Reflective and conductive surface-silvered polyimide films prepared by surface graft copolymerization and electroless plating

Ag NPs-Assisted Synthesis of Stable Cu NPs on PET Fabrics for Antibacterial and Electromagnetic Shielding Performance

In this study, Cu/Ag/polydopamine (PDA)/polyester (PET) fabrics were fabricated for multi-functional textiles. The PET fabrics were firstly modified by dopamine to form a polydopamine (PDA) layer on the fiber surface, then Ag nanoparticles (Ag NPs) were anchored on fiber surface through chelation between PDA and Ag+ ions, and the Ag NPs were further used as catalytic seeds for in situ reduction of Cu nanoparticles (Cu NPs). The surface morphology, chemistry, and crystalline structure of the prepared PET fabrics were characterized by scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDS), and X-ray diffraction (XRD). As expected, Cu NPs were evenly dispersed on the surface of fibers. The Cu/Ag/PDA/PET fabrics showed good antibacterial property against Escherichia coli and exhibited excellent electromagnetic interference (EMI) shielding ability. The Cu/Ag/PDA/PET fabrics with high performance antibacterial and EMI shielding properties can be applied as functional protective textiles.

Polymer Interface Molecular Engineering for E-Textiles

Wearable electronics, regarded as the next generation of conventional textiles, have been an important concept in the study of e-textiles. Conductive fibres are the upstreaming of e-textiles and have witnessed the booming development in recent years. However, little work has focused on improving the wash ability and durability of conductive fibres. As a new approach to manufacturing conductive fibres, Polymer Interface Molecular Engineering (PIME) is starting to be employed recently, to build up an interfacial layer on polymeric fibre surfaces; this interfacial layer services as a platform to anchor catalysts for the following metal Electroless Deposition (ELD). The designed interfacial layer significantly increases adhesion between polymeric substrates and coating metal layers, to improve the durability of e-textiles. This review highlights recent research into different molecular and architectural design strategies, and its potential application for wearable electronics. Further challenges and opportunities in this field are also discussed critically.

Ultrasound-assisted copper deposition on a polymer membrane and application for methanol steam reforming

Copper particles were electrolessly deposited on a palladium aerosol activated polymer membrane in the presence of ultrasound. An application of ultrasound introduced a faster deposition (220 μg min(-1) in deposition rate) and finer copper particles (9 nm in crystallite size) than those (11 and 41 μg min(-1); 27 and 32 nm) in the absence of ultrasound (i.e. respectively 20 and 45 °C in bath temperature with mechanical agitation). A better performance of methanol steam reforming (0.59 in mean conversion during 5h operation; 1.3 and 1.6 times respectively higher than those from 20 to 45 °C cases) at a 300 °C reaction temperature was materialized for the ultrasound application, probably due to a finer (i.e. a more textured) copper particle deposition on a polymer membrane.

Fabrication of a pure, uniform electroless silver film using ultrafine silver aerosol particles

To obtain evenly distributed pure Ag particles with a narrow size distribution on a polymer membrane, a novel activation procedure with an environmentally friendly, cost-effective method was utilized as a pretreatment before electroless Ag deposition. The pretreatment was first performed on an untreated membrane surface by collecting ultrafine ambient spark-generated Ag aerosol particles. After annealing, the electroless Ag film was fabricated on the collected aerosol particles in the Ag electroless bath. Experimental characterizations showed that the ultrafine Ag particles were uniformly anchored onto the membrane surface through pretreatment, resulting in a pure Ag film of closely packed particles with a narrow size distribution on the membrane, and the properties were comparable to those of an Ag film on wet Sn-Ag-activated membranes.

Selective electroless metallization of patterned polymeric films for lithography applications

The fabrication of electrical interconnects to provide power for and communication with computers as their component complementary metal oxide semiconductor (CMOS) devices continue to shrink in size presents significant materials and processing compatibility challenges. We describe here our efforts to address these challenges using top-surface imaging and hybrid photoresist/self-assembled monolayer patterning approaches, in conjunction with selective electroless metal deposition, to develop processes capable of fabricating appropriate submicron and nanoscale metal features useful as electrical interconnects, as well as plasma-etch-resistant masks and metal diffusion barriers. Our efforts focus on the development of cost-effective methods compatible with a manufacturing environment that satisfy materials and process constraints associated with CMOS device production. We demonstrate the fabrication of approximately 50-nm-width features in metal with high fidelity and sufficient control of edge acuity to satisfy current industry design rules using our processes and discuss the challenges and opportunities for fabrication of analogous sub-10-nm metal features.