1
|
Mei S, Yi H, Zhao J, Xu Y, Shi L, Qin Y, Jiang Y, Guo J, Li Z, Wu L. High-density, highly sensitive sensor array of spiky carbon nanospheres for strain field mapping. Nat Commun 2024; 15:3752. [PMID: 38704400 PMCID: PMC11069524 DOI: 10.1038/s41467-024-47283-8] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Received: 07/01/2023] [Accepted: 03/22/2024] [Indexed: 05/06/2024] Open
Abstract
While accurate mapping of strain distribution is crucial for assessing stress concentration and estimating fatigue life in engineering applications, conventional strain sensor arrays face a great challenge in balancing sensitivity and sensing density for effective strain mapping. In this study, we present a Fowler-Nordheim tunneling effect of monodispersed spiky carbon nanosphere array on polydimethylsiloxane as strain sensor arrays to achieve a sensitivity up to 70,000, a sensing density of 100 pixel cm-2, and logarithmic linearity over 99% within a wide strain range of 0% to 60%. The highly ordered assembly of spiky carbon nanospheres in each unit also ensures high inter-unit consistency (standard deviation ≤3.82%). Furthermore, this sensor array can conformally cover diverse surfaces, enabling accurate acquisition of strain distributions. The sensing array offers a convenient approach for mapping strain fields in various applications such as flexible electronics, soft robotics, biomechanics, and structure health monitoring.
Collapse
Affiliation(s)
- Shuxing Mei
- Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, 220 Handan Rd., Shanghai, 200433, China
| | - Haokun Yi
- Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, 220 Handan Rd., Shanghai, 200433, China
| | - Jun Zhao
- Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, 220 Handan Rd., Shanghai, 200433, China
| | - Yanting Xu
- Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, 220 Handan Rd., Shanghai, 200433, China
| | - Lan Shi
- Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, 220 Handan Rd., Shanghai, 200433, China
| | - Yajie Qin
- Micro-Nano System Center, School of Information Science and Technology, Fudan University, 220 Handan Rd., Shanghai, 200433, China
| | - Yizhou Jiang
- Micro-Nano System Center, School of Information Science and Technology, Fudan University, 220 Handan Rd., Shanghai, 200433, China
| | - Jiajie Guo
- State Key Laboratory of Intelligent Manufacturing Equipment and Technology, School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, Hubei, China
| | - Zhuo Li
- Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, 220 Handan Rd., Shanghai, 200433, China.
| | - Limin Wu
- Department of Materials Science and State Key Laboratory of Molecular Engineering of Polymers, Fudan University, 220 Handan Rd., Shanghai, 200433, China.
| |
Collapse
|
2
|
Huang Z, Lin Y. Transfer printing technologies for soft electronics. NANOSCALE 2022; 14:16749-16760. [PMID: 36353821 DOI: 10.1039/d2nr04283e] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 06/16/2023]
Abstract
Soft electronics have received increasing attention in recent years, owing to their wide range of applications in dynamic nonplanar surface integration electronics that include skin electronics, implantable devices, and soft robotics. Transfer printing is a widely used assembly technology for micro- and nano-fabrication, which enables the integration of functional devices with flexible or elastomeric substrates for the manufacturing of soft electronics. Through advanced materials and process design, numerous impressive studies related to transfer printing strategies and applications have been proposed. Herein, a discussion of transfer printing technologies toward soft electronics in terms of mechanisms and example demonstrations is provided. Moreover, the perspectives on the potential challenges and future directions of this field are briefly discussed.
Collapse
Affiliation(s)
- Zhenlong Huang
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China.
- Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen 518110, Guangdong, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China
- Research Centre for Information Technology, Shenzhen Institute of Information Technology, Shenzhen 518172, Guangdong, China
| | - Yuan Lin
- School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China.
- Shenzhen Institute for Advanced Study, University of Electronic Science and Technology of China, Shenzhen 518110, Guangdong, China
- State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, Sichuan, China
| |
Collapse
|
3
|
Qadir A, Le TK, Malik M, Amedome Min-Dianey KA, Saeed I, Yu Y, Choi JR, Pham PV. Representative 2D-material-based nanocomposites and their emerging applications: a review. RSC Adv 2021; 11:23860-23880. [PMID: 35479005 PMCID: PMC9036868 DOI: 10.1039/d1ra03425a] [Citation(s) in RCA: 14] [Impact Index Per Article: 4.7] [Reference Citation Analysis] [Abstract] [Track Full Text] [Download PDF] [Figures] [Journal Information] [Subscribe] [Scholar Register] [Received: 05/01/2021] [Accepted: 06/24/2021] [Indexed: 12/16/2022] Open
Abstract
Composites (or complex materials) are formed from two or many constituent materials with novel physical or chemical characteristics when integrated. The individual components can be combined to create a unique composite material through mechanical transfer, physical stacking, exfoliation, derivative chemical mixtures, mixtures of solid solutions, or complex synthesis processes. The development of new composites based on emerging 2D nanomaterials has allowed for outstanding achievements with novel applications that were previously unknown. These new composite materials show massive potential in emerging applications due to their exceptional properties, such as being strong, light, cheap, and highly photodegradable, and their ability to be used for water splitting and energy storage compared to traditional materials. The blend of existing polymers and 2D materials with their nanocomposites has proven to be immediate solutions to energy and food scarcity in the world. Although much literature has been reported in the said context, we tried to provide an understanding about the relationship of their mechanisms and scope for future application in a comprehensive way. In this review, we briefly summarize the basic characteristics, novel physical and chemical behaviors, and new applications in the industry of the emerging 2D-material-based composites. Composites (or complex materials) are formed from two or many constituent materials with novel physical or chemical characteristics when integrated.![]()
Collapse
Affiliation(s)
- Akeel Qadir
- Research Center of Smart Sensing Chips, Ningbo Institute of Northwestern Polytechnical University Ningbo 315103 China.,Key Laboratory of Micro/Nano Systems for Aerospace (Ministry of Education), Shaanxi Province Key Laboratory of Micro and Nano Electro-Mechanical Systems, Department of Microsystems Engineering, Northwestern Polytechnical University Xi'an 710072 China
| | - Top Khac Le
- Department of Physics and Energy Harvest Storage Research Center, University of Ulsan Ulsan 44610 South Korea
| | - Muhammad Malik
- Department of Electrical Engineering and Technology, Government College University Faisalabad 38000 Pakistan
| | | | - Imran Saeed
- Institute of Aviation Studies, University of Management and Technology Lahore 54000 Pakistan
| | - Yiting Yu
- Research Center of Smart Sensing Chips, Ningbo Institute of Northwestern Polytechnical University Ningbo 315103 China.,Key Laboratory of Micro/Nano Systems for Aerospace (Ministry of Education), Shaanxi Province Key Laboratory of Micro and Nano Electro-Mechanical Systems, Department of Microsystems Engineering, Northwestern Polytechnical University Xi'an 710072 China
| | - Jeong Ryeol Choi
- Department of Nanoengineering, Kyonggi University Suwon 16227 South Korea
| | - Phuong V Pham
- ZJU-Hangzhou Global Scientific and Technological Innovation Center (HIC), School of Micro-Nano Electronics, Zhejiang University Hangzhou 310027 China
| |
Collapse
|