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For: Lee H, Chae H, Kim C. Electroless deposition of NiMoP films using alkali-free chemicals for capping layers of copper interconnections. KOREAN J CHEM ENG 2012;29:1259-65. [DOI: 10.1007/s11814-011-0301-4] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/28/2022]

For:	Lee H, Chae H, Kim C. Electroless deposition of NiMoP films using alkali-free chemicals for capping layers of copper interconnections. KOREAN J CHEM ENG 2012;29:1259-65. [DOI: 10.1007/s11814-011-0301-4] [Citation(s) in RCA: 2] [Impact Index Per Article: 0.2] [Reference Citation Analysis] [What about the content of this article? (0)] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 10/28/2022]

Number	Cited by Other Article(s)
1	Kim MJ, Choe S, Kim HC, Lee SJ, Kim SH, Kwon OJ, Kim JJ. Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer. Electrochim Acta 2014. [DOI: 10.1016/j.electacta.2014.09.142] [Citation(s) in RCA: 1] [Impact Index Per Article: 0.1] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/27/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse
2	Kim MJ, Kim JJ. Electrodeposition for the Fabrication of Copper Interconnection in Semiconductor Devices. KOREAN CHEMICAL ENGINEERING RESEARCH 2014. [DOI: 10.9713/kcer.2014.52.1.26] [Citation(s) in RCA: 14] [Impact Index Per Article: 1.4] [Reference Citation Analysis] [Track Full Text] [Journal Information] [Subscribe] [Scholar Register] [Indexed: 11/23/2022] Abstract Collapse Key Words Collapse MESH Headings Collapse Grants Collapse Affiliation(s) Collapse