High Performance Low Dielectric Constant Polymer with Good Film-Forming Ability Developed from Renewable Plant Oil (Anethole)

Effects of the Solvent Vapor Exposure on the Optical Properties and Photocatalytic Behavior of Cellulose Acetate/Perylene Free-Standing Films

The search to deliver added value to industrialized biobased materials, such as cellulose derivatives, is a relevant aspect in the scientific, technological and innovation fields at present. To address these aspects, films of cellulose acetate (CA) and a perylene derivative (Pr) were fabricated using a solution-casting method with two different compositions. Consequently, these samples were exposed to dimethylformamide (DMF) solvent vapors so that its influence on the optical, wettability, and topographical properties of the films could be examined. The results demonstrated that solvent vapor could induce the apparent total or partial preferential orientation/migration of Pr toward the polymer-air interface. In addition, photocatalytic activities of the non-exposed and DMF vapor-exposed films against the degradation of methylene blue (MB) in an aqueous medium using light-emitting diode visible light irradiation were comparatively investigated. Apparently, the observed improvement in the performance of these materials in the MB photodegradation process is closely linked to the treatment with solvent vapor. Results from this study have allowed us to propose the fabrication and use of the improved photoactivity "all-organic" materials for potential applications in dye photodegradation in aqueous media.

Research progress of low dielectric constant polymer materials

The advent of high frequency communication era presents new challenges for further development of dielectric polymer materials. In the field of communication, efficient signal transmission is critical. The lower the dielectric constant of the dielectric material used, the lower the signal delay and the higher the signal fidelity. The preparation of polymer materials with low dielectric constant or reduce the dielectric constant of polymer materials becomes a key research topic. Summarizing past progress and providing perspective, this paper primarily discusses the intrinsic low dielectric polymers, fluorine doped low dielectric polymers, and microporous low dielectric polymers, while predicting the research trend of low dielectric materials.

A bio-based low dielectric material at a high frequency derived from resveratrol

An efficient strategy to design and synthesize a low dielectric material at a high frequency of 5 GHz derived from renewable resveratrol.

A fluoropolymer with a low dielectric constant at a high frequency derived from bio-based anethole

The copolymerization between a fluoro-containing monomer derived from bio-based anethole and a benzocyclobutene (BCB)-containing monomer gave a polymer with good dielectric properties and low water uptake.

Biomass materials derived from anethole: conversion and application

Renewable biomass has attracted much attention because of its advantages over fossil fuels. Of these biomasses, anethole has been developed as a reliable monomer or precursor for diverse materials with potential applications.

Synthesis and properties of benzocyclobutene-terminated imide-containing cyano group

Benzocyclobutene (BCB) resins have aroused much interest because of their excellent physical and chemical properties. Unfortunately the temperature required to induce cross-linking in typical BCBs is higher than 250°C, which restricts their applications. In this study, a novel cyano-containing BCB-terminated imide monomer was synthesized through the reaction of 1-cyano-5-amino-benzocyclobutene with 4,4′-oxydiphthalic anhydride. This monomer allows a 50–100°C lower curing temperature in comparison with typical BCBs, and it is highly soluble in various solvents and can easily convert to cured film at 150–200°C. Because of the presence of rigid imide group and strong polar cyano group, the cured film exhibits excellent mechanical strength with tensile strength up to 87.8 MPa, high glass transition temperature up to 350°C, low coefficient of thermal expansion (36.9 ppm K−1), and outstanding planarity with the average surface roughness as low as 0.26 nm.