Epoxy Resins With Controllable "Thermally Conductive-Self-Healing" Synergies: a New Material to Meet the Needs of Flexible Electronic Devices

With the popularization of 5G technology and artificial intelligence, thermally conductive epoxies with self-healing ability will be widely used in flexible electronic materials. Although many compounds containing both performances have been synthesized, there is little systematic theory to explain the coordination mechanism. In this paper, alkyl chains of different lengths were introduced to epoxies to discuss the thermally conductive, the self-healing performance, and the synergistic effect. A series of electronic-grade biphenyl epoxies (4,4'-bis(oxiran-2-ylmethoxy)-1,1'-biphenyl (1), 4,4'-bis(2-(oxiran-2-yl)ethoxy)-1,1'-biphenyl (2), 4,4'-bis(3-(oxiran-2-yl)propoxy)-1,1'-biphenyl (3), and 4,4'-bis(4-(oxiran-2-yl)butoxy)-1,1'-biphenyl (4) were synthesized and characterized. Furthermore, they were cured with decanedioic acid to produce polymers. Results showed that alkyl chains can both affect the two properties, and the epoxies suitable for specific application scenarios can be prepared by adjusting the length of alkyl chains. In terms of thermal conductivity, compound 1 was a most promising material. However, compound 4 was expected to be utilized in flexible electronic devices because of its acceptable thermal conductivity, self-healing ability, transparency, and flexibility.

Higher-Order Structural Analysis of a Transparent and Flexible High Thermal Conductive Liquid Crystalline Elastomer Sheet and Its Composite

Transparency, flexibility, and high thermal conductivity are trade-offs. Specifically, we have investigated a cross-linked acrylic liquid crystal elastomer (LCE) that exhibits both transparency and flexibility while maintaining a high level of thermal conductivity. The transparent monodomain LCE sheet was achieved through a process of stretching an initially opaque polydomain sheet to 80% elongation and subsequently subjecting it to photocuring. The thermal conductivity in the stretching direction (x) of the monodomain LCE sheet was found to be 1.8 times higher than that of the prestretched polydomain sheet, consistent with findings from previous studies. However, in the orthogonal direction (y) to the stretching (x) direction, the thermal conductivity exhibited an even higher value, being 1.7 times greater than in the x-direction, with a value of 3.0 W/(m·K). This unique observation prompted us to conduct further investigation through higher-order structural analysis of these LCE sheets using 2D wide-angle X-ray scattering (WAXS) analysis. In the transparent sheet, the LCE molecules were aligned in the sheet in the stretching x-direction (monodomain structure) for the out-of-plane direction. However, in the in-plane x-direction, the molecular plane spacing exhibited random orientation at a period of 0.45 nm. In contrast, within the y-direction of the inner layer, the molecular plane spacing exhibited a uniaxial horizontal orientation at the same period length as in the x-direction. The heat energy entering into the y-direction once spreads to the x-direction, but it was considered that the reason for the higher thermal conductivity to the y-direction would be forming covalent bonds that function as new heat transmission paths, in the direction intersecting to the x-direction during photocuring. Therefore, we concluded that the synergistic effect of the high level of the ordered inner structure and covalent bonding structure due to cross-linking in the y-direction contributes to its higher thermal conductivity compared to that in the x-direction, which exhibits a random in-plane structure. Additionally, we have fabricated an LCE composite sheet filled with 75 vol % of alumina particles using a polydomain-type LCE as the base material. The composite sheet exhibits remarkable thermal conductivity in the thickness direction, measuring at 9.8 W/(m·K), while maintaining a flexibility characterized by an elastic modulus of 70 MPa. This thermal conductivity surpasses that of a nonmesogenic acrylic composite sheet with identical alumina particle filling, which measured at 3.9 W/(m·K), more than twice as much. The presence of the mesogen skeleton has been demonstrated to enhance heat transfer, even within soft composites, by facilitating the formation of an ordered structure.

Modification of the Dielectric and Thermal Properties of Organic Frameworks Based on Nonterminal Epoxy Liquid Crystal with Silicon Dioxide and Titanium Dioxide

A nonterminal liquid crystal epoxy monomer is used to create an epoxy-amine network with a typical diamine 4,4'diaminodiphenylmethane. The plain matrix is compared to matrices modified with inorganic fillers: TiO2 or SiO2. Conditions of the curing reaction and glass transition temperatures in the cured products are determined through differential scanning calorimetry and broadband dielectric spectroscopy. The curing process is also followed through optical and electrical observations. The dielectric response of all investigated networks reveals a segmental α-process related to structural reorientation (connected to the glass transition). In all products, a similar process associated with molecular motions of polar groups also appears. The matrix modified with TiO2 exhibits two secondary relaxation processes (β and γ). Similar processes were observed in the pure monomer. An advantage of the network with the TiO2 filler is a shorter time or lower temperature required for optimal curing conditions. The physical properties of cured matrices depend on the presence of a nematic phase in the monomer and nonterminal functional groups in the aliphatic chains. In effect, such cured matrices can have more flexibility and internal order than classical resins. Additional modifiers used in this work shift the glass transition above room temperature and influence the fragility index in both cases.

Effect of the Structure of Epoxy Monomers and Curing Agents: Toward Making Intrinsically Highly Thermally Conductive and Low-Dielectric Epoxy Resins

The low intrinsic thermal conduction and high dielectric properties of epoxy resins have significantly limited their applications in electrical and electronic devices with high integration, high frequency, high power, and miniaturization. Herein, a liquid crystalline epoxy (LCE) monomer with a biphenyl mesogenic unit was first synthesized through an efficient one-step reaction. Subsequently, bisphenol AF (BPAF) containing low-polarizable -CF3 groups and 4,4'-diaminodiphenylmethane (DDM) were applied to cure the LCE and commercial diglycidyl ether of bisphenol A-type epoxy (E-51), respectively, to afford four kinds of epoxy resins with various intrinsic thermal conductivity and dielectricity values. Owing to the dual effect of microscopically stacking of mesogens and the contribution of fluorine to the formation of liquid crystallinity, ordered microstructures of the nematic liquid crystal phase were formed within the cross-linking network of LCE as confirmed by polarized optical microscopy and X-ray diffraction. Consequently, phonon scattering was suppressed, and the intrinsic thermal conductivity was improved considerably to 0.38 W/(m·K), nearly twice as high as that of E-51 cured with DDM (0.20 W/(m·K)). Additionally, the ordered microstructure and ultralow polar -CF3 groups within LCE cured with BPAF enabled the epoxy resin to exhibit a remarkably lower and stable dielectric constant (ε) and dielectric loss tangent (tan δ) over both low and high frequencies compared to E-51 cured with DDM. The ε decreased from 3.40 to 2.72 while the tan δ decreased from 0.044 to 0.038 at 10 GHz. This work presents a scalable and facile strategy for breaking the bottleneck of making epoxy resins simultaneously with high inherent thermal conduction and low dielectric performance.

Recent advances in thermally conductive polymer composites

Polymer matrix composites (PMCs) with high thermal conductivity (TC) play an important role in improving the heat dissipation capacity of a new generation of electronic devices, particularly for 5G and aviation applications. Over the last few decades, considerable efforts have been made in the fabrication of highly thermally conductive PMCs. Advances in the thermal conduction mechanism of polymer composites are induced to, and then commonly used thermally conductive fillers are presented. In the following, the factors affecting the TC of polymer composites are discussed in detail, including fillers, interfaces, polymer matrices and processing technologies. Special attention is paid to the thermally conductive fillers. Then, some application areas of thermally conductive polymer composites are introduced. Finally, the deficiencies and future development trends in this research field are put forward. It is expected that this review will provide some beneficial inspiration in improving the TC of PMCs.

State-of-the-Art, Opportunities, and Challenges in Bottom-up Synthesis of Polymers with High Thermal Conductivity

In contrast to metals, polymers are predominantly thermal and electrical insulators. With their unparalleled advantages such as light weight, turning polymer insulators into heat conductors with metal-like thermal conductivity is...

High intrinsic thermally conductivity side-chain liquid crystalline polysiloxane films grafted with pendent difunctional mesogenic groups

Herein, the microscopic ordered aggregation morphologies of SCLCP films are investigated, and molecular structures with regular arrangement can increase heat transfer via suppressing the scattering of phonons, thus greatly improving the λ of SCLCPs.

Discotic Liquid Crystal Epoxy Resins Integrating Intrinsic High Thermal Conductivity and Intrinsic Flame Retardancy

The integration of intrinsic thermal conductivity and intrinsic flame retardancy of epoxy resins shows wider application prospects in electricals and electronics. Discotic liquid crystal epoxy (D-LCE) is synthesized from pyrocatechol, 2-allyloxyethanol, and 3-chloroperoxybenzoic acid. P/Si synergistic flame-retardant co-curing agent (DOPO-POSS, DP) is synthesized from p-hydroxybenzaldehyde, 9, 10-dihydro-9-oxa-10-phosphaphenanthrene 10-oxide (DOPO), and amino terminated polysilsesquioxane (POSS). Finally, D-LCE is cured within liquid crystal range with 4, 4'-diaminodiphenyl methane (DDM) and DP, to obtain intrinsic highly thermal conductive/flame-retardant epoxy resins (D-LCER_DP ). D-LCER_DP-10.0 (10.0 wt% DP) synchronously possesses excellent intrinsic thermal conductivity and intrinsic flame retardancy, with thermal conductivity coefficient in vertical and parallel direction (λ_⊥ and λ_∥ ) of 0.34 and 1.30 W m^-1 K^-1 , much higher than that of general bisphenol A epoxy resin (E-51, λ_⊥ of 0.19 W m^-1 K^-1 , λ_∥ of 0.65 W m^-1 K^-1 ). The limiting oxygen index (LOI) value of D-LCER_DP-10.0 reaches 31.1, also better than those of E-51 (19.8) and D-LCER (21.3).

Current Status of Research on the Modification of Thermal Properties of Epoxy Resin-Based Syntactic Foam Insulation Materials

As a lightweight and highly insulating composite material, epoxy resin syntactic foam is increasingly widely used for insulation filling in electrical equipment. To avoid core burning and cracking, which are prone to occur during the casting process, the epoxy resin-based syntactic foam insulation materials with high thermal conductivity and low coefficient of thermal expansion are required for composite insulation equipment. The review is divided into three sections concentrating on the two main aspects of modifying the thermal properties of syntactic foam. The mechanism and models, from the aspects of thermal conductivity and coefficient of thermal expansion, are presented in the first part. The second part aims to better understand the methods for modifying the thermal properties of syntactic foam by adding functional fillers, including the addition of thermally conductive particles, hollow glass microspheres, negative thermal expansion filler and fibers, etc. The third part concludes by describing the existing challenges in this research field and expanding the applicable areas of epoxy resin-based syntactic foam insulation materials, especially cross-arm composite insulation.

Effects of pendant side groups on the properties of the silicon-containing arylacetylene resins with 2,5-diphenyl-[1,3,4]-oxadiazole moieties

Silicon-containing arylacetylene resins with rigid conjugated structures in the main chain often exhibit poor processability. A strategy of improving the processability by destroying the molecular structure symmetry using side aromatic groups was proposed, and the effects of the side groups was further explored. Two novel structural resins with side aromatic phenyl and phenylacetylene groups (PODSA-2P-MM and PODSA-2E-MM) were synthesized by Grignard reaction. The side aromatic groups strongly interfere with the regular arrangement of the main chains, and the crystallinities of the resins decrease as compared with PODSA-MM resin without side aromatic groups. Due to the influence of the side aromatic groups, the novel resins exhibit good processability, low exothermic enthalpy, high modulus and good heat resistance.

Silicon-containing arylacetylene resins with rigid conjugated structures in the main chain often exhibit poor processability and low mechanical properties.

Advances in Liquid Crystalline Epoxy Resins for High Thermal Conductivity

Epoxy resin (EP) is one of the most famous thermoset materials. In general, because EP has a three-dimensional random network, it possesses thermal properties similar to those of a typical heat insulator. Recently, there has been substantial interest in controlling the network structure of EP to create new functionalities. Indeed, the modified EP, represented as liquid crystalline epoxy (LCE), is considered promising for producing novel functionalities, which cannot be obtained from conventional EPs, by replacing the random network structure with an oriented one. In this paper, we review the current progress in the field of LCEs and their application to highly thermally conductive composite materials.

Breaking Through Bottlenecks for Thermally Conductive Polymer Composites: A Perspective for Intrinsic Thermal Conductivity, Interfacial Thermal Resistance and Theoretics

Rapid development of energy, electrical and electronic technologies has put forward higher requirements for the thermal conductivities of polymers and their composites. However, the thermal conductivity coefficient (λ) values of prepared thermally conductive polymer composites are still difficult to achieve expectations, which has become the bottleneck in the fields of thermally conductive polymer composites. Aimed at that, based on the accumulation of the previous research works by related researchers and our research group, this paper proposes three possible directions for breaking through the bottlenecks: (1) preparing and synthesizing intrinsically thermally conductive polymers, (2) reducing the interfacial thermal resistance in thermally conductive polymer composites, and (3) establishing suitable thermal conduction models and studying inner thermal conduction mechanism to guide experimental optimization. Also, the future development trends of the three above-mentioned directions are foreseen, hoping to provide certain basis and guidance for the preparation, researches and development of thermally conductive polymers and their composites.

Thermal Energy Harvest and Reutilization by the Combination of Thermal Conducting Reactive Mesogens and Heat-Storage Mesogens

Utilizing a newly programmed and synthesized heat storage mesogen (HSM) and reactive mesogen (RM), advanced heat managing polymer alloys that exhibit high thermal conductivity, high latent heat, and phase transition at high temperatures were developed for use as smart thermal energy harvesting and reutilization materials. The RM in the heat-managing RM-HSM polymer alloy was polymerized to form a robust polymeric network with high thermal conductivity. The phase-separated HSM domains between RM polymeric networks absorbed and released a lot of thermal energy in response to changes in the surrounding temperature. For the fabrication of smart heat-managing RM-HSM polymer alloys, the composition and polymerization temperature were optimized based on the constructed phase diagram and thermal energy managing properties of the RM-HSM mixture. From morphological investigation and thermal analysis, it was realized that the heat storage capacity of polymer alloys depends on the size of the phase-separated HSM domain. The structure-morphology-property relationship of the heat managing polymer alloys was built based on the combined techniques of thermal, scattering, and morphological analysis. The newly developed mesogen-based polymer alloys can be used as smart thermal energy-harvesting and reutilization materials.

From Paramagnetic to Superparamagnetic Ionic Liquid/Poly(ionic liquid): The Effect of π-π Stacking Interaction

Magnetic ionic liquids (MILs) and poly(magnetic ionic liquids) (PMILs) with FeCl₄^- as anions usually show weak magnetism, such as paramagnetism or antiferromagnetism, at room temperature. Inspired by the natural inorganic ferromagnet with ordered crystal structures, a soft superparamagnetic ionic liquid (TMBBDI[FeCl₄]) and corresponding poly(ionic liquid) (PTMBBDI[FeCl₄]) were prepared by introducing π-π stacking biphenyl groups into the organic cations. Both of the compounds exhibited superparamagnetism from 100 to 300 K, while a ferromagnetic hysteresis loop was found at 300 K. Ferromagnetic interactions were observed from zero field cooling and field cooling studies for both TMBBDI[FeCl₄] and PTMBBDI[FeCl₄]. However, the MIL and PMIL without π-π stacking interaction were paramagnetic without ferromagnetic interaction. The superparamagnetism of the TMBBDI[FeCl₄] and PTMBBDI[FeCl₄] was ascribed to the π-π stacking interactions between biphenyl groups, which not only shortened the Fe-Fe distance to the ferromagnetic interaction range but also increased the order degree of the molecules.