Effect of graphite and carbon fiber contents on the morphology and properties of thermally conductive composites based on polyamide 6

Thermally Conductive and Electrically Insulating Polymer-Based Composites Heat Sinks Fabricated by Fusion Deposition Modeling

This study explores the potential of novel boron nitride (BN) microplatelet composites with combined thermal conduction and electrical insulation properties. These composites are manufactured through Fusion Deposition Modeling (FDM), and their application for thermal management in electronic devices is demonstrated. The primary focus of this work is, therefore, the investigation of the thermoplastic composite properties to show the 3D printing of lightweight polymeric heat sinks with remarkable thermal performance. By comparing various microfillers, including BN and MgO particles, their effects on material properties and alignment within the polymer matrix during filament fabrication and FDM processing are analyzed. The characterization includes the evaluation of morphology, thermal conductivity, and mechanical and electrical properties. Particularly, a composite with 32 wt% of BN microplatelets shows an in-plane thermal conductivity of 1.97 W m-1 K-1, offering electrical insulation and excellent printability. To assess practical applications, lightweight pin fin heat sinks using these composites are designed and 3D printed. Their thermal performance is evaluated via thermography under different heating conditions. The findings are very promising for an efficient and cost-effective fabrication of thermal devices, which can be obtained through extrusion-based Additive Manufacturing (AM), such as FDM, and exploited as enhanced thermal management solutions in electronic devices.

Impact of the Processing-Induced Orientation of Hexagonal Boron Nitride and Graphite on the Thermal Conductivity of Polyethylene Composites

Emergent heat transfer and thermal management applications require polymer composites with enhanced thermal conductivity (κ). Composites filled with non-spherical fillers, such as hexagonal boron nitride (hBN) and Graphite (Gr), suffer from processing-induced filler orientations, resulting in anisotropic κ, commonly low in the through-plane direction. Here, the effects of extrusion and compression molding-induced orientations on κ of hBN- and Gr-filled polyethylene composites were investigated. The effect of extrusion on the hBN orientation was studied using dies of various shapes. The shaped extrudates exhibited hBN orientations parallel to the extrusion flow direction, which prompted additional hBN orientation during compression molding. κ of the composites produced with shaped extrudates varied from 0.95 to 1.67 W m-1 K-1. Pelletizing and crushing the extrudates improved κ, by exploiting and eliminating the effect of extrusion-induced hBN orientations. Gr-filled composites showed better κ than hBN composites due to the higher intrinsic conductivity and bigger particle sizes. A maximum κ of 5.1 and 11.8 W m-1 K-1 was achieved in composites with oriented hBN and Gr through a thin rectangular die and stacking the sheets to fabricate composites with highly oriented fillers.

Improving Thermal Conductivity of Injection Molded Polycarbonate/Boron Nitride Composites by Incorporating Spherical Alumina Particles: The Influence of Alumina Particle Size

In this work, the influences of alumina (Al₂O₃) particle size and loading concentration on the properties of injection molded polycarbonate (PC)/boron nitride (BN)/Al₂O₃ composites were systematically studied. Results indicated that both in-plane and through-plane thermal conductivity of the ternary composites were significantly improved with the addition of spherical Al₂O₃ particles. In addition, the thermal conductivity of polymer composites increased significantly with increasing Al₂O₃ concentration and particle size, which were related to the following factors: (1) the presence of spherical Al₂O₃ particles altered the orientation state of flaky BN fillers that were in close proximity to Al₂O₃ particles (as confirmed by SEM observations and XRD analysis), which was believed crucial to improving the through-plane thermal conductivity of injection molded samples; (2) the presence of Al₂O₃ particles increased the filler packing density by bridging the uniformly distributed BN fillers within PC substrate, thereby leading to a significant enhancement of thermal conductivity. The in-plane and through-plane thermal conductivity of PC/50 μm-Al₂O₃ 40 wt%/BN 20 wt% composites reached as high as 2.95 and 1.78 W/mK, which were 1183% and 710% higher than those of pure PC, respectively. The prepared polymer composites exhibited reasonable mechanical performance, and excellent electrical insulation properties and processability, which showed potential applications in advanced engineering fields that require both thermal conduction and electrical insulation properties.

Numerical Computation of Anisotropic Thermal Conductivity in Injection Molded Polymer Heat Sink Filled with Graphite Flakes

The use of polymer composites as a replacement for commonly applied materials in industry has been on the rise in recent decades. Along with the development of computer software, the desire to predict the behavior of new products is thus increasing. Traditional additives in the form of fibers cause anisotropic properties of the whole product. The subject of the presented study is a polymer heat sink prototype with a thermally conductive filler in the form of graphite flakes, which differs from the commonly used fibers. Three simplified approaches are introduced to model the thermal conductivity anisotropy of an entire heat sink. Each model is subjected to an inverse heat conduction problem, the output of which are thermal conductivity values. These are optimized to minimize the difference between simulated and experimental temperatures at selected locations in the model. The approaches are compared with each other with respect to their error against the experimentally obtained results. The goal is to find a sufficiently simplified approach that can be applied to products of various geometries. This would remove the costly and time-consuming need for mold production and experimental testing.

Effects of Mixing Ratio of Hybrid Carbonaceous Fillers on Thermal Conductivity and Mechanical Properties of Polypropylene Matrix Composites

This study investigated the effects of carbon fibers and graphite flakes on the composite materials' heat dissipation properties and mechanical strength with various hybrid ratios in the matrix. Carbon fibers and graphite flakes with high thermal conductivity showed efficiency in heat dissipation performance, and mechanical strength was reinforced by carbon fiber. However, the heat dissipation performance and mechanical strength were greatly changed according to the mixing ratio. The optimal filler mixing ratio was derived for inducing the enhanced physical properties of the composites reinforced by hybrid fillers with different shapes.

High-Performance Thermal Interface Materials with Magnetic Aligned Carbon Fibers

Thermal interface materials with high thermal conductivity and low hardness are crucial to the heat dissipation of high-power electronics. In this study, a high magnetic field was used to align the milled carbon fibers (CFs, 150 μm) in silicone rubber matrix to fabricate thermal interface materials with an ordered and discontinuous structure. The relationship among the magnetic field density, the alignment degree of CFs, and the properties of the resulting composites was explored by experimental study and theoretical analysis. The results showed higher alignment degree and enhanced thermal conductivity of composites under increased magnetic flux density within a certain curing time. When the magnetic flux density increased to 9 T, the CFs showed perfect alignment and the composite showed a high thermal conductivity of 11.76 W/(m·K) with only 20 vol% CF loading, owing to the ordered structure. Meanwhile, due to the low filler loading and discontinuous structure, a low hardness of 60~70 (shore 00) was also realized. Their thermal management performance was further confirmed in a test system, revealing promising applications for magnetic aligned CF–rubber composites in thermal interface materials.

Preparation and Properties of Carbon Fiber/Carbon Nanotube Wet-Laid Composites

In this study, carbon nanotubes (CNTs) were introduced into carbon fiber (CF) wet-laid composites as functional nano-fillers to fabricate multi-functional composites with improved mechanical, electrical, and thermal properties. It was considered that the wet-laid process was most suitable in order to introduce filler into brittle and rigid carbon fiber substrates, and we established the conditions of the process that could impart dispersibility and bonding between the fibers. We introduced polyamide 6 (PA6) short fiber, which is the same polymeric material as the stacking film, into carbon fiber and CNT mixture to enhance the binding interactions between carbon fiber and CNTs. Various types of CNT-reinforced carbon fiber wet-laid composites with PA6 short fibers were prepared, and the morphology, mechanical and electrical properties of the composites were estimated. As CNT was added to the carbon fiber nonwoven, the electrical conductivity increased by 500% but the tensile strength decreased slightly. By introducing short fibers of the same material as the matrix between CNT–CF wet-laid nonwovens, it was possible to find optimum conditions to increase the electrical conductivity while maintaining mechanical properties.

Synergistic Effects of Various Ceramic Fillers on Thermally Conductive Polyimide Composite Films and Their Model Predictions

In this study, thermally conductive composite films were fabricated using an anisotropic boron nitride (BN) and hybrid filler system mixed with spherical aluminum nitride (AlN) or aluminum oxide (Al₂O₃) particles in a polyimide matrix. The hybrid system yielded a decrease in the through-plane thermal conductivity, however an increase in the in-plane thermal conductivity of the BN composite, resulting from the horizontal alignment and anisotropy of BN. The behavior of the in-plane thermal conductivity was theoretically treated using the Lewis–Nielsen and modified Lewis–Nielsen theoretical prediction models. A single-filler system using BN exhibited a relatively good fit with the theoretical model. Moreover, a hybrid system was developed based on two-population approaches, the additive and multiplicative. This development represented the first ever implementation of two different ceramic conducting fillers. The multiplicative-approach model yielded overestimated thermal conductivity values, whereas the additive approach exhibited better agreement for the prediction of the thermal conductivity of a binary-filler system.

Anisotropy-Driven High Thermal Conductivity in Stretchable Poly(vinyl alcohol)/Hexagonal Boron Nitride Nanohybrid Films

Controlling the anisotropy of two-dimensional materials with orientation-dependent heat transfer characteristics is a possible solution to resolve severe thermal issues in future electronic devices. We demonstrate a dramatic enhancement in the in-plane thermal conductivity of stretchable poly(vinyl alcohol) (PVA) nanohybrid films containing small amounts (below 10 wt %) of hexagonal boron nitride ( h-BN) nanoplatelets. The h-BN nanoplatelets were homogeneously dispersed in the PVA polymer solution by ultrasonication without additional surface modification. The mixture was used to prepare thermally conductive nanocomposite films. The in-plane thermal conductivity of the resulting PVA/ h-BN nanocomposite films increased to 6.4 W/mK when the strain was increased from 0 to 100% in the horizontal direction. More specifically, the thermal conductivity of a PVA/ h-BN composite film with 10 wt % filler loading can be improved by up to 32 times as compared to pristine PVA. This outstanding thermal conductivity value is significantly larger than that of materials currently used in in-plane thermal management systems. This result is attributed to the anisotropic alignment of h-BN particles in the PVA chain matrix during stretching, enhancing phonon conductive paths and hence improving the thermal conductivity and thermal properties of PVA/ h-BN nanocomposite films. These polymer nanocomposites have low cost as the amount of expensive conductive fillers is reduced and can be potentially used as high-performance materials for thermal management systems such as heat sink and thermal interface materials, for future electronic and electrical devices.

Enhancement of thermal conductivity in polyamide-6/graphene composites via a “bridge effect” of silicon carbide whiskers

It is urgent to manufacture a polymer composite that has high thermal conductivity (especially in the through-plane direction) and mechanical properties simultaneously to meet the heat dissipation requirement of electronic devices.

Preparation of polyvinylidene fluoride/expanded graphite composites with enhanced thermal conductivity via ball milling treatment

Herein, we illustrate a facile strategy to improve the thermal conductivity of polyvinylidene fluoride/expanded graphite (PVDF/EG) composites by pre-treatment of EG via ball milling.

Emerging trends in graphene carbon based polymer nanocomposites and applications

Recent sustainable advancement in carbon nanotechnology has further broadened the scope of application of carbon based materials, especially graphene based polymer nanocomposites, in emerging applications. This paper mainly focuses on recently emerging trends in synthesis and properties of graphene based polymer nanocomposites, in addition to brief discussion of some selected carbon based nanocomposites for application in electromagnetic interference shielding efficiency, terahertz shielding efficiency, electrostatic dissipation, thermal interface materials, sensors, and energy storage. Finally, an overview of recently emerging trends in sustainability, economies of scale, and emerging commercial market share of these materials is also presented.

Formation of thermally conductive networks in isotactic polypropylene/hexagonal boron nitride composites via “Bridge Effect” of multi-wall carbon nanotubes and graphene nanoplatelets

Efficiently thermal conductive networks were fabricated in the iPP/h-BN composites by the “bridge effect” of MWCNTs or GNPs.

Thermally conductive polyamide 6/carbon filler composites based on a hybrid filler system

We explored the use of a hybrid filler consisting of graphite nanoplatelets (GNPs) and single walled carbon nanotubes (SWCNTs) in a polyamide 6 (PA 6) matrix. The composites containing PA 6, powdered GNP, and SWCNT were melt-processed and the effect of filler content in the single filler and hybrid filler systems on the thermal conductivity of the composites was examined. The thermal diffusivities of the composites were measured by the standard laser flash method. Composites containing the hybrid filler system showed enhanced thermal conductivity with values as high as 8.8 W (m · K)^-1, which is a 35-fold increase compared to the thermal conductivity of pure PA 6. Thermographic images of heat conduction and heat release behaviors were consistent with the thermal conductivity results, and showed rapid temperature jumps and drops, respectively, for the composites. A composite model based on the Lewis-Nielsen theory was developed to treat GNP and SWCNT as two separate types of fillers. Two approaches, the additive and multiplicative approaches, give rather good quantitative agreement between the predicted values of thermal conductivity and those measured experimentally.

Fabrication and characterization of thermally conductive composites based on poly(butylene terephthalate)/glass fiber-silicon carbide

A new method is reported for preparing poly(butylene terephthalate) (PBT)/glass fiber (GF)-silicon carbide (SiC) composites. GFs were coated with SiC particles firstly and then the treated GFs (GF-SiC) were mixed with PBT. Scanning electron microscopy (SEM) images showed that some SiC particles dispersed on the surfaces of GFs, and other particles fell off from surfaces of GFs and dispersed around GFs after processing. The thermal conductivities of composites are increased with increase of GF-SiC. At 30 wt% GF-SiC, the thermal conductivity of composites reached 0.6392 W/mK, which improved nearly 160% compared to that of neat polymer. Differential scanning calorimetry (DSC) results indicated that GF-SiC increased crystallinity of PBT compared with that of neat PBT and had no obvious influence on the melting temperature of PBT. The crystallization temperature (Tc) and glass transition temperature of all samples shifted to a higher temperature. The addition of GF-SiC can improve the thermal stability of PBT/GF-SiC composites obviously. Dynamic mechanical properties and dielectric properties were also discussed in this paper.

Thermal Conductive and Mechanical Properties of Polymeric Composites Based on Solution-Exfoliated Boron Nitride and Graphene Nanosheets: A Morphology-Promoted Synergistic Effect

In this work, we reported a synergistic effect of boron nitride (BN) with graphene nanosheets on the enhancement of thermal conductive and mechanical properties of polymeric composites. Here, few layered BN (s-BN) and graphene (s-GH) were used and obtained by liquid exfoliation method. The polystyrene (PS) and polyamide 6 (PA) composites were obtained via solution blending method and subsequently hot-pressing. The experimental results suggested that the thermal conductivity (TC) of the PS and PA composites increases with additional introduction of s-BN. For example, compared with the composites containing 20 wt % s-GH, additional introduction of only 1.5 wt % s-BN could increase the TC up to 38 and 34% in polystyrene (PS) and polyamide 6 (PA) matrix, respectively. Meanwhile, the mechanical properties of the composites were synchronously enhanced. It was found that s-BN filled in the interspaces of s-GH sheets and formed s-BN/s-GH stacked structure, which were helpful for the synchronously improving TC and mechanical properties of the polymeric materials.