Performance of Thermal Interface Materials

Thermally Conductive Polydimethylsiloxane-Based Composite with a Three-Dimensional Vertically Aligned Thermal Network Incorporating Hexagonal Boron Nitride Nanosheets and Nanodiamonds

Thermal interface materials play a pivotal role in efficiently transferring heat from heating devices to thermal management components, thereby reducing the risk of component degradation due to overheating. In this study, we propose a strategy for enhancing the out-of-plane thermal conductivity (TC) of composite materials by fabricating a three-dimensional (3D) thermal network within a polydimethylsiloxane (PDMS) matrix. Specifically, the composite material was designed to incorporate a dense thermal network comprising hexagonal boron nitride nanosheets (BNNSs) and nanodiamonds (NDs). The fabrication process commenced with the preparation of BNNSs through liquid-phase exfoliation, followed by the creation of a 3D BNNSs-NDs/polyimide aerogel thermal framework using a unidirectional solidification ice templating method and subsequent heat treatment. Vacuum impregnation and curing were then employed to finalize the production of the 3D BNNSs-NDs/PDMS composite material. Characterization analyses indicated that the addition of NDs filled the voids between BNNSs, leading to the densification of the thermal framework pore walls and the establishment of additional thermal pathways. Impressively, with concentrations of BNNSs and NDs of 17.99 and 7.71 wt %, respectively, the out-of-plane TC of the 3D BNNSs-NDs/PDMS composite material reached 1.623 W m-1 K-1, marking notable enhancements of 754.21% and 256.70% compared to those of pure PDMS and composites prepared via direct blending with randomly distributed BNNSs and NDs, respectively. Furthermore, the 3D BNNSs-NDs thermal framework improved the compressive strength and the dimensional stability of the composite material. Finite element simulations additionally confirmed the synergistic improvement of the TC achieved through the combination of BNNSs and NDs, demonstrating that the 3D BNNSs-NDs/PDMS composite material displayed superior heat conduction and a greater density of thermal pathways compared to those of its counterparts, including 3D BNNSs/PDMS and 3D NDs/PDMS composite materials. In summary, this work presents a strategy for enhancing the out-of-plane TC of polymer-based composite materials by incorporating vertically aligned thermal networks.

Poly(ionic liquid)s: A Promising Matrix for Thermal Interface Materials

The swift progression of high-density chiplet packaging, propelled by the artificial intelligence revolution, has precipitated a critical need for high-performance chip-scale thermal interface materials (TIMs). The elevated thermal resistance, limited interfacial adhesion, and mechanical flexibility intrinsic to silicone systems present a substantial challenge in meeting reliability standards amidst chip warpage. This particular matter underscores a significant performance bottleneck within existing high-end TIMs. In this study, we present poly(ionic liquid)s (PILs) as an innovative matrix for TIMs. Our findings highlight the unique properties of PILs, showcasing a low elastic modulus (60 kPa), exceptional flexibility and stretchability (>3800%), high adhesion to diverse substrates (up to 4.10 MPa), favorable filler compatibility, remarkable thermal stability, and prompt self-healing capabilities coupled with recyclability. The collective findings suggest that the PIL serves as an ideal matrix for heat transfer. As a proof of concept, PIL blended with liquid metal was straightforwardly combined to produce a TIM, exhibiting exceptional performance within practical encapsulated structures. The PIL-based TIM demonstrates substantial elongation at break (>350%), coupled with sustained high adhesion strength (up to 1.70 MPa), and exhibits favorable thermal conductivity in package testing. This study presents an innovative TIM matrix with the potential to enhance existing TIM systems, delivering significant performance benefits compared to silicones. Besides elucidating their multifaceted characteristics, this study forecasts an expanded range of applications for PILs, along with laying the groundwork for advancing next-generation TIMs.

Highly Thermally Conductive and Flexible Thermal Interface Materials with Aligned Graphene Lamella Frameworks

Highly thermally conductive and flexible thermal interface materials (TIMs) are desirable for heat dissipation in modern electronic devices. Here, we fabricated a high-crystalline aligned graphene lamella framework (AGLF) with precisely controlled lamella thickness, pore structure, and excellent intergraphene contact by manipulating the thermal expansion behavior of scanning centrifugal casted graphene oxide films. The rational design of the AGLF balances the trade-off between the thermal conductivity and flexibility of TIMs. The AGLF-based TIM (AGLF-TIM) shows a record thermal conductivity of 196.3 W m-1 K-1 with a graphene loading of only 9.4 vol %, which is about 4 times higher than those of reported TIMs at a similar graphene loading. Meanwhile, good flexibility remains comparable to that of commercial TIMs. As a result, an LED device achieves an additional temperature decrease of ∼8 °C with the use of AGLF-TIM compared to high-performance commercial TIMs. This work offers a strategy for the controlled fabrication of graphene macrostructures, showing the potential use of graphene as filler frameworks in thermal management.

Exploring the Impact of Visual Heat Conduction Paths on Thermal Conductivity of Polymer Composites and the Practical Applications

The theory of heat conduction paths has been widely recognized and widely studied in the research about the thermal conductivity of thermal conductive polymer composites at present. Encapsulating polymer pellets with thermally conductive fillers and processing them into thermally conductive polymer composites is a simple and effective method for constructing heat conduction paths. It is meaningful to investigate the related heat conduction mechanism of this method. Otherwise, this approach can significantly preserve the performance of the polymer substrate, making it highly valuable for practical material applications. In this work, polyethylene-octene elastomer (POE) pellets were encapsulated with thermal conductive fillers by physical absorption. Subsequently, the composite films containing heat conduction paths were fabricated using the encapsulated POE pellets through a heating press. Alumina (Al2O3), boron nitride (BN), and alumina/boron nitride hybrid (Al2O3/BN) fillers were used to prepare Al2O3@POE, BN@POE, and BN/Al2O3@POE composite films to investigate the influence of filler shapes on heat conduction path construction. The influence of the constitute and density of heat conduction paths on the thermal conductivity of composite films was analyzed by infrared thermal imaging, finite element analysis, and thermal resistance theory in detail. Owing to the reserved good adhesion and flexibility of the POE substrate, the composite films could be directly used as thermal interface materials for chip cooling, which presented a good heat dissipation effect. Furthermore, a series of integrated composite materials were prepared by the combination of encapsulated pellets with various functional films (copper foil, aluminum foil, and graphite sheet) through a one-pot heating press, exhibiting a good electromagnetic shielding effect. The performance of the composites and the corresponding preparation method demonstrate the strong significance of this research for practical applications.

Mussel-Inspired Polymer-Based Composites for Efficient Thermal Management in Dry and Underwater Environments

To address the escalating power consumption of processors in data centers and the growing emphasis on environmental sustainability, the prospective shift from traditional air-cooling to immersion liquid cooling necessitates multiple functional integrations in polymer-based thermal conductive materials. Here, drawing inspiration from mussels, we showed a copolymer, poly(dimethylsiloxane-co-dopamine methacrylate) (PDMS-DMA), with a variety of reversible molecular interactions and simply combined with liquid metal (EGaIn) can yield a flexible, waterproof, and electrically insulating thermal conductive composite. The obtained PDMS-DMA/EGaIn composites demonstrate a harmonious blend of attributes, including a low modulus (75.8 kPa), high thermal conductivity of 6.9 W m-1 K-1, and rapid room-temperature self-healing capabilities, capable of complete repair within 20 min, even under water. Based on its electrically insulating and water resistance properties, PDMS-DMA/EGaIn emerges as a promising candidate for efficient and stable heat transfer in both air and underwater thermal management. Consequently, this water-resistant polymer-based composite holds significance for application in thermal protective layers for future immersion liquid cooling systems.

Simultaneous Measurement of Thermal Conductivity and Volumetric Heat Capacity of Thermal Interface Materials Using Thermoreflectance

Thermal interface materials are crucial to minimize the thermal resistance between a semiconductor device and a heat sink, especially for high-power electronic devices, which are susceptible to self-heating-induced failures. The effectiveness of these interface materials depends on their low thermal contact resistance coupled with high thermal conductivity. Various characterization techniques are used to determine the thermal properties of the thermal interface materials. However, their bulk or free-standing thermal properties are typically assessed rather than their thermal performance when applied as a thin layer in real application. In this study, we introduce a low-frequency range frequency domain thermoreflectance method that can measure the effective thermal conductivity and volumetric heat capacity of thermal interface materials simultaneously in situ, illustrated on silver-filled thermal interface material samples, offering a distinct advantage over traditional techniques such as ASTM D5470. Monte Carlo fitting is used to quantify the thermal conductivities and heat capacities and their uncertainties, which are compared to a more efficient least-squares method.

Scalable Compliant Graphene Fiber-Based Thermal Interface Material with Metal-Level Thermal Conductivity via Dual-Field Synergistic Alignment Engineering

High-performance thermal interface materials (TIMs) are highly desired for high-power electronic devices to accelerate heat dissipation. However, the inherent trade-off conflict between achieving high thermal conductivity and excellent compliance of filler-enhanced TIMs results in the unsatisfactory interfacial heat transfer efficiency of existing TIM solutions. Here, we report the graphene fiber (GF)-based elastic TIM with metal-level thermal conductivity via mechanical-electric dual-field synergistic alignment engineering. Compared with state-of-the-art carbon fiber (CF), GF features both superb high thermal conductivity of ∼1200 W m-1 K-1 and outstanding flexibility. Under dual-field synergistic alignment regulation, GFs are vertically aligned with excellent orientation (0.88) and high array density (33.5 mg cm-2), forming continuous thermally conductive pathways. Even at a low filler content of ∼17 wt %, GF-based TIM demonstrates extraordinarily high through-plane thermal conductivity of up to 82.4 W m-1 K-1, exceeding most CF-based TIMs and even comparable to commonly used soft indium foil. Benefiting from the low stiffness of GF, GF-based TIM shows a lower compressive modulus down to 0.57 MPa, an excellent resilience rate of 95% after compressive cycles, and diminished contact thermal resistance as low as 7.4 K mm2 W-1. Our results provide a superb paradigm for the directed assembly of thermally conductive and flexible GFs to achieve scalable and high-performance TIMs, overcoming the long-standing bottleneck of mechanical-thermal mismatch in TIM design.

Low thermal contact resistance boron nitride nanosheets composites enabled by interfacial arc-like phonon bridge

Two-dimensional materials with ultrahigh in-plane thermal conductivity are ideal for heat spreader applications but cause significant thermal contact resistance in complex interfaces, limiting their use as thermal interface materials. In this study, we present an interfacial phonon bridge strategy to reduce the thermal contact resistance of boron nitride nanosheets-based composites. By using a low-molecular-weight polymer, we are able to manipulate the alignment of boron nitride nanosheets through sequential stacking and cutting, ultimately achieving flexible thin films with a layer of arc-like structure superimposed on perpendicularly aligned ones. Our results suggest that arc-like structure can act as a phonon bridge to lower the contact resistance by 70% through reducing phonon back-reflection and enhancing phonon coupling efficiency at the boundary. The resulting composites exhibit ultralow thermal contact resistance of 0.059 in2 KW-1, demonstrating effective cooling of fast-charging batteries at a thickness 2-5 times thinner than commercial products.

Alveoli-Mimetic Synergistic Liquid and Solid Thermal Conductive Interface as a Novel Strategy for Designing High-Performance Thermal Interface Materials

Thermal interface materials (TIMs) are in desperate desire with the development of the modern electronic industry. An excellent TIM needs desired comprehensive properties including but not limited to high thermal conductivity, low Yong's modulus, lightweight, as well as low price. However, as is typically the case, those properties are naturally contradictory. To tackle such dilemmas, a strategy of construction high-performance TIM inspired by alveoli is proposed. The material design includes the self-alignment of graphite into 3D interconnected thermally conductive networks by polydimethylsiloxane beads (PBs) -the alveoli; and a small amount of liquid metal (LM) - capillary networks bridging the PBs and graphite network. Through the delicate structural regulation and the synergistic effect of the LM and solid graphite filler, superb thermal conductivity (9.98 ± 0.34 W m-1 K-1) can be achieved. The light emitting diode (LED) application and their performance in the central processing unit (CPU) heat dispersion manifest the TIM developed in the work has stable thermal conductivity for long-term applications. The thermally conductive, soft, and lightweight composites are believed to be high-performance silicone bases TIMs for advanced electronics.

Fillers and methods to improve the effective (out-plane) thermal conductivity of polymeric thermal interface materials - A review

The internet of things and growing demand for smaller and more advanced devices has created the problem of high heat production in electronic equipment, which greatly reduces the work performance and life of the electronic instruments. Thermal interface material (TIM) is placed in between heat generating micro-chip and the heat dissipater to conduct all the produced heat to the heat sink. The development of suitable TIM with excellent thermal conductivity (TC) in both in-plane and through-plane directions is a very important need at present. For efficient thermal management, polymer composites are potential candidates. But in general, their thermal conductivity is low compared to that of metals. The filler integration into the polymer matrix is one of the two approaches used to increase the thermal conductivity of polymer composites and is also easy to scale up for industrial production. Another way to achieve this is to change the structure of polymer chains, which fall out of the scope of this work. In this review, considering the first approach, the authors have summarized recent developments in many types of fillers with different scenarios by providing multiple cases with successful strategies to improve through-plane thermal conductivity (TPTC) (k⊥). For a better understanding of TC, a comprehensive background is presented. Several methods to improve the effective (out-plane) thermal conductivity of polymer composites and different theoretical models for the calculation of TC are also discussed. In the end, it is given a detailed conclusion that provides drawbacks of some fillers, multiple significant routes recommended by other researchers to build thermally conductive polymer composites, future aspects along with direction so that the researchers can get a guideline to design an effective polymer-based thermal interface material.

Application-Driven High-Thermal-Conductivity Polymer Nanocomposites

Polymer nanocomposites combine the merits of polymer matrices and the unusual effects of nanoscale reinforcements and have been recognized as important members of the material family. Being a fundamental material property, thermal conductivity directly affects the molding and processing of materials as well as the design and performance of devices and systems. Polymer nanocomposites have been used in numerous industrial fields; thus, high demands are placed on the thermal conductivity feature of polymer nanocomposites. In this Perspective, we first provide roadmaps for the development of polymer nanocomposites with isotropic, in-plane, and through-plane high thermal conductivities, demonstrating the great effect of nanoscale reinforcements on thermal conductivity enhancement of polymer nanocomposites. Then the significance of the thermal conductivity of polymer nanocomposites in different application fields, including wearable electronics, thermal interface materials, battery thermal management, dielectric capacitors, electrical equipment, solar thermal energy storage, biomedical applications, carbon dioxide capture, and radiative cooling, are highlighted. In future research, we should continue to focus on methods that can further improve the thermal conductivity of polymer nanocomposites. On the other hand, we should pay more attention to the synergistic improvement of the thermal conductivity and other properties of polymer nanocomposites. Emerging polymer nanocomposites with high thermal conductivity should be based on application-oriented research.

Scalable microfluidic fabrication of vertically aligned two-dimensional nanosheets for superior thermal management

Two-dimensional (2D) nanosheets have been assembled into various macroscopic structures for wide engineering applications. To fully explore their exceptional thermal, mechanical, and electrical properties, 2D nanosheets must be aligned into highly ordered structures due to their strong structural anisotropy. Structures stacked layer by layer such as films and fibers have been readily assembled from 2D nanosheets due to their planar geometry. However, scalable manufacturing of macroscopic structures with vertically aligned 2D nanosheets remains challenging, given their large lateral size with a thickness of only a few nanometers. Herein, we report a scalable and efficient microfluidics-enabled sheet-aligning process to assemble 2D nanosheets into a large-area film with a highly ordered vertical alignment. By applying microchannels with a high aspect ratio, 2D nanosheets were well aligned vertically under strong channel size confinement and high flow shear stress. A vertically aligned graphene sheet film was obtained and applied to effectively improve the heat transfer of thermal interfacial materials (TIMs). Superior through-plane thermal conductivity of 82.7 W m-1 K-1 at a low graphene content of 11.8 vol% was measured for vertically aligned TIMs. Thus, they demonstrate exceptional thermal management performance for switching power supplies with high reliability.

Thermal Interface Materials with High Thermal Conductivity and Low Young's Modulus Using a Solid-Liquid Metal Codoping Strategy

Thermal interface materials (TIMs), as typical thermal functional materials, are highly required to possess both high thermal conductivity and low Young's modulus. However, the naturally synchronized change in the thermal and mechanical properties seriously hinders the development of high-performance TIMs. To tackle such a dilemma, a strategy of codoping solid fillers and liquid metal fillers into polymer substrates is proposed in this study. This strategy includes a large amount of liquid metals that play the role of thermal paths and a small amount of uniformly dispersed solid fillers that further enhance heat conduction. Through the synergistic effect of the liquid metal and solid fillers, the thermal conductivity can be improved, and Young's modulus can be kept small simultaneously. A typical TIM with a volume of 55% gallium-based liquid metal and 15% copper particles as fillers has a thermal conductivity of 3.94 W/(m·K) and a Young's modulus of 699 kPa, which had the maximum thermomechanical performance coefficient compared with liquid metal TIMs and solid filler-doped TIMs. In addition, the thermal conductivity of the solid-liquid metal codoped TIM increased sharply with an increase of liquid metal content, and Young's modulus increased rapidly with an increase of the volume ratio of copper and polymer. The high-low-temperature cycling test and large-size light-emitting diode (LED) application demonstrated that this TIM had stable physical performance. The synergistic effect of the solid fillers and liquid metal fillers provides a broad space to solve the classic tradeoff issue of the mechanical and thermal properties of composites.

Reducing interfacial thermal resistance by interlayer

Heat dissipation is crucial important for the performance and lifetime for highly integrated electronics, Li-ion battery-based devices and so on, which lies in the decrease of interfacial thermal resistance (ITR). To achieve this goal, introducing interlayer is the most widely used strategy in industry, which has attracted tremendous attention from researchers. In this review, we focus on bonding effect and bridging effect to illustrate how introduced interlayer decreases ITR. The behind mechanisms and theoretical understanding of these two effects are clearly illustrated. Simulative and experimental studies toward utilizing these two effects to decrease ITR of real materials and practical systems are reviewed. Specifically, the mechanisms and design rules for the newly emerged graded interlayers are discussed. The optimization of interlayers by machine learning algorithms are reviewed. Based on present researches, challenges and possible future directions about this topic are discussed.

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 ± 1 °C (10.5 °C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPU-BNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.