Liquid-Suspended and Liquid-Bridged Liquid Metal Microdroplets

Recent advances and progress on the design, fabrication and biomedical applications of Gallium liquid metals-based functional materials

Gallium (Ga) is a well-known liquid metals (LMs) that possesses the features, such as fluidity, low viscosity, high electrical and thermal conductivity, and relative low toxicity. Owing to the weak interactions between Ga atoms, Ga LMs can be adopted for fabrication of various Ga LMs-based functional materials via ultrasonic treatment and mechanical grinding. Moreover, many organic compounds/polymers can be coated on the surface of LMs-based materials through coordination between oxidized outlayers of Ga LMs and functional groups of organic components. Over the past decades, different strategies have been reported for synthesizing Ga LMs-based functional materials and their biomedical applications have been intensively investigated. Although some review articles have published over the past few years, a concise review is still needed to advance the latest developments in biomedical fields. The main context can be majorly divided into two parts. In the first section, various strategies for fabrication of Ga LMs-based functional materials via top-down strategies were introduced and discussed. Following that, biomedical applications of Ga LMs-based functional materials were summarized and design Ga LMs-based functional materials with enhanced performance for cancer photothermal therapy (PTT) and PTT combined therapy were highlighted. We trust this review article will be beneficial for scientists to comprehend this promising field and greatly advance future development for fabrication of other Ga LMs-based functional materials with better performance for biomedical applications.

Room-Temperature Liquid Metals for Flexible Electronic Devices

Room-temperature gallium-based liquid metals (RT-GaLMs) have garnered significant interest recently owing to their extraordinary combination of fluidity, conductivity, stretchability, self-healing performance, and biocompatibility. They are ideal materials for the manufacture of flexible electronics. By changing the composition and oxidation of RT-GaLMs, physicochemical characteristics of the liquid metal can be adjusted, especially the regulation of rheological, wetting, and adhesion properties. This review highlights the advancements in the liquid metals used in flexible electronics. Meanwhile related characteristics of RT-GaLMs and underlying principles governing their processing and applications for flexible electronics are elucidated. Finally, the diverse applications of RT-GaLMs in self-healing circuits, flexible sensors, energy harvesting devices, and epidermal electronics, are explored. Additionally, the challenges hindering the progress of RT-GaLMs are discussed, while proposing future research directions and potential applications in this emerging field. By presenting a concise and critical analysis, this paper contributes to the advancement of RT-GaLMs as an advanced material applicable for the new generation of flexible electronics.

High-Thermal-Conductivity and High-Fluidity Heat Transfer Emulsion with 89 wt % Suspended Liquid Metal Microdroplets

Colloidal suspensions of thermally conductive particles in a carrier fluid are considered promising heat transfer fluids for various thermal energy transfer applications, such as transportation, plants, electronics, and renewable energy systems. The thermal conductivity (k) of the particle-suspended fluids can be improved substantially by increasing the concentration of conductive particles above a "thermal percolation threshold," which is limited because of the vitrification of the resulting fluid at the high particle loadings. In this study, eutectic Ga-In liquid metal (LM) was employed as a soft high-k filler dispersed as microdroplets at high loadings in paraffin oil (as a carrier fluid) to produce an emulsion-type heat transfer fluid with the combined advantages of high thermal conductivity and high fluidity. Two types of the LM-in-oil emulsions, which were produced via the probe-sonication and rotor-stator homogenization (RSH) methods, demonstrated significant improvements in k, i.e., Δk ∼409 and ∼261%, respectively, at the maximum investigated LM loading of 50 vol % (∼89 wt %), attributed to the enhanced heat transport via high-k LM fillers above the percolation threshold. Despite the high filler loading, the RSH-produced emulsion retained remarkably high fluidity, with a relatively low viscosity increase and no yield stress, demonstrating its potential as a circulatable heat transfer fluid.

3D-printable, lightweight, and electrically conductive metal inks based on evaporable emulsion templates jammed with natural rheology modifiers

Conductive metal inks with 3D-printable rheological properties have gained considerable attention, owing to their potential for manufacturing 3D electronics. Typically, such inks are formulated with high volume fractions of metal particles to achieve both rheological and electrical percolation. However, this leads to a high product cost and weight, making this approach potentially undesirable for practical application. In this study, naturally occurring ingredients, i.e., bee pollen microparticles (BPMPs) and citric acids (CAs), are used to produce a jammed hexane-in-aqueous suspension-type emulsion with controllable viscoelasticity as a template for conductive metal particles. Correspondingly, it is possible to develop 3D-printable, lightweight, and conductive inks. The BPMPs and CAs, as rheology modifiers, facilitate the 3D printability of the ink. After drying, the ink forms 3D networks without macroscopic discontinuities. Hexanes co-dispersed with BPMPs and CAs in the aqueous continuous phase improve the ink rheological processability and create internal macropores within the 3D-printed structure upon evaporation under ambient conditions, decreasing the product density. A conductive copper ink based on the emulsion template shows excellent 3D printability and electrical percolation at low metal loadings (<10 vol%); moreover, the printed ink with the optimized formulation has a remarkably low density (<2 g ∙ cm^-3).