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Zhang C, Xu Z, Huang Y, Li Y, Li Y, Yang B, Hu R, Zou J, Zheng C, Qian Q. Study on Thermomechanical Properties and Morphology of an Epoxy Resin Thermally Conductive Adhesive under Different Curing Conditions. ACS OMEGA 2024; 9:11637-11645. [PMID: 38497002 PMCID: PMC10938327 DOI: 10.1021/acsomega.3c08950] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Grants] [Track Full Text] [Download PDF] [Figures] [Subscribe] [Scholar Register] [Received: 11/09/2023] [Revised: 02/06/2024] [Accepted: 02/12/2024] [Indexed: 03/19/2024]
Abstract
An epoxy resin thermally conductive adhesive is a type of thermosetting polymer encapsulation material that exhibits comprehensive performance, and the thermomechanical properties of this adhesive vary significantly under different curing conditions. In this paper, spherical alumina was used as a filler for thermal conductivity to prepare an epoxy resin thermal conductivity adhesive using a multistage freezing mixing method. The effects of various curing conditions on the thermal-mechanical properties and fracture morphology of the epoxy resin thermal conductivity adhesive were studied. The results showed that the curing condition of 150 °C/2.5 h significantly improved the performance of the epoxy resin thermally conductive adhesive. Through the shear test of the composite material, the influence of the curing agent on the adhesion of the thermally conductive adhesive under fixed conditions was explored. It was found that the curing agent with a superbranched structure exhibited latent properties and greatly enhanced the toughness of the cured epoxy resin product. Altering the curing conditions increases the shear strength by up to 307%. With the increase in curing temperature and the extension of curing temperature, the glass transition temperature gradually increased from 103.9 to 159.8 °C. The initial decomposition temperature TIDT gradually increased from 295.4 to 310.1 °C, and the temperature at which the fastest decomposition rate occurs (Tmax) gradually increased from 312.48 to 330.33 °C. The thermal stability of the substance increased with both temperature and time. The curing time and curing temperature were increased, and the morphology of the fracture of the epoxy resin thermally conductive adhesive cured sample gradually showed a ductile fracture from a typical brittle fracture. The research results reveal the influence of curing conditions on the thermal conductivity and thermal stability of the epoxy resin thermally conductive adhesive, which has a specific reference value for improving the performance of the epoxy resin thermally conductive adhesive, optimizing its usage conditions, and improving production efficiency.
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Affiliation(s)
- Cheng Zhang
- School
of Science, Shanghai Institute of Technology, Shanghai 201418, China
| | - Zhe Xu
- School
of Science, Shanghai Institute of Technology, Shanghai 201418, China
| | - Yingxuan Huang
- School
of Science, Shanghai Institute of Technology, Shanghai 201418, China
| | - Yuefeng Li
- School
of Science, Shanghai Institute of Technology, Shanghai 201418, China
| | - Yang Li
- School
of Materials Science and Engineering, Shanghai
Institute of Technology, Shanghai 201418, China
| | - Bobo Yang
- School
of Science, Shanghai Institute of Technology, Shanghai 201418, China
| | - Rongrong Hu
- School
of Science, Shanghai Institute of Technology, Shanghai 201418, China
| | - Jun Zou
- School
of Science, Shanghai Institute of Technology, Shanghai 201418, China
| | - Changran Zheng
- Academy
for Engineering and Technology, Fudan University, Shanghai 200433, China
| | - Qi Qian
- Zhejiang
Silanex Technology (Taizhou) Co., Ltd., No 318, Yongyuan Road, Lunan Street, Luqiao District, Taizhou, Zhejiang 318050, China
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Petrova TV, Tretyakov IV, Solodilov VI. Technological Parameters of Epoxypolysulphone Binders Modified with Furfuryl Glycidyl Ether. RUSSIAN JOURNAL OF PHYSICAL CHEMISTRY B 2023. [DOI: 10.1134/s1990793123010086] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/07/2023]
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Yang J, Li F, Guan C, Xu X, Zhong L, Gao Y, Yan N, Jin J, Zhao G, Jiang W. Brittle-ductile transition of elastomer toughened HDPE: effect of elastomer modulus. JOURNAL OF POLYMER RESEARCH 2022. [DOI: 10.1007/s10965-022-03027-0] [Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/18/2022]
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Wang Q, Pu Z, Zheng X, Tian Y, Li X, Zhong J. Preparation and physical properties of intrinsic low-k polyarylene ether nitrile with enhanced thermo-stability. JOURNAL OF POLYMER RESEARCH 2020. [DOI: 10.1007/s10965-020-02311-1] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.5] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 11/24/2022]
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Irzhak VI, Dzhardimalieva GI, Uflyand IE. Structure and properties of epoxy polymer nanocomposites reinforced with carbon nanotubes. JOURNAL OF POLYMER RESEARCH 2019. [DOI: 10.1007/s10965-019-1896-0] [Citation(s) in RCA: 8] [Impact Index Per Article: 1.6] [Reference Citation Analysis] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 10/26/2022]
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