materials for the radiation shielding of space solar cells or spacecraft components. The main strategies that have been explored to improve the processability, optical transparency, and radiation resistance of polyimide-based materials without compromising their thermal stability are highlighted. The combination of different types of polyimides, such as linear and hyperbranched, as well as the incorporation of bulky pendant groups, are reported as routes for improving the mechanical behavior and optical transparency while retaining the thermal stability and radiation shielding properties. Furthermore, the thermal stability of polymer/carbon nanocomposites is discussed with particular reference to the role of the filler in radiation monitoring systems and electromagnetic interference shielding in the space environment. Finally, the thermal stability of epoxy-based composites and how it is influenced by the type and content of epoxy resin, curing agent, degree of cross-linking, and the addition of fillers or modifiers are critically reviewed. Some studies have reported that incorporating mesoporous silica micro-filler or microencapsulated phase change materials (MPCM) into epoxy resin can enhance its thermal stability and mechanical properties. The mesoporous silica composite exhibited the highest glass transition temperature and activation energy for thermal degradation among all the epoxy-silica nano/micro-composites. Indeed, an average activation energy value of 148.86 kJ/mol was recorded for the thermal degradation of unfilled epoxy resin. The maximum activation energy range was instead recorded for composites loaded with mesoporous microsilica. The EMC-5p50 sample showed the highest mean value of 217.6 kJ/mol. This remarkable enhancement was ascribed to the polymer invading the silica pores and forging formidable interfacial bonds.

Synthesis of a Novel Rigid Semi-Alicyclic Dianhydride and Its Copolymerized Transparent Polyimide Films' Properties

A new series of colorless polyimides (CPIs) with outstanding thermal properties and mechanical properties were fabricated by the copolymerization of a novel dianhydride and 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) with 2,2′-bistrifluoromethyl benzidine (TFDB). The novel dianhydride, 10-oxo-9-phenyl-9-(trifluoromethyl)-9,10-dihydroanthracene-2,3,6,7-tetraacid dianhydride (3FPODA), possessed a rigid semi-alicyclic structure, –CF₃ and phenyl side groups, and an active carbonyl group. Benefitting from the special structure of 3FPODA, the glass transition temperatures (T_g) of the new CPIs improved from 330 °C to 377 °C, the coefficient of thermal expansion (CTE) decreased from 46 ppm/K to 24 ppm/K, and the tensile strength (T_S), tensile modulus (T_M), and elongation at break (E_B) increased from 84 MPa to 136 MPa, 3.2 GPa to 4.4 GPa, and 2.94% to 4.13% with the increasing amount of 3FPODA, respectively. Moreover, the active carbonyl group of the 3FPODA could enhance the CPI’s adhesive properties. These results render the new dianhydride 3FPODA an ideal candidate monomer for the fabrication of high-performance CPIs.

A Universal Study on the Effect Thermal Imidization Has on the Physico-Chemical, Mechanical, Thermal and Electrical Properties of Polyimide for Integrated Electronics Applications

Polyimides (PI) are a class of dielectric polymer used in a wide range of electronics and electrical engineering applications from low-voltage microelectronics to high voltage isolation. They are well appreciated because of their excellent thermal, electrical, and mechanical properties, each of which need to be optimized uniquely depending on the end application. For example, for high-voltage applications, the final polymer breakdown field and dielectric properties must be optimized, both of which are dependent on the curing process and the final physico-chemical properties of PI. The majority of studies to date have focused on a limited set of properties of the polymer and have analyzed the effect of curing from a physicochemical-, mechanical- or electrical-centric viewpoint. This paper seeks to overcome this, unifying all of these characterizations in the same study to accurately describe the universal effect of the cure temperature on the properties of PI and at an industrial processing scale. This paper reports the widest-ranging study of its kind on the effect that cure temperature has on the physico-chemical, mechanical, thermal and electrical properties of polyimide, specifically poly (pyromellitic dianhydride-co-4, 4′-oxydianiline) (PMDA/ODA). The optimization of the cure temperature is accurately studied not only regarding the degree of imidization (DOI), but also considering the entire physical properties. Particularly, the analysis elucidates the key role of the charge–transfer complex (CTC) on these properties. The results show that while the thermal and mechanical properties improve with both DOI and CTC formation, the electrical properties, particularly at high field conditions, show an antagonistic behavior enhancing with increasing DOI while degrading at higher temperatures as the CTC formation increases. The electrical characterization at low field presents an enhancement of the final PI properties likely due to the DOI. On the contrary, at high electric field, the conductivity results show an improvement at an intermediate temperature emphasizing an ideal compromise between a high DOI and PI chain packing when the thermal imidization process is performed over this equilibrium. This balance enables maximum performance to be obtained for the PI film with optimized electrical properties and, overall, optimal thermal and mechanical properties are achieved.

Super-heat resistant, transparent and low dielectric polyimides based on spirocyclic bisbenzoxazole diamines with Tg > 450°C

Maintaining ultra-high heat resistance and sufficient colorless transparency at the same time is a challenge for polymer materials because of conflicting design principles, but such materials are urgently needed for...

Terphenyl-based colorless and heat-resistant polyimides with a controlled molecular structure using methyl side groups

A methyl regulation strategy is proposed and verified to balance the optical and thermal properties of aromatic polyimides.

Origami-Inspired Fabrication: Self-Folding or Self-Unfolding of Cross-Linked-Polyimide Objects in Extremely Hot Ambience

A methodology that integrates a folding step into the conventional poly(amic acid)/polyimide film fabrication scheme is developed. It enables fabricating cross-linked polyimide (XCP2) films into a host of complex-shaped objects. Particularly unprecedented is that these origami (3D) objects can be unfolded into a 2D temporary shape under externally applied stress at T ∼ T_g and remain in the free-standing, 2D configuration at room temperature until spontaneously returning to the original 3D configuration at T > 200 °C. This 3D/2D/3D cycle can be repeated >20× without showing any sign of fatigue, as exemplified by a cubic box that shows visually no dimensional change after each cycle, and even after having been immersed in a 215 °C oil bath for 3 days. The enabling materials are two series XCP2s that are cross-linked by either a phosphine oxide-containing triamine (POTAm) or a trianhydride (POTAn). These cross-linked polyimides form tough and creasable films that possess ∼100% shape memory recovery and 99% shape memory fixity and withstand over 100 fatigue-prone, strain-stress-temperature cycles, while the linear version LCP2 film exhibits much lower shape memory recovery and fails after only 7 cycles.

High Operation Stability of Ultraflexible Organic Solar Cells with Ultraviolet-Filtering Substrates

Ultralightweight and flexible power sources are essential for driving textile or wearable electronic devices and soft robots because they do not induce discomfort or limit movement when they are attached to human skin, textiles, or soft actuators. Organic solar cells (OSCs) are good candidates for developing such power sources because they have the advantages of being lightweight and flexible. However, achieving operational stability and ultrathin shape simultaneously remains difficult because the ultrathin substrate cannot prevent the penetration of ultraviolet (UV) light, which is major a cause for the degradation of OSCs. Here, ultrathin OSCs that show great operational stability and high performance are reported. The 1.3 µm thick transparent polyimide utilized as a substrate can block light of 350 nm wavelength in the UV range by 90%. The ultrathin OSCs with the transparent polyimide substrate produce a power conversion efficiency (PCE) of 9.0% and realize both photostability and operational stability. The PCE was maintained at 90% after 3 h in a maximum power point tracking test, indicating much better operational stability than the reference rigid OSCs.

Thermally stable, highly efficient, ultraflexible organic photovoltaics

We have developed an ultraflexible organic photovoltaic (OPV) that achieves sufficient thermal stability of up to 120 °C and a high power conversion efficiency of 10% with a total thickness of 3 μm. By combining an inherently stable donor:acceptor blend as the active layer and ultrathin substrate and barriers with excellent thermal capability, we were able to overcome the trade-offs between efficiency, stability, and device thickness. The ultraflexible and thermally stable OPV can be easily integrated into textiles through the commercially available hot-melt process without causing performance degradation, thereby presenting great potential as a ubiquitous and wearable power source in daily life.

Flexible photovoltaics with extreme mechanical compliance present appealing possibilities to power Internet of Things (IoT) sensors and wearable electronic devices. Although improvement in thermal stability is essential, simultaneous achievement of high power conversion efficiency (PCE) and thermal stability in flexible organic photovoltaics (OPVs) remains challenging due to the difficulties in maintaining an optimal microstructure of the active layer under thermal stress. The insufficient thermal capability of a plastic substrate and the environmental influences cannot be fully expelled by ultrathin barrier coatings. Here, we have successfully fabricated ultraflexible OPVs with initial efficiencies of up to 10% that can endure temperatures of over 100 °C, maintaining 80% of the initial efficiency under accelerated testing conditions for over 500 hours in air. Particularly, we introduce a low-bandgap poly(benzodithiophene-cothieno[3,4-b]thiophene) (PBDTTT) donor polymer that forms a sturdy microstructure when blended with a fullerene acceptor. We demonstrate a feasible way to adhere ultraflexible OPVs onto textiles through a hot-melt process without causing severe performance degradation.