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Li X, Zhou Y, Bao Y, Wei W, Fei X, Li X, Liu X. Bismaleimide/Phenolic/Epoxy Ternary Resin System for Molding Compounds in High-Temperature Electronic Packaging Applications. Ind Eng Chem Res 2022. [DOI: 10.1021/acs.iecr.2c00048] [Citation(s) in RCA: 3] [Impact Index Per Article: 1.5] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/29/2022]
Affiliation(s)
- Xiaohan Li
- Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Wuxi, Jiangsu 214122, PR China
| | - Yanglong Zhou
- Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Wuxi, Jiangsu 214122, PR China
| | - Ying Bao
- Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Wuxi, Jiangsu 214122, PR China
| | - Wei Wei
- Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Wuxi, Jiangsu 214122, PR China
| | - Xiaoma Fei
- Wuxi Chuangda Advanced Materials Co., Ltd., Wuxi, Jiangsu 214028, PR China
| | - Xiaojie Li
- Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Wuxi, Jiangsu 214122, PR China
| | - Xiaoya Liu
- Key Laboratory of Synthetic and Biological Colloids, Ministry of Education, School of Chemical and Material Engineering, Jiangnan University, Wuxi, Jiangsu 214122, PR China
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