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For: Jiao L, Zhang Y, Du Z, Dai X, Wang H, Dong Z, Yao H, Qiu X. Ultra‐high T g and ultra‐low coefficient of thermal expansion polyimide films based on hydrogen bond interaction. Journal of Polymer Science 2022. [DOI: 10.1002/pol.20220177] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 01/12/2023]
Number Cited by Other Article(s)
1
Hung YT, Chen CK, Lin YC, Yu YY, Chen WC. Dimensionally thermally stable biomass-based polyimides for flexible electronic applications. Polym J 2022. [DOI: 10.1038/s41428-022-00696-y] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/09/2022]
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