Preparation of nylon MXD6/EG/CNTs ternary composites with excellent thermal conductivity and electromagnetic interference shielding effectiveness

Optimized Properties in Multifunctional Polyphenylene Sulfide Composites via Graphene Nanosheets/Boron Nitride Nanosheets Dual Segregated Structure under High Pressure

The practical application of polymer composites in the electronic and communications industries often requires multi-properties, such as high thermal conductivity (TC), efficient electromagnetic interference (EMI) shielding ability with low electrical conductivity, superior tribological performance, reliable thermal stability and excellent mechanical properties. However, the integration of these mutually exclusive properties is still a challenge, ascribed to their different requirement on the incorporated nanofillers, composite microstructure as well as processing process. Herein, a well-designed boron nitride nanosheet (BN)/graphene nanosheet (GNP)/polyphenylene sulfide (PPS) composite with a dual-segregated structure is fabricated via high-pressure molding. Rather than homogenous mixing of the hybrid fillers, GNP is first coated on PPS particles and followed by encapsulating the conductive GNP layers with insulating BN, forming a BN shell-GNP layer-PPS core composite particles. After hot-pressing, a dual segregated structure is constructed, in which GNP and BN are distinctly separated and arranged in the interfaces of PPS, which on the one hand gives rise to high thermal conductivity, and on the other hand, the aggregated BN layer can act as an "isolation belt" to effectively reduce the electronic transmission. Impressively, high-pressure is loaded and it has a more profound effect on the EMI shielding and thermal conductive properties of PPS composites with a segregated structure than that with homogenous mixed-structure composites. Intriguingly, the synergetic enhancement effect of BN and GNP on both thermal conductive performance and EMI shielding is stimulated by high pressure. Consequently, PPS composites with 30 wt% GNP and 10 wt% BN hot-pressed under 600 MPa present the most superior comprehensive properties with a high TC of 6.4 W/m/K, outstanding EMI SE as high as 70 dB, marvelous tribological performance, reliable thermal stability and satisfactory mechanical properties, which make it promising for application in miniaturized electronic devices in complex environments.

Tailoring Nylon 6/Acrylonitrile-Butadiene-Styrene Nanocomposites for Application against Electromagnetic Interference: Evaluation of the Mechanical, Thermal and Electrical Behavior, and the Electromagnetic Shielding Efficiency

Nylon 6/acrylonitrile-butadiene-styrene nanocomposites were prepared by mixing in a molten state and injection molded for application in electromagnetic interference shielding and antistatic packaging. Multi-wall carbon nanotubes (MWCNT) and maleic anhydride-grafted ABS compatibilizer were incorporated to improve the electrical conductivity and mechanical performance. The nanocomposites were characterized by oscillatory rheology, Izod impact strength, tensile strength, thermogravimetry, current-voltage measurements, shielding against electromagnetic interference, and scanning electron microscopy. The rheological behavior evidenced a severe increase in complex viscosity and storage modulus, which suggests an electrical percolation phenomenon. Adding 1 to 5 phr MWCNT into the nanocomposites produced electrical conductivities between 1.22 × 10⁻⁶ S/cm and 6.61 × 10⁻⁵ S/cm. The results make them suitable for antistatic purposes. The nanocomposite with 5 phr MWCNT showed the highest electromagnetic shielding efficiency, with a peak of –10.5 dB at 9 GHz and a value around –8.2 dB between 11 and 12 GHz. This was possibly due to the higher electrical conductivity of the 5 phr MWCNT composition. In addition, the developed nanocomposites, regardless of MWCNT content, showed tenacious behavior at room temperature. The results reveal the possibility for tailoring the properties of insulating materials for application in electrical and electromagnetic shielding. Additionally, the good mechanical and thermal properties further widen the application range.

Millefeuille-Inspired Thermal Interface Materials based on Double Self-Assembly Technique for Efficient Microelectronic Cooling and Electromagnetic Interference Shielding

Owing to the increasing power density of miniaturized and high-frequency electronic devices, flexible thermal interface materials (TIMs) with the electromagnetic interference (EMI) shielding property are in urgent demand to maintain the system performance and reliability. Recently, carbon-based TIMs receive considerable attention due to the ultrahigh intrinsic thermal conductivity (TC). However, the large-scale production of such TIMs is restricted by some technical difficulties, such as production-induced defects of graphite sheets, poor microstructure architecture within the matrix, and nonnegligible interfacial thermal resistance result from the strong phono scattering. In this work, inspired by the structure and production process of millefeuille cakes, a unique double self-assembly strategy for fabricating ultrahigh thermal conductive TIMs with superior EMI shielding performance is demonstrated. The percolating and oriented multilayered microstructure enables the TIM to exhibit an ultrahigh in-plane TC of 233.67 W m^-1 K^-1 together with an outstanding EMI shielding effectiveness of 79.0 dB (at 12.4 GHz). In the TIM evaluation system, a nearly 45 °C decrease is obtained by this TIM when compared to the commercial material. The obtained TIM achieves the desired balance between thermal conduction and EMI shielding performance, indicating broad prospects in the fields of military applications and next-generation thermal management systems.

Fabrication of Carbon Fiber Reinforced Aromatic Polyamide Composites and Their Thermal Conductivities with a h-BN Filler

In this study, a carbon fiber-reinforced thermoplastic composite was fabricated using a new aromatic polyamide (APA) as a matrix. Non-isothermal crystallization behaviors in the cooling process of APA resin (a semi-crystalline polymer) and composite were analyzed by using a differential scanning calorimeter (DSC). To determine the optimum molding conditions, processing parameters such as the molding temperature and time were varied during compression molding of the Carbon/APA composite. The tensile and flexural properties and morphologies of the fabricated composites were analyzed. Molding at 270 °C and 50 MPa for 5 min. showed relatively good mechanical properties and morphologies; thus, this condition was selected as the optimal molding condition. In addition, to enhance the thermal conductivity of the Carbon/APA composite, a study was conducted to add hexagonal boron nitride (h-BN) as a filler. The surface of h-BN was oxidized to increase its miscibility in the resin, which resulted in better dispersity in the APA matrix. In conclusion, a Carbon/APA (h-BN) composite manufactured under optimal molding conditions with an APA resin containing surface-treated h-BN showed a thermal conductivity more than twice that of the case without h-BN.