Lee YJ, Wang YX, Jeong YC, Atkins MD, Kang K, Kim T. An Ultralight Capillary-Driven Heat Pipe.
LANGMUIR : THE ACS JOURNAL OF SURFACES AND COLLOIDS 2024;
40:8194-8204. [PMID:
38584470 DOI:
10.1021/acs.langmuir.4c00307]
[Citation(s) in RCA: 0] [Impact Index Per Article: 0] [Reference Citation Analysis] [Abstract] [Track Full Text] [Subscribe] [Scholar Register] [Indexed: 04/09/2024]
Abstract
Capillary-driven heat pipes are an effective thermal solution for compacting electronic cooling systems. We advance such a heat pipe thermal solution with ultralightweighting for mobile applications. In our advancement, the envelope that encapsulates the phase-change process of a working fluid is fabricated via electroless plating being ∼40 μm thick. Furthermore, the wick structure that transports condensate to a heat source via capillarity is also electroless-plated onto the envelope's inner surfaces, creating a 100-μm-thick, microporous layer. This wick structure is sequentially superhydrophilized by blackening that forms a nanotexture on the microporous wick layer. An effective density of our prototype ultralight heat pipes (uHPs), as a measure of lightweighting, indicates, on average, a remarkable 73% weight reduction of commercial counterparts with sintered copper powder wick in similar exterior dimensions (e.g., ∼2.7 g, compared to ∼10.0 g) while providing equivalent heat spreading. Furthermore, the uHP operates at a 25% lower evaporator temperature, due to additional heat rejection to the surroundings through the ultrathin-walled envelope and wick.
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