Development of a novel toughener for epoxy resins

Curing Behavior of UV-Initiated Surface-Modified Nano-TiO2/Epoxy Resin Prepolymers and the Properties of Cured Composites

Nano-titanium dioxides (nano-TiO2) surface modified with isopropyl tri(dioctylpyrophosphate) titanate (NDZ-201), a titanate coupling agent, and 3-glycidoxypropyltrimethoxysilane (KH-560), a silane coupling agent, were separately mixed with bisphenol A epoxy resin (DEGBA) prepolymer and then cured using a UV-normal temperature synergistic curing process. Then, the isothermal curing process of the system was investigated by differential scanning calorimetry (DSC). The relationship between the organization structures, mechanical properties, and heat resistance properties of the cured composites and material formulation was studied, and the DSC results showed that the addition of nano-TiO2 reduced the curing reaction rate constant k1 and increased the k2 of the prepolymer, while the activation energy of the curing reaction after UV irradiation Ea1 decreased, and the activation energy in the middle and later periods Ea2 increased. The characterization results of the composite material showed that nano-TiO2 as a scattering agent reduced the photoinitiation efficiency of UV light, and due to its obvious agglomeration tendency in the epoxy resin, the mechanical properties of the composite material were poor. The dispersibility of the coupling-agent-modified nano-TiO2 in the epoxy resin was greatly enhanced, and the mechanical and heat resistance properties of the composite material improved remarkably. The comparison results of the two coupling agents showed that NDZ-201 had better performance in increasing the impact strength by 6.8% (minimum value, the same below) and the maximum thermal decomposition rate temperature by 4.88 °C of the composite, while KH-560 improved the tensile strength by 7.3% and the glass transition temperature (Tg) by 3.34 °C of the composite.

Sound Insulation Properties of Hollow Polystyrene Spheres/Polyethylene Glycol/Epoxy Composites

The generation of noise requires a noise source, transmission path, and passive acceptance target of noise, all of which are indispensable. Blocking the propagation path of noise is one of the available means when the existence of the noise source and passive receiving target cannot be addressed. This is an effective way to prevent noise pollution, often using sound insulation materials to block the path of noise transmission. In this work, composites with excellent sound insulation properties were designed and prepared. These composites, using epoxy resin (EP) as the matrix, polyethylene glycol (PEG), and hollow polystyrene spheres (HPS), were added to epoxy resin as a toughening agent and functional filler to prepare the ternary HPS/PEG/EP composites. The soundproofing results showed that when the thickness of the sample was 3 mm, the average sound transmission loss (STL) value of the neat EP and the HPS/PEG/EP composites with an HPS 32 vol% was up to 19.0 dB and 42.1 dB, and the STL values of the composites were increased by approximately 120% compared to the pure epoxy. When the sample was 10 mm thick, the average STL value of the HPS/PEG/EP composites with HPS 32 vol% contents was enhanced to 55.7 dB.

A facile approach to the scalable preparation of thermoplastic/carbon nanotube composites

Disentangling and dispersing multiwalled carbon nanotubes (MWCNTs) in thermoplastics by the existing melt compounding facilities where neither solvent nor liquid chemicals are allowed remains a great challenge. This challenge is addressed herein by combining ball milling with melt compounding. Specifically, ball milling is applied to disentangle MWCNTs and to eventually liberate each tube from agglomeration, and then the tubes are melt compounded with SSFs (PA6). A uniformly distributed MWCNT network is observed; obvious load transfer from the matrix to the tubes is evidenced by the presence of many firmly embedded tubes on the fracture surface. The electrical conductivity percolation threshold of PA6/MWCNT composites is found to be 2.5-3.0 wt%, in comparison with 5.0-8.0 wt% for PA6/stainless steel fiber composites. The PA6/MWCNT composite at 10.0 wt% shows a 76% increase in flexural modulus and 58% in flexural strength.

Processable 3-nm thick graphene platelets of high electrical conductivity and their epoxy composites

Graphene platelets (GnPs) are a class of novel 2D nanomaterials owing to their very small thickness (∼3 nm), high mechanical strength and electric conductivity (1460 S cm(-1)), and good compatibility with most polymers as well as cost-effectiveness. In this paper we present a low-cost processing technique for producing modified GnPs and an investigation of the electrical and mechanical properties of the resulting composites. After dispersing GnPs in solvent N-methyl-2-pyrrolidone, a long-chain surfactant (Jeffamine D 2000, denoted J2000) was added to covalently modify GnPs, yielding J2000-GnPs. By adjusting the ratio of GnPs to the solvent, the modified GnPs show different average thickness and thus electrical conductivity ranging from 694 to 1200 S cm(-1). To promote the exfoliation and dispersion of J2000-GnPs in a polymeric matrix, they were dispersed in the solvent again and further modified using diglycidyl ether of bisphenol A (DGEBA) producing m-GnPs, which were then compounded with an epoxy resin for the development of epoxy/m-GnP composites. A percolation threshold of electrical volume resistivity for the resulting composites was observed at 0.31 vol%. It was found that epoxy/m-GnP composites demonstrated far better mechanical properties than those of unmodified GnPs of the same volume fraction. For example, m-GnPs at 0.25 vol% increased the fracture energy release rate G1c from 0.204 ± 0.03 to 1.422 ± 0.24 kJ m(-2), while the same fraction of unmodified GnPs increased G1c to 1.01 ± 0.24 kJ m(-2). The interface modification also enhanced the glass transition temperature of neat epoxy from 58.9 to 73.8 °C.

From carbon nanotubes and silicate layers to graphene platelets for polymer nanocomposites

In spite of extensive studies conducted on carbon nanotubes and silicate layers for their polymer-based nanocomposites, the rise of graphene now provides a more promising candidate due to its exceptionally high mechanical performance and electrical and thermal conductivities. The present study developed a facile approach to fabricate epoxy-graphene nanocomposites by thermally expanding a commercial product followed by ultrasonication and solution-compounding with epoxy, and investigated their morphologies, mechanical properties, electrical conductivity and thermal mechanical behaviour. Graphene platelets (GnPs) of 3.57 ± 0.50 nm in thickness were created after the expanded product was dispersed in tetrahydrofuran using 60 min ultrasonication. Since epoxy resins cured by various hardeners are widely used in industries, we chose two common hardeners: polyoxypropylene (J230) and 4,4'-diaminodiphenylsulfone (DDS). DDS-cured nanocomposites showed a better dispersion and exfoliation of GnPs, a higher improvement (573%) in fracture energy release rate and a lower percolation threshold (0.612 vol%) for electrical conductivity, because DDS contains benzene groups which create π-π interactions with GnPs promoting a higher degree of dispersion and exfoliation of GnPs during curing. This research pointed out a potential trend where GnPs would replace carbon nanotubes and silicate layers for many applications of polymer nanocomposites.