Supplement comprising of laccase and citric acid as an alternative for antibiotics: In vitro triggers of melanin production

Metabolomic and secretomic approach to the resistance features of the fungus Aspergillus niger IOC 4687 to copper stress

Metabolomic and secretomic analyses of Aspergillus niger IOC 4687 indicated the features of resistance of this strain to copper stress. To investigate the metabolites produced under oxidative stress conditions, gas chromatography-mass spectrometry analysis was performed. The secretome principal component analysis results showed that mannitol could be the main metabolite responsible for conferring resistance to the fungus, and gluconic acid is the possible cause of copper desorption because of its chelating ability. The meta-analysis of the metabolome of A. niger IOC 4687 indicated that a low concentration of sorbitol and ribonolactone during growth may be an indicator of oxidative stress.

Biocomposite Fabrication from Enzymatically Treated Nanocellulosic Fibers and Recycled Polylactic Acid

Recycled polylactic acid (PLAr) was reinforced with treated nanocellulosic hemp fibers for biocomposite fabrication. Cellulosic fibers were extracted from hemp fibers chemically and treated enzymatically. Treated nanocellulosic fibers (NCF) were analyzed by Fourier-transform infrared spectroscopy, X-ray diffraction, and scanning electron microscopy. Biocomposite fabrication was done with PLAr and three concentrations of treated NCF (0.1%, 0.25%, and 1% (v/v)) and then studied for thermal stability and mechanical properties. Increased thermal stability was observed with increasing NCF concentrations. The highest value for Young’s modulus was for PLAr + 0.25% (v/v) NCF (250.28 ± 5.47 MPa), which was significantly increased compared to PLAr (p = 0.022). There was a significant decrease in the tensile stress at break point for PLAr + 0.25% (v/v) NCF and PLAr + 1% (v/v) NCF as compared to control (p = 0.006 and 0.002, respectively). No significant difference was observed between treatments for tensile stress at yield.