Network toughening of additively manufactured, high glass transition temperature materials via sequentially cured, interpenetrating polymers

Preparation and Mechanical Properties of Flexible Prepreg Resin with High Strength and Low Creep

In this study, aiming at the problem of low strength and high creep caused by medium-low modulus flexible resin based on the formulation design idea of high-molecular-weight epoxy resin (E12)-reinforced flexible epoxy-terminated urethane resin (EUR), a flexible epoxy prepreg resin with high strength and low bending creep was prepared to be suitable for hot melt processing technology. Flexible EUR was synthesized by grafting flexible polyurethane segments onto the epoxy side chain by urethane bonding. By adjusting the ratio of E12 and EUR, the effects of different ratios of the two components on the mechanical properties and viscoelasticity of the resin were systematically studied with dicyandiamide as the latent curing system. Research has found that when the E12 content is between 20%wt and 40%wt, the resin system has the best coating viscosity at 65 °C to 85 °C. The molecular weight and the content of aromatic heterocyclic groups of the resin determine the strength and creep behavior of the resin. When the content of E12 in the system is less than 50%wt, modulus and strength increase linearly, but after more than 50%wt E12 content, the modulus is almost unchanged and the strength begins to decrease. By increasing the content of E12 in the resin, the creep behavior of the resin is greatly reduced. When the content of E12 increases to 50%wt, the bending creep is the lowest.

Superior Properties through Feedstock Development for Vat Photopolymerization Additive Manufacturing of High-Performance Biobased Feedstocks

Vat photopolymerization additive manufacturing (Vat AM) technologies have found niche industrial use being able to produce personalized parts in moderate quantity. However, Vat AM lacks in its ability to produce parts of satisfactory thermal and mechanical properties for structural applications. The purpose of this investigation was to develop high-performance resins with glass transition temperatures (Tg) above 200 °C for Vat AM, evaluate the properties of the produced thermosets and establish a structure–property relationship of the thermosets produced. Herein, we have developed SLA-type resins that feature bio-derived monomer hesperetin trimethacrylate (HTM) synthesized from the flavonone hesperetin. Diluents 4-acryloyl morpholine, styrene, 4-methyl styrene and 4-tert butylstyrene (tbutylsty) were photocured with HTM as the monomer and all produced thermosets with Tg values above 200 °C. Investigations of suitable crosslinkers urethane dimethacrylate, the vinyl ester CN 151 and Ebecryl 4859 (Eb4859) showed that each crosslinker displayed different benefits when formulated with HTM as the monomer and tbutylSty as the diluent (HTM:crosslinker:tbutylSty with mass ratio 2:1:2). The crosslinker CN 151 produced the thermoset of greatest onset of thermal decomposition temperature (T₀) of 352 °C. Eb4859 produced the thermoset of highest tensile strength, 19 ± 7 MPa, amongst the set of varied crosslinkers. The formulation featuring UDM (HTM:UDM:tbutysty) offered ease of processing and was seemingly the easiest to print. Investigations of reactive diluent showed that styrene produced the thermoset of the highest extent of cure and the overall highest tensile strength, 25 ± 5 MPa, while tbutylSty produced the thermoset with the greatest Tan-δ Tg, 231 °C. HTM was synthesized, formulated with diluents, crosslinkers and initiators. The HTM resins were then 3D printed to produce thermosets of Tg values greater than 200 °C. The polymer properties were evaluated and a structure–reactivity relationship was discussed.