Liquid crystal epoxy resins based on biphenyl group cured with aromatic amines - studied by dielectric spectroscopy

Curing Reaction and Dielectric Properties of Rigid and Elastic Liquid Crystal Epoxy Networks Modified with Nanofillers

The aim of the paper is to compare the progress of the curing reaction and the dielectric properties of liquid crystalline epoxy networks of different elasticity and to investigate how modification with nanofillers influences their properties. The study focuses on a liquid crystalline epoxy monomer with four aromatic rings in the mesogen, cross-linked with 4,4′-diaminodiphenylmethane (DDM) and pimelic acid (PA) to produce rigid and elastic polymer networks. The obtained results are compared to networks modified with nanofillers (diphenyl aluminum phosphate nanorods). The curing process is monitored in situ with broadband dielectric spectroscopy, which is a good tool to view the progress of the reaction. Two stages with different reaction dynamics are observed in the studied cases. Dielectric properties of the products cured with two chosen agents show significant differences in the obtained parameters (activation energy, glass transition, and fragility index) as well as in the dynamics of the α and β relaxations. Although the curing agent is the main factor determining the properties of the product, the nanofiller additive also modifies the values of specific parameters that characterize both the process of the reaction and the properties of the final composites. Particularly, adding the nanofiller raises the glass transition temperature in both the cases. The obtained results are in good agreement with the earlier calorimetric study.

Relationship between crosslinking structure and low dielectric constant of hydrophobic epoxies based on substituted biphenyl mesogenic units

In this work, a series of low dielectric constant hydrophobic epoxies based on substituted biphenyl mesogenic were prepared and characterized.

High thermo-responsive shape memory epoxies based on substituted biphenyl mesogenic with good water resistance

In this work, a novel epoxy monomer denoted as 3,5′-di-t-butyl-5,3′-dimethyl biphenyl diglycidyl ether was synthesized and applied intoin situcomposites with 3,3′,5,5′-tetramethyl-4,4′-biphenyl diglycidyl ether, accompanied with curing agent aromatic amines.