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Zeng X, Liang T, Cheng X, Fan J, Pang Y, Xu J, Sun R, Xia X, Zeng X. Design of Soft/Hard Interface with High Adhesion Energy and Low Interfacial Thermal Resistance via Regulation of Interfacial Hydrogen Bonding Interaction. NANO LETTERS 2024; 24:6386-6394. [PMID: 38743576 DOI: 10.1021/acs.nanolett.4c01409] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 05/16/2024]
Abstract
Adhesion ability and interfacial thermal transfer capacity at soft/hard interfaces are of critical importance to a wide variety of applications, ranging from electronic packaging and soft electronics to batteries. However, these two properties are difficult to obtain simultaneously due to their conflicting nature at soft/hard interfaces. Herein, we report a polyurethane/silicon interface with both high adhesion energy (13535 J m-2) and low thermal interfacial resistance (0.89 × 10-6 m2 K W-1) by regulating hydrogen interactions at the interface. This is achieved by introducing a soybean-oil-based epoxy cross-linker, which can destroy the hydrogen bonds in polyurethane networks and meanwhile can promote the formation of hydrogen bonds at the polyurethane/silicon interface. This study provides a comprehensive understanding of enhancing adhesion energy and reducing interfacial thermal resistance at soft/hard interfaces, which offers a promising perspective to tailor interfacial properties in various material systems.
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Affiliation(s)
- Xiangliang Zeng
- College of Chemistry and Chemical Engineering, Hunan University, Lushan South Road, Yuelu District, Changsha 410082, People's Republic of China
| | - Ting Liang
- State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China
- Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong SAR 999077, People's Republic of China
| | - Xiaxia Cheng
- State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China
| | - Jianfeng Fan
- State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China
| | - Yunsong Pang
- State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China
| | - Jianbin Xu
- Department of Electronic Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong SAR 999077, People's Republic of China
| | - Rong Sun
- State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China
| | - Xinnian Xia
- College of Chemistry and Chemical Engineering, Hunan University, Lushan South Road, Yuelu District, Changsha 410082, People's Republic of China
| | - Xiaoliang Zeng
- State Key Laboratory of Materials for Integrated Circuits, Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, People's Republic of China
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Wang Z, Yang F, Liu X, Han X, Li X, Huyan C, Liu D, Chen F. Hydrogen Bonds-Pinned Entanglement Blunting the Interfacial Crack of Hydrogel-Elastomer Hybrids. ADVANCED MATERIALS (DEERFIELD BEACH, FLA.) 2024; 36:e2313177. [PMID: 38272488 DOI: 10.1002/adma.202313177] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Grants] [Track Full Text] [Subscribe] [Scholar Register] [Received: 12/05/2023] [Revised: 01/16/2024] [Indexed: 01/27/2024]
Abstract
Anchoring a layer of amorphous hydrogel on an antagonistic elastomer holds potential applications in surface aqueous lubrication. However, the interfacial crack propagation usually occurs under continuous loads for amorphous hydrogel, leading to the failure of hydrogel interface. This work presents a universal strategy to passivate the interfacial cracks by designing a hydrogen bonds-pinned entanglement (Hb-En) structure of amorphous hydrogel on engineering elastomers. The unique Hb-En structure is created by pinning well-tailored entanglements via covalent-like hydrogen bonds, which can amplify the delocalization of interfacial stress concentration and elevate the necessary fracture energy barrier within hydrogel interface. Therefore, the interfacial crack propagation can be suppressed under single and cyclic loads, resulting in a high interfacial toughness over 1650 J m-2 and an excellent interfacial fatigue threshold of 423 J m-2. Such a strategy universally works on blunting the interfacial crack between hydrogel coating and various elastomer materials with arbitrary shapes. The superb fatigue-crack insensitivity at the interface allows for durable aqueous lubrication of hydrogel coating with low friction.
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Affiliation(s)
- Zibi Wang
- School of Chemical Engineering and Technology, Xi'an Jiaotong University, No. 28, Xianning West Road, Xi'an, Shaanxi, 710049, China
| | - Fahu Yang
- School of Chemical Engineering and Technology, Xi'an Jiaotong University, No. 28, Xianning West Road, Xi'an, Shaanxi, 710049, China
| | - Xiaoxu Liu
- School of Chemical Engineering and Technology, Xi'an Jiaotong University, No. 28, Xianning West Road, Xi'an, Shaanxi, 710049, China
| | - Xiang Han
- School of Chemical Engineering and Technology, Xi'an Jiaotong University, No. 28, Xianning West Road, Xi'an, Shaanxi, 710049, China
| | - Xinxin Li
- School of Chemical Engineering and Technology, Xi'an Jiaotong University, No. 28, Xianning West Road, Xi'an, Shaanxi, 710049, China
| | - Chenxi Huyan
- School of Chemical Engineering and Technology, Xi'an Jiaotong University, No. 28, Xianning West Road, Xi'an, Shaanxi, 710049, China
| | - Dong Liu
- School of Chemical Engineering and Technology, Xi'an Jiaotong University, No. 28, Xianning West Road, Xi'an, Shaanxi, 710049, China
| | - Fei Chen
- School of Chemical Engineering and Technology, Xi'an Jiaotong University, No. 28, Xianning West Road, Xi'an, Shaanxi, 710049, China
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Chen L, Xu J, Zhu M, Zeng Z, Song Y, Zhang Y, Zhang X, Deng Y, Xiong R, Huang C. Self-healing polymers through hydrogen-bond cross-linking: synthesis and electronic applications. MATERIALS HORIZONS 2023; 10:4000-4032. [PMID: 37489089 DOI: 10.1039/d3mh00236e] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 07/26/2023]
Abstract
Recently, polymers capable of repeatedly self-healing physical damage and restoring mechanical properties have attracted extensive attention. Among the various supramolecular chemistry, hydrogen-bonding (H-bonding) featuring reversibility, directionality and high per-volume concentration has become one of the most attractive directions for the development of self-healing polymers (SHPs). Herein, we review the recent advances in the design of high-performance SHPs based on different H-bonding types, for example, H-bonding motifs and excessive H-bonding. In particular, the effects of the structural design of SHPs on their mechanical performance and healing efficiency are discussed in detail. Moreover, we also summarize how to employ H-bonding-based SHPs for the preparation of self-healable electronic devices, focusing on promising topics, including energy harvesting devices, energy storage devices, and flexible sensing devices. Finally, the current challenges and possible strategies for the development of H-bonding-based SHPs and their smart electronic applications are highlighted.
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Affiliation(s)
- Long Chen
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Jianhua Xu
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Miaomiao Zhu
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Ziyuan Zeng
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Yuanyuan Song
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Yingying Zhang
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Xiaoli Zhang
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Yankang Deng
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Ranhua Xiong
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
| | - Chaobo Huang
- Joint Laboratory of Advanced Biomedical Materials (NFU-UGent), Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources, Nanjing Forestry University, Nanjing 210037, P. R. China.
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Fan J, Wu W, Zeng X, Zhang J, Zhang H, He H. Dual Reversible Network Nanoarchitectonics for Ultrafast Light-Controlled Healable and Tough Polydimethylsiloxane-Based Composite Elastomers. ACS APPLIED MATERIALS & INTERFACES 2023; 15:38996-39007. [PMID: 37530652 DOI: 10.1021/acsami.3c08041] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Key Words] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 08/03/2023]
Abstract
It is highly desirable to develop polydimethylsiloxane (PDMS) elastomers with high self-healing efficiency and excellent mechanical properties. However, most self-healable materials reported to date still take several hours to self-heal and improving the self-healing property often comes at the expense of mechanical properties. Herein, a simple design strategy of dual reversible network nanoarchitectonics is reported for constructing ultrafast light-controlled healable (40 s) and tough (≈7.2 MJ m-3) PDMS-based composite elastomers. The rupture reconstruction of dynamic bonds and the reinforcement effect of carbon nanotubes (10 wt %) endowed our composite elastomer with excellent fracture toughness that originated from a good yield strength (≈1.1 MPa) and stretchability (≈882%). Moreover, carbon nanotubes can quickly and directly heat the damaged area of the composite to achieve its ultrafast repair with the assistance of dynamic polymer/filler interfacial interaction, greatly shortening the self-healing time (12 h). The self-healing performance is superior to that of reported self-healable PDMS-based materials. This novel strategy and the as-prepared supramolecular elastomer can inspire further various practical applications, such as remote anti-icing/deicing materials.
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Affiliation(s)
- Jianfeng Fan
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
- Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, Key Laboratory of Polymer Processing Engineering, Ministry of Education, South China University of Technology, Guangzhou 510640, China
| | - Weijian Wu
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
| | - Xiangliang Zeng
- Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
| | - Jiahao Zhang
- Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, Key Laboratory of Polymer Processing Engineering, Ministry of Education, South China University of Technology, Guangzhou 510640, China
| | - Huanhuan Zhang
- Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, Key Laboratory of Polymer Processing Engineering, Ministry of Education, South China University of Technology, Guangzhou 510640, China
| | - Hezhi He
- Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing, Key Laboratory of Polymer Processing Engineering, Ministry of Education, South China University of Technology, Guangzhou 510640, China
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