Accelerated life-test methods and results for implantable electronic devices with adhesive encapsulation

Sustainability Analysis of a ZnO-NaCl-Based Capacitor Using Accelerated Life Testing and an Intelligent Modeling Approach

From small toys to satellites, capacitors play a vital role as an energy storage element, filtering or controlling other critical tasks. This research paper focuses on estimating the remaining useful life of a nanocomposite-based fabricated capacitor using various experimental and artificial intelligence techniques. Accelerated life testing is used to explore the sustainability and remaining useful life of the fabricated capacitor. The acceleration factors affecting the health of capacitors are investigated, and experiments are designed using Taguchi’s approach. The remaining useful lifetime of the fabricated capacitor is calculated using a statistical technique, i.e., regression analysis using Minitab 18.1 software. An expert model is designed using artificial neural networks (ANN), which warns the user of any upcoming faults and failures. The average remaining useful life of the fabricated capacitor, using accelerated life testing, regression, and artificial neural network, is reported as 13,724.3 h, 14,515.9 h, and 14,247.1 h, respectively. A comparison analysis is conducted, and performance metrics are analyzed to opt for the most efficient technique for the prediction of the remaining useful life of the fabricated capacitor, which confirms 93.83% accuracy using the statistical method and 95.82% accuracy using artificial neural networks. The root mean square error (RMSE) of regression and artificial neural networks is found to be 0.102 and 0.167, respectively, which validates the consistency of the reliability methods.

Evaluation methods for long-term reliability of polymer-based implantable biomedical devices

Long-term reliability of implantable biomedical devices is a critical issue for their practical usefulness and successful translation into clinical application. Reliability is particularly of great concern for recently demonstrated devices based on new materials typically relying on polymeric thin films and microfabrication process. While reliability testing protocol has been well-established for traditional metallic packages, common evaluation methods for polymer-based microdevices has yet to be agreed upon, even though various testing methods have been proposed. This article is aiming to summarize the evaluation methods on long-term reliability of emerging biomedical implants based on polymeric thin-films in terms of their theories and implementation with specific focus on difference from the traditional metallic packages.

A 3-Mbps, 802.11g-Based EMG Recording System With Fully Implantable 5-Electrode EMG Acquisition Device

We have developed a 5-electrode recording system that combines an implantable electromyography (EMG) device package with transcutaneous inductive power transmission, near-infrared (NIR) transcutaneous data telemetry and 3 Mbps Wi-Fi data acquisition for chronic EMG recording in vivo. This system comprises a hermetically-sealed single-chip, 5-electrode Implantable EMG Acquisition Device (IEAD), a custom external powering and Implant Telemetry Module (ITM), and a custom Wi-Fi-based Raspberry Pi-based Data Acquisition (RaspDAQ) and relay device. The external unit (ITM and RaspDAQ) is powered entirely by a single battery to achieve the objective of untethered EMG recording, for the convenience of clinicians and animal researchers. The IEAD acquires intramuscular EMG signals at 17.85 ksps/electrode while being powered transcutaneously by the ITM using 22 MHz near-field inductive coupling. The acquired EMG data is transmitted transcutaneously via NIR telemetry to the ITM, which in turn, transfers the data to the RaspDAQ for relaying to a laptop computer for display and storage. We have also validated the complete system by acquiring EMG signals from rodents for up to two months. Following the explantation of the devices, we have also conducted failure and histological analysis on the devices and the surrounding tissue, respectively.

Effect of Signals on the Encapsulation Performance of Parylene Coated Platinum Tracks for Active Medical Implants

Platinum is widely used as the electrode material for implantable devices. Owing to its high biostability and corrosion resistivity, platinum could also be used as the main metallization for tracks in active implants. Towards this goal, in this work we investigate the stability of parylene-coated Pt tracks using passive and active tests. The test samples in this study are Pt-on-SiO₂ interdigitated comb structures. During testing all samples were immersed in saline for 150 days; for passive testing, the samples were left unbiased, whilst for active testing, samples were exposed to two different stress signals: a 5 V DC and a 5 Vp 500 pulses per second biphasic signal. All samples were monitored over time using impedance spectroscopy combined with optical inspection. After the first two weeks of immersion, delamination spots were observed on the Pt tracks for both passive and actively tested samples. Despite the delamination spots, the unbiased samples maintained high impedances until the end of the study. For the actively stressed samples, two different failure mechanisms were observed which were signal related. DC stressed samples showed severe parylene cracking mainly due to the electrolysis of the condensed water. Biphasically stressed samples showed gradual Pt dissolution and migration. These results contribute to a better understanding of the failure mechanisms of Pt tracks in active implants and suggest that new testing paradigms may be necessary to fully assess the long-term reliability of these devices.

Reliability Study of Electronic Components on Board-Level Packages Encapsulated by Thermoset Injection Molding

A drastically growing requirement of electronic packages with an increasing level of complexity poses newer challenges for the competitive manufacturing industry. Coupled with harsher operating conditions, these challenges affirm the need for encapsulated board-level (2nd level) packages. To reduce thermo-mechanical loads induced on the electronic components during operating cycles, a conformal type of encapsulation is gaining preference over conventional glob-tops or resin casting types. The availability of technology, the ease of automation, and the uncomplicated storage of raw material intensifies the implementation of thermoset injection molding for the encapsulation process of board-level packages. Reliability case studies of such encapsulated electronic components as a part of board-level packages become, thereupon, necessary. This paper presents the reliability study of exemplary electronic components, surface-mounted on printed circuit boards (PCBs), encapsulated by the means of thermoset injection molding, and subjected to cyclic thermal loading. The characteristic lifetime of the electronic components is statistically calculated after assessing the probability plots and presented consequently. A few points of conclusion are summarized, and the future scope is discussed at the end.

Apparatus to investigate the insulation impedance and accelerated life-testing of neural interfaces

Objective. Neural interfaces and other implantable micro-devices that use polymer-encapsulated integrated circuits will only be allowed in medical devices when their lifetimes can be estimated from experimental data. An apparatus has been developed and tested that allows hundreds of insulated samples (interdigitated combs) to be aged under accelerated conditions of high temperature and voltage stress. Occasionally, aging is paused while the sample’s impedance is measured; the impedance spectrogram may show degradation as it progresses before failure. Approach. The design was based on practical considerations which are reviewed. A Solartron Modulab provides the frequency response analyser and the femtoammeter. The apparatus can accommodate batches of samples at several temperatures and with different aging voltage waveforms. It is important to understand features of the spectra that are not due to comb–comb leakage, but come from other places (for example substrate-solution leakage); some have been observed and investigated using SPICE. Main results. The design is described in detail and test results show that it is capable of making measurements over long periods, at least up to 67 °C. Despite the size of the apparatus, background capacitance is about 1 pF and comb–comb capacitances of about 30 pF can be measured down to 10 mHz, an impedance of about 100 GΩ. An important discovery was the advantage of grounding the bathing solution, primarily in that it raises the measurement ceiling. Observation and SPICE simulation shows that leakage from the substrate to the bathing solution can give phase lags  >90°, in contrast to comb–comb leakage which reduces phase lag to  <90°. Significance. The value of this paper is that it will facilitate research into the endurance of small implanted devices because, given a description of a proven apparatus, researchers can start building their own apparatus relatively quickly and with confidence.