Boosting the Heat Dissipation Performance of Graphene/Polyimide Flexible Carbon Film via Enhanced Through-Plane Conductivity of 3D Hybridized Structure

Analysis of sandwich graphene origami composite plate sandwiched by piezoelectric/piezomagnetic layers: A higher-order electro-magneto-elastic analysis

This work applies a higher order thickness-stretched model for the electro-elastic analysis of the composite graphene origami reinforced square plate sandwiched by the piezoelectric/piezomagnetic layers subjected to the thermal, electric, magnetic and mechanical loads. The plate is manufactured of a copper matrix reinforced with graphene origami where the effective material properties are calculated based on the micromechanical models as a function of volume fraction and folding degree of graphene origami, material properties of matrix, reinforcement, and local temperature. The governing equations are derived using the virtual work principle in terms of the bending, shear and stretching functions, in-plane displacements, electric, and magnetic potentials. The numerical results including various displacement components, maximum electric, and magnetic potentials are presented with changes of volume fraction, folding degree of reinforcement, electrical, magnetic, and thermal loading. A verification investigation is presented for approve of the methodology, and the solution procedure. The main novelty of this work is simultaneous effect of the thickness stretching and the multi-field loading on the electromagnetic bending results of the sandwich plate. Another novelty of this work is usage of graphene origami nano-reinforcement as a controllable material in a sandwich structure subjected to multi-field loadings. The results show an increase in bending, shear, and stretching deflections with an increase in electromagnetic loads, and folding degree as well as a decrease in volume fraction of reinforcement.

New Carbon Materials for Multifunctional Soft Electronics

Soft electronics are garnering significant attention due to their wide-ranging applications in artificial skin, health monitoring, human-machine interaction, artificial intelligence, and the Internet of Things. Various soft physical sensors such as mechanical sensors, temperature sensors, and humidity sensors are the fundamental building blocks for soft electronics. While the fast growth and widespread utilization of electronic devices have elevated life quality, the consequential electromagnetic interference (EMI) and radiation pose potential threats to device precision and human health. Another substantial concern pertains to overheating issues that occur during prolonged operation. Therefore, the design of multifunctional soft electronics exhibiting excellent capabilities in sensing, EMI shielding, and thermal management is of paramount importance. Because of the prominent advantages in chemical stability, electrical and thermal conductivity, and easy functionalization, new carbon materials including carbon nanotubes, graphene and its derivatives, graphdiyne, and sustainable natural-biomass-derived carbon are particularly promising candidates for multifunctional soft electronics. This review summarizes the latest advancements in multifunctional soft electronics based on new carbon materials across a range of performance aspects, mainly focusing on the structure or composite design, and fabrication method on the physical signals monitoring, EMI shielding, and thermal management. Furthermore, the device integration strategies and corresponding intriguing applications are highlighted. Finally, this review presents prospects aimed at overcoming current barriers and advancing the development of state-of-the-art multifunctional soft electronics.

High-Performance Graphene Biocomposite Enabled by Fe3+ Coordination for Thermal Management

Emerging biocomposites with excellent heat dissipation capabilities and inherent sustainability are urgently needed to address the cooling issues of modern electronics and growing environmental concerns. However, the moisture stability, mechanical performance, thermal conductivity, and even flame retardancy of biomass-based materials are generally insufficient for practical thermal management applications. Herein, we present a high-performance graphene biocomposite consisting of carboxylated cellulose nanofibers and graphene nanosheets through an evaporation-induced self-assembly and subsequent Fe3+ cross-linking strategy. The Fe3+ coordination plays a critical role in stabilizing the material structure, thereby improving the mechanical strength and water stability of the biocomposite films, and its effect is revealed by density functional theory calculations. The hierarchical structure of the biocomposite films also leads to a high in-plane thermal conductivity of 42.5 W m-1 K-1, enabling a superior heat transfer performance. Furthermore, the resultant biocomposite films exhibit outstanding Joule heating performance with a fast thermal response and long-term stability, improved thermal stability, and flame retardancy. Therefore, such a general strategy and the desired overall properties of the biocomposite films offer wide application prospects for functional and safe thermal management.

Exploring Lipoic Acid-Mediated Dynamic Bottlebrush Elastomers as a New Platform for the Design of High-Performance Thermally Conductive Materials

The development of high-performance thermally conductive interface materials is the key to unlocking the serious bottleneck of modern microelectronic technology through enhanced heat dispersion. Existing methods that utilize silicone composites rely either on loading large doses of randomly distributed thermal conductive fillers or on filling prealigned thermal conductive scaffolds with liquid silicone precursors. Both approaches suffer from several limitations in terms of physical traits and processability. We describe an alternative approach in which malleable silicone matrices, based on the dynamic cyclic disulfide nature cross-linker (α-lipoic acid), are readily prepared using ring-opening polymerization. The mechanical properties of the resultant dynamic silicone matrix are readily tunable. Stress-dependent depolymerization of the disulfide network demonstrates the ability to reprocess the silicone elastomer matrix, which allows for the fabrication of highly efficient thermal conductive composites with a 3D interconnecting, thermally conductive network (3D-graphite/MxBy composites) via in situ methods. Applications of the composites as thermal dispersion interface materials are demonstrated by LEDs and CPUs, suggesting great potential in advanced electronics.

Thermally conductive and compliant polyurethane elastomer composites by constructing a tri-branched polymer network

Most elastomers suffer from poor thermal conductivity, which limits their further applications in various fields, especially for electronic devices. A common method to enhance thermal conductivity is to introduce thermally conductive fillers into elastomers. Unfortunately, thermal conductivity and compliance are often correlated and coupled: large amounts of fillers are required to increase thermal conductivity while damaging the compliance dramatically. In this study, we report thermally conductive and compliant polyurethane elastomer composites by constructing a tri-branched polymer network. The resultant polyurethane elastomer composites exhibit excellent superhigh stretchability (2000%), low Young's modulus (640 kPa), and low thermal resistance (0.11 K cm² W^-1). Experimental rheology and a theoretical tube model are employed to study the nature of the high compliant tri-branched polymer network. Furthermore, the remarkable flexibility of our elastomer composite and heat dissipation act as thermal interface materials in the thermal management of flexible electronics. These findings advance our understanding on the rational design of the polymer frameworks of thermal composites, improving our ability to predict, design, and leverage their unique properties for future applications.

Structural Effect of Polyimide Precursors on Highly Thermally Conductive Graphite Films

In this study, polyimide (PI) with high carbonization yield was used as a precursor to prepare graphite films with high thermal conductivity. The crystallinity, grain size, and thermal conductivity of the graphite films were characterized and found to vary according to the chemical structure of the PI precursor. Aromatic PIs containing ortho-substituted hydroxyl groups in the PI main chain (DHB-BPDA) were synthesized by the polycondensation reaction of 3,3'-dihydroxybenzidine (DHB) and 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA). The DHB-BPDA is converted to a polybenzoxazole (PBO) structure through thermolysis reaction during carbonization. The PBO containing a benzene ring and a heterocycle group can provide a strong main chain and high thermal stability due to its resonant structure. The graphite film prepared from DHB-BPDA exhibited a large grain size (63.727 nm) and a high thermal conductivity of 916 W/(mK).

Significantly enhanced thermally conductive epoxy composite composed of caterpillar-like structured expanded graphite/ boron nitride nanotubes

The trend toward miniaturization, integration and multifunctionality of modern electronics has led to a rapid increase in power density, which makes heat dissipation a critical issue. Despite the great potential of graphite-related nanocomposites in dissipating excess heat to ensure high efficiency and long lifetime of electronic devices, the practical application of these composites is limited by the ultra-low vertical thermal conductivity due to the interfacial thermal resistance between graphite layers. Here, a caterpillar-like hybrid filler was fabricated by the in situ intercalation of boron nitride nanotubes (BNNTs) between expanded graphite (EG) layers based on chemical vapor deposition technology. Owing to the optimized interfacial thermal resistance by forming covalent C-N bonding at the interface of EG and BNNT, the through-plane thermal conductivity of epoxy-based nanocomposites can be up to 5.18 Wm−1 K−1. In addition, the composite possessed electromagnetic interference shielding performance of 33.34 dB while maintaining electrical insulation due to the hierarchical structure. This work provided a new strategy for fabricating polymer-based composites with excellent through-plane thermal conductivity in thermal management applications.

Highly aligned welding of ultrathin graphene layer to robust carbon nanotube film for significantly enhanced thermal conductivity

Carbon nanotube (CNT) films have demonstrated great potential for highly efficient thermal management materials. However, how to enable a combined feature of excellent thermal conductivity and structural robustness, which is crucial for the high-performance realization, still remains challenging. Herein, an effective and facile strategy to solve the problem was proposed by developing a graphene (G)/CNT film with highly aligned welding of ultrathin G layer to robust CNT film. The unique architectural features of the obtained composite film enabled a high tensile strength (116 MPa) and electric conductivity (1.7 × 10³S cm^-1). Importantly, the thermal conductivity was significantly improved compared to neat CNT film, and reached as high as 174 W m^-1K^-1. In addition, the G/CNT film featured a superior electromagnetic shielding performance. This work provides useful guidelines for designing and fabricating the composite CNT film with prominent thermal conductivity, as well as excellent mechanical and electrical properties.

Recent Advances in Design and Preparation of Polymer-Based Thermal Management Material

The boosting of consumer electronics and 5G technology cause the continuous increment of the power density of electronic devices and lead to inevitable overheating problems, which reduces the operation efficiency and shortens the service life of electronic devices. Therefore, it is the primary task and a prerequisite to explore innovative material for meeting the requirement of high heat dissipation performance. In comparison with traditional thermal management material (e.g., ceramics and metals), the polymer-based thermal management material exhibit excellent mechanical, electrical insulation, chemical resistance and processing properties, and therefore is considered to be the most promising candidate to solve the heat dissipation problem. In this review, we summarized the recent advances of two typical polymer-based thermal management material including thermal-conduction thermal management material and thermal-storage thermal management material. Furtherly, the structural design, processing strategies and typical applications for two polymer-based thermal management materials were discussed. Finally, we proposed the challenges and prospects of the polymer-based thermal management material. This work presents new perspectives to develop advanced processing approaches and construction high-performance polymer-based thermal management material.

In situ fabrication of silver/polyimide composite films with enhanced heat dissipation

In this study, silver/polyimide (Ag/PI) composite films with enhanced heat dissipation properties were prepared. Ag was formed in situ by reducing AgNO₃ at various locations according to the reduction method. Two different types of soluble PIs capable of solution processing were used, namely Matrimid and hydroxy polyimide (HPI). Unlike Matrimid with bulky substituents, HPI with polar hydroxy groups formed ion-dipole interactions with Ag ions to form Ag particles with uniform size distribution. The location and distribution of Ag particles affect the heat emission characteristics of the composite films, resulting in better heat dissipation properties with the thermally and photochemically reduced Ag/HPI films having more Ag particles distributed inside of the films than the chemically reduced films.

Recent progress in the development of thermal interface materials: a review

Modern electronic devices are characterized by high-power and high-frequency with excessive heat accumulation. Thermal interface materials (TIMs) are of crucial importance for efficient heat dissipation to maintain proper functions and lifetime for these devices. The most promising TIMs are those polymer-based nanocomposites consisting of polymers and low-dimensional materials with high thermal conductivity (TC). This perspective summarizes the recent progress on the thermal transport properties of newly discovered one-dimensional (1D) nanomaterials and two-dimensional (2D) nanomaterials as well as three-dimensional (3D) nanostructures consisting of these 1D and 2D nanomaterials. Moreover, the applications of various nanomaterials in polymer nanocomposites for advanced TIMs are critically reviewed and the mechanism of TC enhancement is analysed. It is hoped that the present review could provide better understanding of the thermal transport properties of recently developed 2D nanomaterials and various 3D nanostructures as well as relevant polymer-based TIMs, shedding more light on the thermal management research.